Patents by Inventor Hao Liu

Hao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12389455
    Abstract: Wireless communications systems and methods related to communicating control information are provided. A method of wireless communication performed by a user equipment (UE) may include performing a clear channel assessment (CCA), transmitting, to a first UE based on the CCA being successful, a first transport block (TB) via a first sub-PSSCH associated with a first sub-slot, and transmitting, to at least one of the first UE or a second UE, a second TB via a PSSCH associated with a slot.
    Type: Grant
    Filed: December 19, 2023
    Date of Patent: August 12, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Chih-Hao Liu, Yisheng Xue, Jing Sun, Xiaoxia Zhang, Lik Hang Silas Fong, Piyush Gupta, Tao Luo, Juan Montojo, Peter Gaal
  • Publication number: 20250252068
    Abstract: A data receiving and transmitting method includes following steps: receiving and transmitting a plurality of general priority data by a first request block; receiving and transmitting a plurality of high priority data by a second request block; and if the first request block is unable to receive and transmit a portion data of the plurality of general priority data, receiving and transmitting the portion data of the plurality of general priority data by the second request block.
    Type: Application
    Filed: February 3, 2025
    Publication date: August 7, 2025
    Inventors: Zhen-Ting HUANG, Wen-Hao LIU, Heng-Da NIE, Chun-Hao LIN
  • Publication number: 20250252088
    Abstract: A multi-source heterogenous data management system and method are provided. The system includes a data source management module and a data acquisition module that are connected to each other. The data source management module is configured to classify multi-source heterogeneous data to obtain classified data sources, where the classified data sources include a structured data source, a semi-structured data souce, an unstructured data source, and a binary data source; and perform information configuration of a predetermined configuration rule on the classified data sources to obtain data source information, where the predetermined configuration rule includes a URL, a username, a password, and a driver. The data acquisition module is configured to query, retrieve, and read the data source information by using a predetermined data processing method, such as a batch data mode or a streaming data mode, to obtain read data.
    Type: Application
    Filed: January 23, 2025
    Publication date: August 7, 2025
    Inventors: Tao ZHANG, Hao Liu, Zhefeng Liu, Qi Wang, Zhiling Chen, Wei Chen, Yinlong Liu, Chenxi Yu, Peng Wang
  • Publication number: 20250251907
    Abstract: A numerical data processing method includes transforming a plurality of original numerical values of data into a plurality of number sequences; and determining a maximal value, a minimal value and at least a survival value of the plurality of number sequences according to a sorting result of the plurality of number sequences; wherein the plurality of number sequences are one-hot encoding.
    Type: Application
    Filed: August 6, 2024
    Publication date: August 7, 2025
    Applicant: Realtek Semiconductor Corp.
    Inventor: Chih-Hao Liu
  • Publication number: 20250254939
    Abstract: A method of forming a semiconductor device including performing an ion implantation on a substrate and etching the substrate and semiconductor devices formed by the same are disclosed. In an embodiment, a method includes forming a transistor on a first side of a substrate; performing an ion implantation on a second side of the substrate opposite the first side; after performing the ion implantation, etching the substrate to remove the substrate and form a first recess; and forming a dielectric layer in the first recess.
    Type: Application
    Filed: April 25, 2025
    Publication date: August 7, 2025
    Inventors: Chun-Hung Wu, Chia-Ling Chung, Su-Hao Liu, Liang-Yin Chen, Shun-Wu Lin, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20250244464
    Abstract: A radar system includes multiple radio frequency (RF) circuits and a processing circuit. The RF circuits obtain multiple RF signals with respect to an object. The processing circuit is configured to measure a range and an angle of the object related to the radar system according to the RF signals, and calculates coordinates according to the range and the angle in each of multiple cycles. The processing circuit also obtains multiple combinations among the cycles, in which each combination corresponds to two cycles. For each combination, the processing circuit calculates velocities according to the corresponding coordinates and a cycle difference. The processing circuit also calculates at least one statistic value of the velocities of the combinations, and calculates a corrected velocity according to the statistic value.
    Type: Application
    Filed: January 30, 2024
    Publication date: July 31, 2025
    Inventors: Chi-Yung LIAO, Modick Bahadur BASNET, Chi-Cheng KUO, Shu-Hao LIU
  • Publication number: 20250248235
    Abstract: A display substrate and a preparation method therefor, and a display apparatus. The display substrate includes a base substrate (101), a drive circuit layer (102) and a light emitting structure layer (105). The drive circuit layer (102) includes at least one pixel drive circuit, the at least one pixel drive circuit includes at least one transistor, the transistor at least includes an active layer (206), and the drive circuit layer (102) further includes at least one insulating layer located on a side of the active layer (206) away from the base substrate (101). The light emitting structure layer (105) includes at least one light emitting device.
