Abstract: A portable data accessing device and more particularly the use of multi-port interfaces on a data accessing device disclosed. The multi-port data accessing device includes an inner body, one or a plurality of moving-caps, one or a plurality of grips, a pump-action and one or a plurality of locking/releasing mechanisms.

Abstract: An electronic device may have a display with touch sensors. One or more shielding layers may be interposed between the display and the touch sensors. The display may include transistors with gate conductors, a first planarization layer formed over the gate conductors, one or more contacts formed in a first source-drain layer within the first planarization layer, a second planarization layer formed on the first planarization layer, one or more data lines formed in a second source-drain layer within the second planarization layer, a third planarization layer formed on the second planarization layer, and a data line shielding structure formed at least partly in a third source-drain layer within the third planarization layer. The data line shielding structure may be a routing line, a blanket layer, a mesh layer formed in one or more metal layers, and/or a data line covering another data line.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: The present disclosure provides composition and methods to improve the nutritional status of a subject, as well as aid in the maturation of the gut microbiota of a subject. The disclosure encompasses edible compositions that, when eaten in a manner described herein, impacts the subject's gut microbiota by changing the relative abundances of a plurality of health-discriminatory gut taxa in a statistically significant manner towards chronologically age-matched healthy subjects.

Abstract: The present invention provides a backlight module including a back bezel and a frame. The back bezel is provided with a wall disposed along a first side of the back bezel. The wall is provided with a first wall portion and a second wall portion alternately arranged along the first side, and the first wall portion and the second wall portion are each provided with an inner side surface and an outer side surface opposite to the inner side surface. In the backlight module, the inner side surface of the second wall portion protrudes toward the interior of the back bezel more than the inner side surface of the first wall portion. The frame extends at least partially along the first side and is positioned on the wall. The frame is provided with a first frame wall and a second frame wall alternately arranged and protruding toward a base of the wall.

Abstract: The present invention provides a backlight module including a back bezel and a frame. The back bezel is provided with a wall disposed along a first side of the back bezel. The wall is provided with a first wall portion and a second wall portion alternately arranged along the first side, and the first wall portion and the second wall portion are each provided with an inner side surface and an outer side surface opposite to the inner side surface. In the backlight module, the inner side surface of the second wall portion protrudes toward the interior of the back bezel more than the inner side surface of the first wall portion. The frame extends at least partially along the first side and is positioned on the wall. The frame is provided with a first frame wall and a second frame wall alternately arranged and protruding toward a base of the wall.

Abstract: A method for text character identification. The method acquires multiple connected components (CCs) in a binary image, and each CC has a pattern property value. The method determines at least one property limit based on the pattern property values, generates a filtering rule according to the property limit, and determines whether each of the CCs is a text character according to the filtering rule.

Abstract: A printing system outputs an alignment pattern using a printhead where its skewness is to be calibrated. The skewness of the printhead can be detected according to the pattern match of the alignment pattern. The available number of nozzles to be used on the printhead is then determined according to the skewness of the printhead, which thereby reduces the influence of skewness of the printhead.

Abstract: A method for text character identification. The method acquires multiple connected components (CCs) in a binary image, and each CC has a pattern property value. The method determines at least one property limit based on the pattern property values, generates a filtering rule according to the property limit, and determines whether each of the CCs is a text character according to the filtering rule.

Abstract: Within both a method for forming a patterned photoresist layer and a method for forming an electroplated patterned conductor layer while employing the patterned photoresist layer as a patterned photoresist plating mask layer there is first provided a substrate. There is then formed over the substrate a blanket photoresist layer formed of a negative photoresist material. There is then photoexposed the blanket photoresist layer to form a photoexposed blanket photoresist layer while employing a photoexposure apparatus which employs an annular edge ring exclusion apparatus positioned over an annular edge ring of the blanket photoresist layer and the substrate. Finally, there is then developed the photoexposed blanket photoresist layer to form a patterned photoresist layer having an annular edge ring excluded over the annular edge ring of the substrate.

Abstract: Within both a method for forming a patterned photoresist layer and a method for forming an electroplated patterned conductor layer while employing the patterned photoresist layer as a patterned photoresist plating mask layer there is first provided a substrate. There is then formed over the substrate a blanket photoresist layer formed of a negative photoresist material. There is then photoexposed the blanket photoresist layer to form a photoexposed blanket photoresist layer while employing a photoexposure apparatus which employs an annular edge ring exclusion apparatus positioned over an annular edge ring of the blanket photoresist layer and the substrate. Finally, there is then developed the photoexposed blanket photoresist layer to form a patterned photoresist layer having an annular edge ring excluded over the annular edge ring of the substrate.

Abstract: An apparatus and a method for sealingly engaging an upper chamber lid and a lower chamber lid of a vacuum process chamber together without leakage are provided. In the apparatus, an upper chamber lid is connected to a support frame by an universal joint such that a perfect alignment between the upper chamber lid and the lower camber lid can be achieved by making 360° movement of the upper chamber lid. The support frame is further provided with a plurality of compressible spring members, i.e., at least 3 or 4 spring members that are mounted to the support frame and projected downwardly for pressing on a top surface of the upper camber lid and achieving a vacuum-tight seal between the upper lid and the lower lid. The novel use of the universal joint and the plurality of compressible springs therefore enables the present invention apparatus to achieve a vacuum-tight seal between two chambers halves in a vacuum process chamber.

Abstract: A system for pumping resist to a wafer coating machine includes a line that returns a selected proportion of the resist entering the resist pump to the resist supply tank. The return line to the tank is connected to the pump outlet at a higher point than the pump outlet to the wafer coating machine, and the resist that is returned to the tank carries substantially all of the bubbles that are carried in the resist entering the tank. The bubbles are removed from the resist in the tank and the resist can be used normally.

Abstract: A system for pumping resist to a wafer coating machine includes a line that returns a selected proportion of the resist entering the resist pump to the resist supply tank. The return line to the tank is connected to the pump outlet at a higher point than the pump outlet to the wafer coating machine, and the resist that is returned to the tank carries substantially all of the bubbles that are carried in the resist entering the tank. The bubbles are removed from the resist in the tank and the resist can be used normally.