Abstract: New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediately below the photoresist layer. The adhesion layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate, such as an alpha-carbon, spin-on carbon, spin-on silicon hardmask, metal hardmask, or deposited silicon layer. The preferred adhesion layers are formed from spin-coatable, polymeric compositions. The inventive method improves adhesion and reduces or eliminates pattern collapse issues.

Abstract: New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediately below the photoresist layer. The adhesion layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate, such as an alpha-carbon, spin-on carbon, spin-on silicon hardmask, metal hardmask, or deposited silicon layer. The preferred adhesion layers are formed from spin-coatable, polymeric compositions. The inventive method improves adhesion and reduces or eliminates pattern collapse issues.

Abstract: New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediately below the photoresist layer. The adhesion layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate, such as an alpha-carbon, spin-on carbon, spin-on silicon hardmask, metal hardmask, or deposited silicon layer. The preferred adhesion layers are formed from spin-coatable, polymeric compositions. The inventive method improves adhesion and reduces or eliminates pattern collapse issues.

Abstract: A folding assembly is movable between a collapsed configuration and an extended configuration includes a first rotating link having a first end pivotably coupled to a structural member/frame and a second end. The folding assembly also includes a second rotating link having a first end pivotably coupled to the structural member/frame and a second end. A first connecting link is pivotably coupled between the first rotating link and the second rotating link. A first end of a second connecting link is pivotably coupled to the first rotating link second end. The folding assembly further includes a support link having a first end pivotably coupled to the first rotating link second end and a second end configured to couple to a component to be moved. The support link is configured to selectively move the component between, inclusively, a retracted position and a deployed position.

Abstract: A nose landing gear assembly includes an oleo strut, a forward brace including a forward brace first end and a forward brace second end. The forward brace first end is pivotably coupled to the nose gear bay of a high wing aircraft about a first pivot axis. The assembly also includes an aft brace including an aft brace first end and an aft brace second end. The aft brace first end is pivotably coupled to the nose gear bay about a second pivot axis, and the aft brace second end is pivotably coupled to the oleo strut. An actuator includes an actuator first end and an actuator second end. The actuator second end is coupled to the nose gear bay and the actuator first end coupled to the forward brace. The actuator is configured to move the nose landing gear assembly between a retracted position and an extended position.

Abstract: A folding assembly is movable between a collapsed configuration and an extended configuration includes a first rotating link having a first end pivotably coupled to a structural member/frame and a second end. The folding assembly also includes a second rotating link having a first end pivotably coupled to the structural member/frame and a second end. A first connecting link is pivotably coupled between the first rotating link and the second rotating link. A first end of a second connecting link is pivotably coupled to the first rotating link second end. The folding assembly further includes a support link having a first end pivotably coupled to the first rotating link second end and a second end configured to couple to a component to be moved. The support link is configured to selectively move the component between, inclusively, a retracted position and a deployed position.

Abstract: A nose landing gear assembly includes an oleo strut, a forward brace including a forward brace first end and a forward brace second end. The forward brace first end is pivotably coupled to the nose gear bay of a high wing aircraft about a first pivot axis. The assembly also includes an aft brace including an aft brace first end and an aft brace second end. The aft brace first end is pivotably coupled to the nose gear bay about a second pivot axis, and the aft brace second end is pivotably coupled to the oleo strut. An actuator includes an actuator first end and an actuator second end. The actuator second end is coupled to the nose gear bay and the actuator first end coupled to the forward brace. The actuator is configured to move the nose landing gear assembly between a retracted position and an extended position.

Abstract: Present disclosure provides a method for pathogen detection, including operations that applying a biological sample to a culturing chamber comprising an interacting agent; driving a sensor electrically coupled to the biological sample in the culturing chamber; measuring an electrical signal from the sensor; and obtaining pathogen-related information of the biological sample based on the electrical signal.

Abstract: New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediately below the photoresist layer. The adhesion layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate, such as an alpha-carbon, spin-on carbon, spin-on silicon hardmask, metal hardmask, or deposited silicon layer. The preferred adhesion layers are formed from spin-coatable, polymeric compositions. The inventive method improves adhesion and reduces or eliminates pattern collapse issues.

Abstract: A shaft structure having a high service life is disclosed. An outer surface of the shaft is provided with a concave annular area and a plurality of first oil grooves. The first oil grooves extend helically along the outer surface; the fix end has a plurality of toothed portions disposed at interval and along the fixed end radially. A bearing is sleeved on the shaft and has an oil-keeping structure located on the outer surface. Thereby, lubricant can be remained on the surface of the shaft for reducing wear between the shaft and the bearing.

