Abstract: Disclosed are a refrigerator and a door assembly therefor; the door assembly includes two oppositely arranged doors and a turnover beam assembly, wherein the turnover beam assembly includes: a turnover beam body; a guide part extending out of one end of the turnover beam body and configured to be fitted with a retainer provided on a cabinet of the refrigerator; a locking part telescopically provided in the turnover beam body and having a first end fixedly connected with the guide part and a second end having a locking portion, the locking part having an unlocking state and a locking state. In the present invention, an anti-turnover function of the turnover beam body is achieved using the locking part and the elastic part, which improves coordination among all components, makes an internal structure of the turnover beam assembly more reasonable, achieves high practicability, and realizes easy popularization.

Abstract: A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.

Abstract: This application discloses a packet transmission method and apparatus, a device, and a storage medium, and relates to the field of communication technologies. The method includes: in response to that a second slave port of a network device is invalid or the second slave port does not exist, a second master port of the network device obtains a second dataset, where the second dataset is obtained by modifying a first dataset, and the first dataset includes a timestamp carried in a first clock packet received by a first slave port and data generated by the first slave port based on the first clock packet. The network device sends a second clock packet based on the second dataset through the second master port, where a timestamp carried in the second clock packet is the timestamp carried in the first clock packet.

Abstract: An integrated, modular system for direct air capture (DAC) and electro-microbial production (EMP) for bioelectrochemical conversion of CO2 comprises (a) a solid absorbent configured to directly capture CO2 from air; (b) a first bioreactor configured to receive enriched and purified CO2 from the absorbent and convert the CO2 to an upgradeable organic carbon intermediate by an autotrophic microorganism, wherein the autotrophic organism derives energy from oxidation of electrochemically-generated reducing equivalents; and (c) a second bioreactor configured to receive the organic carbon intermediate from the first bioreactor for use as a feedstock by a metabolically engineered microorganism to generate a value added product.

Abstract: Chemically and thermally stable covalent organic framework (COF) materials are configured and operative as solid adsorbents for capturing gases and water.

Abstract: Compositions comprising multivariate metal-organic frameworks and other single-linker metal-organic frameworks are used for containing and storing a gas or fluid or for water harvesting or water purification applications.

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

Abstract: A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. The first encapsulation layer surrounds a portion of the electrical connection terminal and exposes the electrical connection terminal.

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

Abstract: A microphone inspection method includes the following steps. Firstly, a sound wave from a speaker is received by an under-test microphone and a reference microphone. Consequently, a first characteristic point distribution chart and a second characteristic point distribution chart are created, respectively. Each of the first characteristic point distribution chart and the second characteristic point distribution chart includes plural characteristic points corresponding to respective normalized frequency values. Then, a characteristic point number difference between a number of the characteristic points of the first characteristic point distribution chart and a number of the characteristic points of the second characteristic point distribution chart within a specified normalized frequency value range is calculated. Consequently, the quality of the under-test microphone is judged according to the characteristic point number difference.

Abstract: An optical analysis method is provided for judging whether a lens and a sensing element of an image pickup device are parallel with each other. The method utilizes a tested image pickup device and a standard image pickup device to shoot an object at the same fixed shooting position to acquire a standard image frame and a tested image frame. According to the difference between the position coordinate value or the area of at least one mark of the standard image frame and the tested image frame, the method can judge whether the tested lens and the tested sensing element of the tested image pickup device are parallel with each other.

Abstract: A microphone inspection method includes the following steps. Firstly, a sound wave from a speaker is received by an under-test microphone and a reference microphone. Consequently, a first characteristic point distribution chart and a second characteristic point distribution chart are created, respectively. Each of the first characteristic point distribution chart and the second characteristic point distribution chart includes plural characteristic points corresponding to respective normalized frequency values. Then, a characteristic point number difference between a number of the characteristic points of the first characteristic point distribution chart and a number of the characteristic points of the second characteristic point distribution chart within a specified normalized frequency value range is calculated. Consequently, the quality of the under-test microphone is judged according to the characteristic point number difference.

Abstract: The present invention discloses a method for image pickup and an image pickup device using the same. The image pickup device includes a lens, an image-processing program, and a user interface. The lens is utilized to obtain a main image by shooting an object. The image-processing program divides the main image into a plurality of sub-image blocks, computes the resolution of every sub-image block, and compares each resolution with a threshold. The user interface displays the compared result of each sub-image block to indicate if the lens and the object are parallel.

Abstract: A method of starting snapping a static scene is applied to a system, which is electrically connected with an image-capturing device and a display device. The display device has a displaying zone for display a visual field of the image-capturing device. After an instruction of setting a block in the displaying zone is received by the system, a skin color coverage percentage of the block is calculated. According to the skin color coverage percentage, the system determines whether the scene within the visual field is stored or not. By the method and system of the present invention, a self-timer function is activated according to the skin color.

Abstract: A method for determining the planting ball number of a camera module is provided. The camera module includes a substrate and a chip. The substrate includes an opening and a plurality of contact pads. The opening of the substrate has four rims. The method includes the following steps. Firstly, an image pickup device is used to detect an average contact pad distance of the distances from four specified contact pads of the substrate to the image pickup device. Then, a smallest opening distance among four opening distances from the four rims to the image pickup device is acquired. Then, plural actual contact pad distances from all contact pads to the image pickup device are acquired. The planting ball number for each contact pad is calculated according to these distances. Consequently, the quality of assembling the camera module is enhanced.

Abstract: A method for determining the planting ball number of a camera module is provided. The camera module includes a substrate and a chip. The substrate includes an opening and a plurality of contact pads. The opening of the substrate has four rims. The method includes the following steps. Firstly, an image pickup device is used to detect an average contact pad distance of the distances from four specified contact pads of the substrate to the image pickup device. Then, a smallest opening distance among four opening distances from the four rims to the image pickup device is acquired. Then, plural actual contact pad distances from all contact pads to the image pickup device are acquired. The planting ball number for each contact pad is calculated according to these distances. Consequently, the quality of assembling the camera module is enhanced.

Abstract: An optical analysis method is provided for judging whether a lens and a sensing element of an image pickup device are parallel with each other. The method utilizes a tested image pickup device and a standard image pickup device to shoot an object at the same fixed shooting position to acquire a standard image frame and a tested image frame. According to the difference between the position coordinate value or the area of at least one mark of the standard image frame and the tested image frame, the method can judge whether the tested lens and the tested sensing element of the tested image pickup device are parallel with each other.

Abstract: A focus-quality judging method includes the following steps. Firstly, a comparing object including a target area is provided. A reference image pickup device is provided to shoot the comparing object to obtain a standard image including a standard target area image. Then, a first pixel number contained in the standard target area image is counted. The comparing object is shot by a test image pickup device to obtain a test image including a test target area image, wherein the test image has the same resolution as the standard image. Then, a second pixel number contained in the test target area image is counted. The first pixel number contained in the standard target area image is compared with the second pixel number contained in the test target area image. According to the comparing results, it is discriminated whether the test image pickup device performs an accurate focusing operation.