Patents by Inventor Hao Lai

Hao Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Patent number: 11971038
    Abstract: A single-stage enthalpy enhancing rotary compressor and an air conditioner having same. The single-stage enthalpy enhancing rotary compressor includes: at least one single-stage cylinder, a rotator, an upper flange, and a lower flange. The rotator is arranged inside the cylinder and is rotatable, a compression chamber is formed between the rotator and an inner peripheral wall of the cylinder, a vapor injection opening is defined in at least one of the upper flange the lower flange, and the vapor injection opening is configured to supply gas outside the compressor to the compression chamber directly. According to the present disclosure, two-stage compression is realized without adding an extra cylinder, thereby effectively enhancing a circulation of refrigerant, improving cooling performance of the air conditioner under high environmental temperatures.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: April 30, 2024
    Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Guanghui Xia, Xiaocheng Lai, Shuo Xiong, Junchu Liang, Boming Zhu, Lihui Zhang, Wei Zhu, Xuechao Ding, Fuqiang Zhang, Hao Mei
  • Publication number: 20240131664
    Abstract: A torque wrench includes a shank and a driving rod. The shank is provided with only one tripping seat therein. One end of the tripping seat is provided with a positioning recess and a restoring surface surrounding the positioning recess. The driving rod is pivotally inserted into the shank and movable between a ready position and a tripping position. One end of the driving rod is provided with an abutting portion having a spherical surface. The abutting portion abuts against the positioning recess when the driving rod is in the ready position. The abutting portion is separated from the positioning recess and abuts against the restoring surface when the driving rod is in the tripping position.
    Type: Application
    Filed: October 23, 2022
    Publication date: April 25, 2024
    Inventor: Shih-Hao Lai
  • Patent number: 11961951
    Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jian-Chin Liang, Shih-Lun Lai, Jo-Hsiang Chen
  • Patent number: 11954259
    Abstract: Glasses with gesture recognition function include a glasses frame and a gesture recognition system. The gesture recognition system is disposed on the glasses frame and configured to detect hand gestures in front of the glasses thereby generating a control command. The gesture recognition system transmits the control command to an electronic device to correspondingly control the electronic device.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: April 9, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Horng-Goung Lai, En-Feng Hsu, Meng-Huan Hsieh, Yu-Hao Huang, Nien-Tse Chen
  • Publication number: 20240114458
    Abstract: The present invention provides a wireless communication method, wherein the wireless communication method includes the steps of: controlling the electronic device to operate in an active mode and communicating with an access point; after a traffic between the electronic device and the access point ends, controlling the electronic device to operate in a first mode, and transmitting a null frame to notify the access point that the electronic device enters a power saving mode; and during the first mode, controlling the electronic device to leave the power saving mode and transmitting at least one query signal to the access point to ask data.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 4, 2024
    Applicant: MEDIATEK INC.
    Inventors: Cheng-Kung Lai, Chia-Ning Chang, Po-Hao Hsiao
  • Patent number: 11949056
    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: April 2, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jo-Hsiang Chen, Shih-Lun Lai, Min-Che Tsai, Jian-Chin Liang
  • Patent number: 11944960
    Abstract: The present disclosure provides a method for fabricating a nickel-cerium dioxide-aluminum oxide hybrid nanoparticle cluster catalyst. The method includes a solution preparation step, an aerosolizing step, a drying step, a first calcining step, a reducing gas adding step, and a second calcining step. The solution preparation step is provided for preparing a precursor solution. The aerosolizing step is performed for obtaining an atomized droplet. The drying step is performed for converting to a precursor crystallite. The first calcining step is performed for obtaining an oxidation state catalyst. The reducing gas adding step is performed for adding hydrogen. The second calcining step is performed for obtaining the nickel-cerium dioxide-aluminum oxide hybrid nanoparticle cluster catalyst.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: April 2, 2024
    Assignees: NATIONAL TSING HUA UNIVERSITY, Chang Chun Plastics Co., Ltd., Chang Chun Petrochemical Co., LTD., DAIREN CHEMICAL CORP.
