Abstract: The present disclosure provides a fabrication method to produce a semiconductor structure with increased reliability for use in NAND memory devices. The method can include forming a layered semiconductor structure that includes a first layer, a second layer disposed on the first layer, and a third layer disposed on the second layer. The method can also include forming a channel structure, which can include etching the first layer, the second layer, and the third layer to form an opening through a surface of the semiconductor structure. A portion of the third layer can be exposed at the opening. The forming of the channel structure also include oxidizing the exposed portion of the third layer to form silicon oxide expand the exposed portion of the third layer.

Abstract: The present disclosure provides a fabrication method to produce a semiconductor structure with increased reliability for use in NAND memory devices. The method can include forming a layered semiconductor structure that includes a first layer, a second layer disposed on the first layer, and a third layer disposed on the second layer. The method can also include forming a channel structure, which can include etching the first layer, the second layer, and the third layer to form an opening through a surface of the semiconductor structure. A portion of the third layer can be exposed at the opening. The forming of the channel structure also include oxidizing the exposed portion of the third layer to form silicon oxide expand the exposed portion of the third layer.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a layer stack, a channel hole, a blocking layer, a charge trap layer, a tunnel insulation layer, and a channel layer. The surface region of the charge trap layer includes a carbon region that contains a certain amount of carbon elements.

Abstract: A memory device includes a first semiconductor layer, a stack structure comprising conductive layers and dielectric layers stacked alternatively over the first semiconductor layer, a semiconductor channel layer extending through the stack structure and the first semiconductor layer, and a functional layer extending through the stack structure and surrounding the semiconductor channel layer. The at least one of the functional layer and the semiconductor channel layer comprises deuterium elements.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a dielectric stack over a substrate, forming a functional layer and a semiconductor channel through the dielectric stack, forming a conductor/insulator stack based on the dielectric stack, and forming memory cells through the conductor/insulator stack. Each memory cell includes a portion of the functional layer and the semiconductor channel. At least one of the functional layer and the semiconductor channel includes a certain amount of deuterium elements.

Abstract: Systems and methods for predicting a delivery time are provided. An example method includes: receiving one or more configurations for a merchant account associated with a merchant; providing to a machine-learning model parcel data corresponding to one or more products purchased from the merchant and the one or more configurations. The machine-learning model is trained based on historical parcel data, configurations, and delivery times to predict an estimated delivery time of one or more products. The method further includes receiving from the machine-learning model an estimated delivery time of the one or more products purchased from the merchant; obtaining updated parcel data corresponding to the one or more products; providing to the machine-learning model the updated parcel data to receive an updated estimated delivery time; and returning the updated estimated delivery time.

Abstract: Examples of the present application disclose a semiconductor device and a fabrication method thereof and a memory system. The semiconductor device includes: a stack structure including first regions and second regions; channel structures that are located in the first regions and penetrate through the stack structure along a first direction; and gate line isolation structures that are located in the second regions and extend along a second direction, wherein the gate line isolation structures penetrate through the stack structure along the first direction and are in a concavo-convex shape along a third direction.

Abstract: Semiconductor fabrication methods and semiconductor devices are disclosed. According to some aspects, a memory device includes a memory stack having interleaved a plurality of conductive layers and a plurality of insulating layers on a substrate, and a channel structure extending vertically in the memory stack. The channel structure includes a semiconductor channel extending vertically in the memory stack and conductively connected to a source structure. The semiconductor channel includes polysilicon, and a grain size of the polysilicon ranges from 100 nm to 600 nm.

Abstract: The present disclosure provides a fabrication method to produce a semiconductor structure with increased reliability for use in NAND memory devices. The method can include forming a layered semiconductor structure that includes a first layer, a second layer disposed on the first layer, and a third layer disposed on the second layer. The method can also include forming a channel structure, which can include etching the first layer, the second layer, and the third layer to form an opening through a surface of the semiconductor structure. A portion of the third layer can be exposed at the opening. The forming of the channel structure also include oxidizing the exposed portion of the third layer to form silicon oxide expand the exposed portion of the third layer.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a dielectric stack over a substrate, forming a functional layer and a semiconductor channel through the dielectric stack, forming a conductor/insulator stack based on the dielectric stack, and forming memory cells through the conductor/insulator stack. Each memory cell includes a portion of the functional layer and the semiconductor channel. At least one of the functional layer and the semiconductor channel includes a certain amount of deuterium elements.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes forming a layer stack, a channel hole, a blocking layer, a charge trap layer, a tunnel insulation layer, and a channel layer. The surface region of the charge trap layer includes a carbon region that contains a certain amount of carbon elements.

Abstract: Semiconductor fabrication methods and semiconductor devices are disclosed. According to some aspects, a memory device includes a memory stack having interleaved a plurality of conductive layers and a plurality of insulating layers on a substrate, and a channel structure extending vertically in the memory stack. The channel structure includes a semiconductor channel extending vertically in the memory stack and conductively connected to a source structure. The semiconductor channel includes polysilicon, and a grain size of the polysilicon ranges from 100 nm to 600 nm.

Abstract: A structure includes a multi-port memory including a multiple transistor bitcell single ended read port and a write port, a read circuit which is connected to a multiple transistor bitcell circuit and is also configured to evaluate the multiple transistor bitcell single ended read port, and a timer circuit for the single ended read port and which is configured to generate two successive read pulses in one clock cycle for the multi-port memory.

Abstract: A structure includes a multi-port memory including a multiple transistor bitcell single ended read port and a write port, a read circuit which is connected to a multiple transistor bitcell circuit and is also configured to evaluate the multiple transistor bitcell single ended read port, and a timer circuit for the single ended read port and which is configured to generate two successive read pulses in one clock cycle for the multi-port memory.

Abstract: A structure includes a write driver circuit configured to drive both a true bitline side and a complement bitline side up to a power supply and down to ground such that one of the true bitline side and the complement bitline side is driven to ground and another of the true bitline side and the complement bitline side is driven to a high level at a same time and before a precharge below a level of the power supply of the one of the true bitline side and the complement bitline side.

Abstract: A structure includes a write driver circuit configured to drive both a true bitline side and a complement bitline side up to a power supply and down to ground such that one of the true bitline side and the complement bitline side is driven to ground and another of the true bitline side and the complement bitline side is driven to a high level at a same time and before a precharge below a level of the power supply of the one of the true bitline side and the complement bitline side.