Abstract: A robotic system having movable mechanism of a non-planar inner projection is provided. It comprises a non-planar projection surface, a servo motor, an inner projection element, and a support frame. The servo motor is connected to the non-planar projection surface, and the non-planar projection surface can be rotated synchronously by the servo motor drive. The inner projection element is disposed relative to the non-planar projection surface, the inner projection element generates a target image, and the target image is projected onto the non-planar projection surface to form a display area, and the display area has a fixed boundary. The servo motor and the inner projection element are disposed on the support frame, and when the non-planar projection surface is synchronously rotated by the servo motor, the inner projection element also rotates synchronously.

Abstract: A robotic system having movable mechanism of a non-planar inner projection is provided. It comprises a non-planar projection surface, a servo motor, an inner projection element, and a support frame. The servo motor is connected to the non-planar projection surface, and the non-planar projection surface can be rotated synchronously by the servo motor drive. The inner projection element is disposed relative to the non-planar projection surface, the inner projection element generates a target image, and the target image is projected onto the non-planar projection surface to form a display area, and the display area has a fixed boundary. The servo motor and the inner projection element are disposed on the support frame, and when the non-planar projection surface is synchronously rotated by the servo motor, the inner projection element also rotates synchronously.

Abstract: A carton with fastening structure includes an inner box including an inner case body, an outer case cover including an outer cover body sheltering inner case body, and an elastic fastening part fixed inside the inner case body. The outer cover body includes an opening providing the inner case body to slide in. The outer cover body slips relative to the inner case body to shelter the inner cover body at a closed position. The elastic fastening part includes a shifting part. Each of the outer cover body and the inner case body includes an outer through-hole and an inner through-hole, respectively. The shifting part includes a fastening position, where the shifting part passes through the outer through-hole and the inner through-hole when the outer cover body is at the closed position, and a retracted position, where the shifting part does not pass through the outer through-hole and the inner through-hole.

Abstract: A carton with fastening structure includes an inner box including an inner case body, an outer case cover including an outer cover body sheltering inner case body, and an elastic fastening part fixed inside the inner case body. The outer cover body includes an opening providing the inner case body to slide in. The outer cover body slips relative to the inner case body to shelter the inner cover body at a closed position. The elastic fastening part includes a shifting part. Each of the outer cover body and the inner case body includes an outer through-hole and an inner through-hole, respectively. The shifting part includes a fastening position, where the shifting part passes through the outer through-hole and the inner through-hole when the outer cover body is at the closed position, and a retracted position, where the shifting part does not pass through the outer through-hole and the inner through-hole.

Abstract: A multi-chips in system level and wafer level package structure includes a package substrate having a plurality of through holes a multi-chips with different functions and sizes, the metal wires, a package body, and the conductive components. The multi-chips are used to combine with the package substrate so as to the pads of the multi-chips are exposed out of the through holes. The pads of the multi-chips are electrically connected to the connecting terminal adjacent to the through holes by the plurality of conductive wires. The package material is filled into the through holes to form the package body to encapsulate the conductive wire, each active surface and the pads of the multi-chips with the different functions and the sizes by dispensing method so as to the multiple chip system level and wafer level package structure is accomplished by partially packaging method.

Abstract: A multi-chips in system level and wafer level package structure includes a package substrate having a plurality of through holes a multi-chips with different functions and sizes, the metal wires, a package body, and the conductive components. The multi-chips are used to combine with the package substrate so as to the pads of the multi-chips are exposed out of the through holes. The pads of the multi-chips are electrically connected to the connecting terminal adjacent to the through holes by the plurality of conductive wires. The package material is filled into the through holes to form the package body to encapsulate the conductive wire, each active surface and the pads of the multi-chips with the different functions and the sizes by dispensing method so as to the multiple chip system level and wafer level package structure is accomplished by partially packaging method.

