Abstract: The invention provides an isolated peptide comprising a crotonylation site, a Kcr-specific affinity reagent that specifically binds to the peptide, and a method for detecting protein crotonylation in a sample using the reagent.

Abstract: The methods and compositions described herein are based, in part, on the discovery that the introduction of a disulfide bond into an integrin polypeptide by the substitution of at least one cysteine residue in the polypeptide permits stabilization of the integrin in a “closed/inactive” state. This stabilizing disulfide bond permits integrins to be screened for a candidate molecule that can bind to the closed state. In particular, this approach can be used to screen for agents that bind to the closed state of an integrin polypeptide, and are useful as therapeutic treatments to prevent integrin activation.

Abstract: Recombinant microbial cells and methods for producing 5-hydroxytryptophan (5HTP) using such cells are described. More specifically, the recombinant microbial cell comprises an exogenous gene encoding an L-tryptophan hydroxylase, and means for providing tetrahydrobiopterin (THB). Related sequences and vectors for use in preparing such recombinant microbial cells are also described.

Abstract: Recombinant microbial cells and methods for producing melatonin and related compounds using such cells are described. More specifically, the recombinant microbial cell may comprise exogenous genes encoding one or more of an L-tryptophan hydroxylase, a 5-hydroxy-L-tryptophan decarboxylyase, a serotonin acetyltransferase, an acetylserotonin O-methyltransferase; an L-tryptophan decarboxy-lyase, and a tryptamine-5-hydroxylase, and means for providing tetrahydrobiopterin (THB). Related sequences and vectors for use in preparing such recombinant microbial cells are also described.

Abstract: An electronic apparatus is provided that includes a number of first components on a first substrate and a number of second components on a second substrate. A lamination material that includes a conducting material is placed between the first components and the second components. Any one first component can couple to a varied subset of second components.

Abstract: The methods and compositions described herein are based, in part, on the discovery that the introduction of a disulfide bond into an integrin polypeptide by the substitution of at least one cysteine residue in the polypeptide permits stabilization of the integrin in a “closed/inactive” state. This stabilizing disulfide bond permits integrins to be screened for a candidate molecule that can bind to the closed state. In particular, this approach can be used to screen for agents that bind to the closed state of an integrin polypeptide, and are useful as therapeutic treatments to prevent integrin activation.

Abstract: An over-current protection system used in a computer system is disclosed. The computer system includes a current supply module, a processor, and a battery. The over-current protection system commands the processor to disable its boost state if a first current generated by the current supply module when the processor is in the boost state is greater than a second current affordable by the current supply module.

Abstract: The invention provides an organosilicon amine electrolyte material containing a polyether chain, which has a wide range of applications, as well as an application of the electrolyte material in a lithium ion battery. The chemical structure thereof is as shown in Formula 1, wherein R1 and R2 are selected from the same or different C1-C10 alkyls; A is a polyether chain segment having the structure of (CH2)nO[(CH2)mO]x(CH2)y, where n and m are integers from 0 to 10, and x is an integer from 1 to 10; R3, R4 and R5 are selected from the same or the different C1-C10 alkyls or alkoxyl groups, or are equivalent to ANR1R2 or —O—SiR6R7R8 in structure; wherein R6, R7 and R8 are C1-C10 alkyls.

Abstract: An over-current protection system used in a computer system is disclosed. The computer system includes a current supply module, a processor, and a battery. The over-current protection system commands the processor to disable its boost state if a first current generated by the current supply module when the processor is in the boost state is greater than a second current affordable by the current supply module.

Abstract: A MEMS device comprises a proof mass suspended above a substrate, one or more driving combs, and one or more sensing combs. During operation, a DC actuating potential in series with an AC modulation potential is applied to the proof mass, and an AC actuating potential is applied to the one or more driving combs such that the proof mass moves in an oscillatory manner. An inertial sensing system further comprises a sensing element configured to detect a rotation information coupled with an AC signal and an acceleration information coupled with a DC signal.

Abstract: Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD.

Abstract: Pixel circuits (100, 300) and related methods are provided. In this regard, a representative pixel circuit includes: a data line (104, 304) operative to carry a data signal; a select line (106, 306) operative to carry a select signal; a first thin film transistor (TFT) (T1, T1A) conductively coupled to the data line and to the select line; and a second TFT (T2, T2A) capacitively coupled to the first TFT, the second TFT being operative to drive an emissive load responsive to the data signal and the select signal; wherein the data signal is provided to the second TFT through capacitive coupling.

Abstract: An electronic apparatus is provided that includes a number of first components on a first substrate and a number of second components on a second substrate. A lamination material that includes a conducting material is placed between the first components and the second components. Any one first component can couple to a varied subset of second components.

Abstract: An X-ray imaging apparatus includes a top transparent conductive layer and a bottom transparent conductive layer electrically connected to the top transparent conductive layer. The apparatus also includes an X-ray field modulator positioned adjacent to the bottom transparent conductive layer and an electro-optic layer positioned between the X-ray field modulator and the top transparent conductive layer. The X-ray field modulator is configured to modulate one of a resistance and a charge level therethrough when exposed to different X-ray levels to thereby create different levels of voltage drop across the electro-optic layer. In addition, the different levels of voltage drop causes varying optical properties to appear in the electro-optic layer.

Abstract: A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.

Abstract: Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD.

Abstract: A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.

Abstract: A thin-film logic circuit, which can be fabricated entirely of TFTs of the same conductivity type, includes a logic stage connected to a supply voltage and a level shifter connected to a wider voltage range provided by the supply voltage and ground. The logic circuit produces output signals with full rail-to-rail signal range from ground to the supply voltage and can implement or include a basic logic component such as an inverter, a NAND gate, or a NOR gate or more complicated circuits in which many basic logic components are cascaded together. Such logic circuits can be fabricated directly on flexible structures or large areas such as in flat panel displays.

Abstract: Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD.

Abstract: This invention provides a method for reducing the effects of process, supply voltage and temperature variations in integrated circuits and its circuit implementation. The disclosed method builds up a detecting-feedback loop with a plurality of target MOS transistors in main circuits, an induction MOS transistor and a current-to-voltage conversion circuit, and performs a body modulation to effectively reduce the parameter fluctuations of the target MOS transistors in a sub-threshold region or a saturated region due to process, supply voltage and temperature variations. A body-modulated circuit achieves the disclosed method with only a few circuit elements, which effectively improves the stability, reliability and product yield of integrated circuits, especially sub-threshold integrated circuits, without significantly increasing the circuit complexity and power consumption.