Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.

Abstract: An in-application search service receives a query from a user attempting to locate information within a document. If a current index and current vector table do not exist, a content indexing service produces an index and a vector table based on the current content of the document. The vector table is based on semantic models that have been pre-trained. The query is tokenized and one of three different processing paths are taken based on the length of the tokenized query. For a single term query, a semantic search and prefix search are performed and the results are combined. If the length of tokenized query exceeds a threshold, a semantic search produces the results. Otherwise, search results are produced based on both prefix fanout and semantic fanout. Results are deduplicated, snippets are extracted, and the results and/or snippets are presented to the user.

Abstract: A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.

Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.

Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.

Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.

Abstract: Embodiments generate and provide connection quality data for networks based on past performance of those networks. Network experience data and corresponding device context are received from a first set of mobile devices. The received data is processed to generate the connection quality data, which is distributed to a second set of mobile devices for use in selecting a network and establishing a connection. Feedback describing performance of the selected network is received and applied to adjust the previously generated connection quality data. In some embodiments, the connection quality data represents voice over Internet Protocol (VoIP) call quality.

Abstract: Embodiments select networks for connection based on application-specific quality scores. A request is received from an application for a network connection. Connection quality data for nearby networks is accessed. The connection quality data is derived from crowdsourced data. The connection quality data is adjusted based on a device context to produce an application-specific quality score for each of the networks. One or more of the networks are selected for connection based on the application-specific quality scores. In some embodiments, a single network connection endpoint is provided to the application to abstract connection management details from the application.