Abstract: A heat pipe having a circuitous capillary tissue includes a pipe body and a capillary tissue installed in the pipe body. The interior of the pipe body is formed with a vapor flow channel which is hollow and extended towards the length direction thereof, and a working fluid is stored therein; the capillary tissue is formed with a primary capillary part, two secondary capillary parts, and communicating capillary parts connected between the primary and the secondary capillary parts; wherein, the two secondary capillary parts are both extended along the length direction of the pipe body and respectively abutted against two lateral walls extended along the length direction of a pipe member, and two sides of the primary capillary part are both formed with a space allowing the vapor flow channel to be kept.

Abstract: A heat pipe structure includes a pipe shell (1) and a capillary tissue (2) disposed in the pipe shell (1). A pipe body (10) has a hollow vapor channel (100) along a longitudinal direction thereof and sealing a working fluid. The capillary tissue (2) has two strip-shaped primary capillary portions (20, 21) passing through the vapor channel (100) and a connecting capillary portion (22) connecting the two primary capillary portions (20, 21). The two primary capillary portions (20, 21) extend along a longitudinal direction of the pipe shell (1) and are immediately adjacent to respective side walls (103) of the pipe body (10) along the longitudinal direction thereof. The connecting capillary portion (22) is disposed against the inside of one end (11) of the pipe shell (1) to connect the two primary capillary portions (20, 21) for mutual transmission of the working fluid.

Abstract: A heat pipe structure having a capillary tissue formed with end part for supporting includes a pipe body and a capillary tissue installed in the pipe body; the capillary tissue includes a strip-like primary capillary part and a positioning capillary part, the primary capillary part is abutted against a lateral wall formed in the pipe body, and the positioning capillary part is formed with a connecting segment, and an abutting segment and a distal segment in sequence extended from the connecting segment. The connecting segment allows the positioning capillary part to be connected to one end of the primary capillary part thereby enabling the positioning capillary part to be extended from a lateral wall to another lateral wall of the pipe body, and the abutting segment is extended along the length direction of the pipe body thereby allowing the distal segment to be formed.

Abstract: A heat pipe includes a pipe and a wick structure disposed therein. The pipe has a longitudinal vapor passage. The wick structure has a strip-shaped main wick portion which passes the vapor passage and two positioning wick portions which separately connect to two ends of the main wick portion. Each positioning wick portion has a connection section and an abutting section extending therefrom. The connection sections separately connect the positioning wick portions to two ends of the main wick portion. The abutting sections abut against two opposite positions of an inside wall of the pipe.

Abstract: A flat mesh wick structure of an ultrathin heat pipe and an ultrathin heat pipe having the same are provided in the present disclosure. The mesh wick structure is included of a plurality of braided wires, and each of the braided wires is included of a plurality of intercrossed segments arranged at interval and a plurality of connecting segments connected between the adjacent intercrossed segments, wherein the intercrossed segment of each braided wire is of a flat shape. The flat mesh wick structure is constituted thereby.

Abstract: A coaxial capillary structure and an ultra-thin heat pipe structure having the same are provided. The coaxial capillary structure is installed in an ultra-thin heat pipe and extended towards the length direction of a pipe body of the ultra-thin heat pipe, and includes: a primary transferring capillary part and a coaxially-arranged capillary part, wherein the primary transferring capillary part is composed of a plurality of fiber bundles for forming as an integral bundle, and the coaxially-arranged capillary part is formed through a plurality of weaving wires interwoven and reeled at the exterior of the primary transferring capillary part, thereby limiting each of the fiber bundles at the central portion of the coaxially-arranged capillary part for forming a compact structure. Accordingly, a better capillary transferring effect is provided.

Abstract: A plate heat pipe includes a hollow housing formed in a plate shape and a flat-plate type capillary structure. The flat-plate type capillary structure includes a capillary boundary part and a plurality of primary capillary transportation parts; wherein the capillary boundary part is surroundingly arranged at the periphery of a vaporization portion of the plate heat pipe, and a hollow vapor flowing zone is defined between the capillary boundary part and the vaporization portion. Each of the primary capillary transportation parts is disposed in the vapor flowing zone and extended from the capillary boundary part to the vaporization portion so as to be respectively gathered on the vaporization portion.