    Type: Application
    Filed: August 30, 2023
    Publication date: July 31, 2025
    Inventors: Yu AI, Xuewu XIE, Xinyu LI, Shi SUN, Yubao KONG, Hao LIU, Bowen LIU, Weidong YIN
  • Publication number: 20250247826
    Abstract: Certain aspects of the present disclosure provide a method for wireless communications by a transmitter user equipment (UE). The method may include selecting a first number of resources for an initial transmission based on a second number of transport blocks (TBs) for the initial transmission where the first number is greater than the second number, and transmitting the initial transmission on one or more of the first number of resources.
    Type: Application
    Filed: May 9, 2022
    Publication date: July 31, 2025
    Inventors: Chih-Hao LIU, Yisheng XUE, Jing SUN, Sherif ELAZZOUNI, Siyi CHEN, Giovanni CHISCI, Ozcan OZTURK, Xiaoxia ZHANG
  • Publication number: 20250242521
    Abstract: The present disclosure provides a mold for concrete house construction, including inner mold plates and outer mold plates driven by an inner mold closing mechanism and an outer mold closing mechanism respectively for mold closing and demolding. The inner mold plates and the outer mold plates are fastened by a mold-closing locking mechanism, and adjacent outer mold plates are locked by an alignment locking mechanism, adjustment assemblies being arranged at a bottom of a cement house mold. The construction quality is improved, and the time for mold closing and demolding is greatly reduced; at the same time, the accuracy of mold closing and demolding of the outer and inner mold plates is improved, and the situation of deflection of the outer mold plate during the mold closing and demolding is avoided, thereby improving the construction efficiency.
    Type: Application
    Filed: March 21, 2024
    Publication date: July 31, 2025
    Inventor: Hao Liu
  • Publication number: 20250246521
    Abstract: A semiconductor device is provided. The semiconductor device includes a leadframe having a plurality of leads. A first lead of the plurality of leads has a lead pad formed between a distal portion and a proximal portion of the first lead. A semiconductor die includes a plurality of bond pads located at an active side. Each bond pad of the plurality is connected to a respective lead of the plurality of leads. An encapsulant encapsulates the semiconductor die and at least a portion of the leadframe. A distal portion of each lead is exposed through the encapsulant at a first major side. The lead pad is exposed through the encapsulant at a second major side opposite of the first major side.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 31, 2025
    Inventor: Chang Hao Liu
  • Patent number: 12371561
    Abstract: A thermoplastic vulcanizate material comprises: a continuous phase comprising polyester, wherein a melting point of the polyester is less than or equal to 180° C., a dispersant phase comprising cross-linked rubber, wherein an average particle diameter of the cross-linked rubber is less than or equal to 100 ?m.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: July 29, 2025
    Assignee: LCY CHEMICAL CORP.
    Inventors: Wan-Ting Tsai, Chun-Jui Hsu, Ren-Hao Liu, Yu-Cheng Hsiao, Han-Liou Yi
  • Patent number: 12375148
    Abstract: Methods and apparatuses for multi-channel communications are disclosed. A method provides precoding, based on sounding reference signal received from a communication device, reference signal ports in spatial and frequency domain by determining pairs of spatial and frequency domain components where the frequency domain components are arranged in clusters comprising one or more frequency domain components, and pairing of at least one of the spatial domain components with at least two clusters of frequency domain components is enabled; sending information of the precoding to the other communication device; and combining the precoding with a report of precoding received in response from the other communication device. Another method provides sending of the sounding reference signal; receiving, the information of the precoding; performing port selection operation based on the clustered information of frequency domain components; and preparing and sending the report based on the selection operation.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: July 29, 2025
    Assignee: Nokia Technologies Oy
    Inventors: Filippo Tosato, Rana Ahmed Salem, Salah Hajri, Hao Liu
  • Publication number: 20250240812
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit an indication of a resource reservation associated with an unlicensed spectrum, the indication specifying at least a listen-before-talk (LBT) parameter associated with category 4 (CAT 4) access to the unlicensed spectrum and an interlace index associated with a resource in the unlicensed spectrum assigned to a participating UE associated with coordinated access to the unlicensed spectrum. The UE may communicate in a wireless network based at least in part on the resource reservation associated with the unlicensed spectrum, the LBT parameter, and the interlace index. Numerous other aspects are described.