    Inventors: De-Hao Tsai, Hung-Yen Chang, Guan-Hung Lai
  • Patent number: 11949920
    Abstract: A video decoding method includes: before residual decoding of a coding unit is completed, referring to available information to determine whether to decode information that an inverse transform (IT) circuit needs for applying inverse transform to transform blocks of the coding unit, and generating a determination result; and controlling coefficient transmission of the coding unit to the IT circuit according to the determination result.
    Type: Grant
    Filed: July 24, 2022
    Date of Patent: April 2, 2024
    Assignee: MEDIATEK INC.
    Inventors: Ming-Hsien Lai, Min-Hao Chiu, Chia-Yun Cheng
  • Patent number: 11944636
    Abstract: This invention discloses a medicinal composition includes a non-coding RNA molecule and an antibody targeting a tumor antigen for preventing and/or treating cancer. This invention uses the synergistic combination of a non-coding RNA molecule or its functional variant or homologue, and an antibody targeting a tumor antigen to prevent and/or treat cancer, thereby providing a novel and effective method in preventing and/or treating various cancers.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: April 2, 2024
    Assignee: Macau University of Science and Technology
    Inventors: Zhi-Hong Jiang, Lee-Fong Yau, Tian-Tian Tong, Hao Huang, Kua Hu, Elaine Lai-Han Leung
  • Patent number: 11948497
    Abstract: A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/?1.5˜2 nm).
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 2, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Chien-Nan Yeh, Jo-Hsiang Chen, Shih-Lun Lai
  • Patent number: 11944486
    Abstract: An analysis method and an electronic apparatus for breast image are provided. The method includes the following steps. One or more breast ultrasound images are obtained. The breast ultrasound images are used for forming a three-dimensional (3D) breast model. A volume of interest (VOI) in the breast ultrasound image is obtained by applying a detection model on the 3D breast model. The VOI is compared with a tissue segmentation result. The VOI is determined as a false positive according to a compared result between the VOI and the tissue segmentation result. The compared result includes that the VOI is located at a glandular tissue based on the tissue segmentation result. In response to the VOI being located in the glandular tissue of the tissue segmentation result, the VOI is compared with the lactiferous duct in the 3D breast model.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIHAO MEDICAL INC.
    Inventors: Jen-Feng Hsu, Hong-Hao Chen, Rong-Tai Chen, Hsin-Hung Lai, Wei-Han Teng
  • Publication number: 20240106104
    Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
  • Patent number: 11942451
    Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai, Kuo-Lung Pan, Hsiu-Jen Lin
  • Patent number: 11940659
    Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Chia-Ping Lai
  • Patent number: 11935757
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Hao Chen, Wei-Han Lai, Ching-Yu Chang, Chin-Hsiang Lin
  • Publication number: 20240090238
    Abstract: A memory device and a method for manufacturing the memory device are provided. The memory device includes a stack and a plurality of memory strings. The stack is disposed on the substrate, and the stack includes a plurality of conductive layers and a plurality of insulating layers alternately stacked. The memory strings pass through the stack along a first direction, wherein a first memory string in the memory strings includes a first conductive pillar and a second conductive pillar, a channel layer, and a memory structure. The first conductive pillar and the second conductive pillar respectively extend along the first direction and are separated from each other. The channel layer is disposed between the first conductive pillar and the second conductive pillar. The memory structure surrounds the second conductive pillar, and the memory structure includes a resistive memory material.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Feng-Min LEE, Erh-Kun LAI, Dai-Ying LEE, Yu-Hsuan LIN, Po-Hao TSENG, Ming-Hsiu LEE
  • Patent number: 11929434
    Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: March 12, 2024
    Assignee: eMemory Technology Inc.
    Inventors: Chih-Hsin Chen, Shih-Chen Wang, Tsung-Mu Lai, Wen-Hao Ching, Chun-Yuan Lo, Wei-Chen Chang
  • Patent number: 11923886
    Abstract: An antenna device and a method for configuring the same are provided. The antenna device includes a grounding metal, a grounding part, a radiating part, a feeding part, a proximity sensor, and a sensing metal. The radiating part is electrically connected to the grounding metal through the grounding part. The feeding part is coupled to the grounding metal through a feeding point. The sensing metal is electrically connected to the proximity sensor. The sensing metal is separated from the radiating part at a distance. The distance is less than or equal to one thousandth of a wavelength corresponding to an operating frequency of the antenna device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 5, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Yan-Ming Lin, Jui-Hung Lai