Abstract: A slim-type heat pipe includes a tube, being hollow and flat; and a wick structure, longitudinally disposed in the tube, having an attachment side attached on a local portion of an inner side of the tube and a formation side opposite to the attachment side, and a vapor passage formed between the formation side and the inner side of the tube. The wick structure is provided with grooves radially around the inner side of the tube. The attachment side is attached on the grooves. Depth of the groove is less than 30% of thickness of a wall of the tube.

Abstract: A method for manufacturing a heat pipe with an ultra-thin capillary structure comprises the steps of: (a) preparing a hollow tube body, and pre-manufacturing a capillary structure that is shaped as a thin plate, the capillary structure having an adhering surface attached to a partial portion of an inner wall of the tube body and a forming surface that is opposite to the adhering surface; (b) disposing the capillary structure into the tube body so as to let the adhering surface be attached to the partial portion of the inner wall of the tube body for positioning; and (c) pressing the tube body in order to let the inner wall of the tube body urge on a partial portion of the forming surface of the capillary structure, and a vapor channel being formed between the capillary structure and the inner wall of the tube body.

Abstract: A heat pipe with an ultra-thin capillary structure includes a tube body which is hollow and flat, and a capillary structure which is in the tube body and is shaped as a thin plate. The capillary structure has an adhering surface attached on a partial portion of an inner wall of the tube body, and a forming surface corresponding to the adhering surface. A vapor channel formed between the forming surface and the inner wall of the tube body; wherein the forming surface further includes an abutting surface elongated along a longitudinal direction of the vapor channel and at least one capillary transmission surface extending from a side of the abutting surface to connect to the adhering surface the steam channel, and the capillary transmission surface is gradually inclined between the adhering surface and the abutting surface.

Abstract: A heat pipe with an ultra-thin capillary structure includes a tube body being hollow and flat, and a capillary structure disposed in the tube body and shaped as a thin plate. The capillary structure has a first adhering surface attaching on a partial portion of an inner wall of the tube body, a forming surface opposite to the first adhering surface, and a second adhering surface forming at one side between the first adhering surface and the forming surface. The second adhering surface is attached on the inner wall so that a vapor channel is formed between the forming surface and the inner wall; wherein the forming surface elongates along a longitudinal direction of the vapor channel, and is tapered to form an inclined interface between the capillary structure and the vapor channel as a capillary transmission surface.

Abstract: A thermal conductor with an ultra-thin flat wick structure (2) includes a hollow shell (1) having a flat shape, and a wick structure (2) disposed in the shell (1) and contacted with an inner wall (100) of the shell (1), wherein the wick structure (2) is a thin planar body having a plane (20) and a pressing surface (21) opposite to the plane (20), wherein the plane (20) is attached to the inner wall (100) of the shell (1), wherein a plurality of elongated concave surfaces (210) are spacedly arranged on the pressing surface (21) such that a steam channel (101) is formed in the shell (1) via each of the concave surfaces (210) and an elongated wick structure connection (200) is formed between each concave surface (210) and the plane (20).

Abstract: A heat pipe with an ultra-thin flat wick structure includes a shell and a wick structure disposed in the shell. The wick structure includes heat exchange zones and at least one liquid channel connected between the heat exchange zones which are divided into an evaporation portion and a condensation portion. Each of the heat exchange zones has a plane and a pressing surface opposite to the plane. A plurality of elongated concave surfaces are spacedly arranged on the pressing surface such that a respective steam channel is formed via each of the concave surfaces in the shell and a respective elongated wick structure connection is formed between each concave surface and the plane. Cut-out zones are formed at two sides of the liquid channel between the heat exchange zones in the shell.

Abstract: A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction includes the steps of preparing a slab-shaped capillary structure, forming narrow and long recessed portions with an interval apart from each other on a surface of the slab-shaped capillary structure by an extrusion method, and arranging the recessed portion along the lengthwise direction of the slab-shaped capillary structure, and installing the slab-shaped capillary structure in a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.