    Type: Application
    Filed: June 9, 2022
    Publication date: July 24, 2025
    Inventors: Chih-Hao LIU, Jing SUN, Yisheng XUE, Peter GAAL, Giovanni CHISCI, Luanxia YANG, Xiaoxia ZHANG, Aleksandar DAMNJANOVIC
  • Publication number: 20250240991
    Abstract: Disclosed is a method of fabricating a contact in a semiconductor device. The method includes: receiving a semiconductor structure having an opening into which the contact is to be formed; forming a metal layer in the opening; forming a bottom anti-reflective coating (BARC) layer in the opening; performing implanting operations with a dopant on the BARC layer and the metal layer, the performing implanting operations including controlling an implant energy level and controlling an implant dosage level to form a crust layer with a desired minimum depth on top of the BARC layer; removing unwanted metal layer sections using wet etching operations, wherein the crust layer and BARC layer protect remaining metal layer sections under the BARC layer from metal loss during the wet etching operations; removing the crust layer and the BARC layer; and forming the contact in the opening over the remaining metal layer sections.
    Type: Application
    Filed: April 14, 2025
    Publication date: July 24, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Ju Chen, Su-Hao Liu, Huicheng Chang, Yee-Chia Yeo
  • Patent number: 12369188
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may determine, within a channel occupancy time shared with a second UE, one or more contention slot starting times based at least in part on a listen before talk duration and an automatic gain control duration. The first UE may transmit a sidelink communication to the second UE at a starting time selected from one or more of the one or more contention slot starting times. Numerous other aspects are provided.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: July 22, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Changlong Xu, Jing Sun, Xiaoxia Zhang, Yisheng Xue, Chih-Hao Liu, Ozcan Ozturk
  • Patent number: 12368018
    Abstract: A method includes moving a plurality of sensors along a translation path with respect to an ion beam, acquiring sensor signals produced by the plurality of sensors, converting the acquired sensor signals into a data set representative of a two-dimensional (2D) profile of the ion beam, generating a plurality of first one-dimensional (1D) profiles of the ion beam from the data set, generating a plurality of second 1D profiles of the ion beam by spatially inverting each of the plurality of first 1D profiles, generating a plurality of third 1D profiles of the ion beam by superposing first current density values of each of the plurality of first 1D profiles with second current density values of a corresponding one of the plurality of second 1D profiles and determining whether to continue an implantation process with the ion beam in accordance with the plurality of third 1D profiles.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tien-Shun Chang, Yu-Kang Liu, Su-Hao Liu, Huicheng Chang, Yee-Chia Yeo
  • Patent number: 12369174
    Abstract: Wireless communications systems and methods related to communicating control information are provided. A method of wireless communication performed by a first sidelink user equipment (UE) may include receiving, from a base station (BS), an indicator associated with occupancy of a channel-access gap symbol and transmitting, to a second sidelink UE, a first physical sidelink shared channel (PSSCH) communication via the channel-access gap symbol based on the indicator associated with the occupancy of the channel-access gap symbol.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: July 22, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Yisheng Xue, Jing Sun, Chih-Hao Liu, Xiaoxia Zhang
  • Publication number: 20250234617
    Abstract: Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. The structure includes a source/drain region disposed over a substrate, an interlayer dielectric layer disposed over the source/drain region, a first conductive feature disposed over the source/drain region, a gate electrode layer disposed over the substrate, and a dielectric layer surrounding the first conductive feature. The dielectric layer includes a first portion disposed between the interlayer dielectric layer and the first conductive feature and a second portion disposed between the first conductive feature and the gate electrode layer, at least a portion of the first portion has a first thickness, and the second portion has a second thickness substantially greater than the first thickness.
    Type: Application
    Filed: May 13, 2024
    Publication date: July 17, 2025
    Inventors: Meng-Han CHOU, Wei-Ting CHANG, Su-Hao LIU, Chi On CHUI, Chien-Hao CHEN
  • Publication number: 20250232101
    Abstract: A method is performed at least partially by a processor and includes, based on design specifications of a voltage regulator, determining parameters of the voltage regulator. The method further includes, based on the parameters of the voltage regulator, determining model parameters of a voltage regulator (VR) model of the voltage regulator. The VR model is free of non-linear circuit components. The method further includes performing a simulation of the voltage regulator, using the model parameters of the VR model.
    Type: Application
    Filed: September 16, 2024
    Publication date: July 17, 2025
    Inventors: Ritvik RATHORE, Yu-Ze LIN, Yu-Hao LIU, King-Ho TAM
  • Publication number: 20250233696
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may receive, from a second UE, a sidelink transmission associated with a cast type. The first UE may transmit, to the second UE, hybrid automatic repeat request (HARQ) feedback based at least in part on the sidelink transmission, wherein slots used for transmitting the HARQ feedback are based at least in part on a set of HARQ timelines associated with the cast type, and wherein the set of HARQ timelines is included in multiple sets of HARQ timelines configured for sidelink. Numerous other aspects are described.
    Type: Application
    Filed: May 27, 2022
    Publication date: July 17, 2025
    Inventors: Shaozhen GUO, Chih-Hao LIU, Changlong XU, Jing SUN, Xiaoxia ZHANG, Luanxia YANG, Siyi CHEN, Hao XU