Abstract: The invention relates to a piezoelectric fan driving device comprising: a piezoelectric fan and a driving unit, wherein the piezoelectric fan comprises a connecting piece, two piezoelectric elements and at least one one-way air flowing piece. The connecting piece has an opening and two end surfaces. The two piezoelectric elements are fixed on the two end surfaces, and the connecting piece and two piezoelectric elements surround to form a cavity, one of the two piezoelectric elements having a through hole connecting to the cavity. The one-way air flowing piece connects the through hole. The driving unit electrically connects with the two piezoelectric elements to convert a DC power to an AC power, and the two piezoelectric elements are driven by the AC power.

Abstract: A replaceable blade includes a blade provided in a long-strip shape. One side of the blade has a plurality of score lines, and each of the score lines is extended from two side edges and crossed the blade. Each score line includes a plurality of groove segments arranged collinearly, and the groove segments of each of the line scores are spaced apart from each other in a longitudinal direction of the score line. The replaceable blade has score lines in dashed line shapes to prevent an unexpected broken from happening.

Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having an off-normal device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The device and waveguide are non-collinear, and the waveguide is end-coupled at its proximal end to the optical device by refraction at the device end face. The apparatus further includes a reflective coating between the waveguide and substrate, an etched end face curved in the horizontal dimension, or an etched end face with a lower portion that protrudes beneath a proximal portion of the waveguide.

Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having an off-normal device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The device and waveguide are non-collinear, and the waveguide is end-coupled at its proximal end to the optical device by refraction at the device end face. The apparatus further includes a reflective coating between the waveguide and substrate, an etched end face curved in the horizontal dimension, or an etched end face with a lower portion that protrudes beneath a proximal portion of the waveguide.

Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having a device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The waveguide is end-coupled at its proximal end to the optical device through the device end face and is arranged so as to comprise a waveguide mode converter. The waveguide is arranged at its distal end to transmit or receive an optical signal through its distal end to or from another low-index optical waveguide end-coupled with the integrally-formed waveguide and assembled with the integrally-formed waveguide, optical device, or substrate. The optical apparatus can further comprise a discrete low-index optical waveguide assembled with the integrally-formed waveguide, optical device, or substrate so as to be end-coupled with the integrally-formed waveguide at its distal end.

Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having a device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The waveguide is end-coupled at its proximal end to the optical device through the device end face and is arranged so as to comprise a waveguide mode converter. The waveguide is arranged at its distal end to transmit or receive an optical signal through its distal end to or from another low-index optical waveguide end-coupled with the integrally-formed waveguide and assembled with the integrally-formed waveguide, optical device, or substrate. The optical apparatus can further comprise a discrete low-index optical waveguide assembled with the integrally-formed waveguide, optical device, or substrate so as to be end-coupled with the integrally-formed waveguide at its distal end.

Abstract: Disclosed are apparatus, methods, systems, and computer program products for providing pricing options for a sales event of online shopping over a data network. In one embodiment, an item selection signal is received over the data network from a data processing device associated with a customer. The item selection signal indicates an item selected for purchase. Responsive to receiving the item selection signal, a plurality of pricing options is retrieved for the selected item. A graphical representation of the plurality of pricing options is generated for display on the data processing device associated with the customer. A pricing option selection signal is received over the data network from the data processing device associated with the customer. The pricing option selection signal indicates a selected one of the plurality of pricing options. A pricing outcome is retrieved from an outcome determination module.

Abstract: An optical apparatus comprises a semiconductor optical device waveguide formed on a semiconductor substrate, and an integrated end-coupled waveguide formed on the semiconductor substrate. The integrated waveguide may comprise materials differing from those of the device waveguide and the substrate. Spatially selective material processing may be employed for first forming the optical device waveguide on the substrate, and for subsequently depositing and forming the integrated end-coupled waveguide on the substrate. Spatially selective material processing enables accurate spatial mode matching and transverse alignment of the waveguides, and multiple device waveguides and corresponding integrated end-coupled waveguides may be fabricated concurrently on a common substrate on a wafer scale.

Abstract: A photodetector comprises a semiconductor substrate with entrance and reflecting faces formed at the substrate upper surface. The reflecting face forms an acute angle with the substrate surface and is positioned so that an optical beam transmitted through the entrance face into the substrate is internally reflected from the reflecting face toward the substrate upper surface. A photodetector active region is formed on the substrate upper surface and is positioned so that the reflected optical beam impinges on the active region. The photodetector may be mounted on a second substrate for receiving an optical beam from a planar waveguide formed on the second substrate or an optical fiber mounted in a groove on the second substrate.

Abstract: A photodetector comprises a semiconductor substrate with entrance and reflecting faces formed at the substrate upper surface. The reflecting face forms an acute angle with the substrate surface and is positioned so that an optical beam transmitted through the entrance face into the substrate is internally reflected from the reflecting face toward the substrate upper surface. A photodetector active region is formed on the substrate upper surface and is positioned so that the reflected optical beam impinges on the active region. The photodetector may be mounted on a second substrate for receiving an optical beam from a planar waveguide formed on the second substrate or an optical fiber mounted in a groove on the second substrate.