Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.

Abstract: An aiming system includes a positioner, an aiming device, and a processor. The positioner has a function of acquiring spatial information, and the aiming device is connected to the positioner, and the processor is connected to the positioner or the aiming device. A method of using the aiming system is also provided. Surgical guidance is more intuitive by directly combining the positioner with the aiming device.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.

Abstract: A method can include receiving a low-resolution (LR) image, extracting a first feature embedding from the LR image, performing a first upsampling to the LR image by a first upsampling factor to generate a upsampled image, receiving a LR coordinate of a pixel within the LR image and a first cell size of the LR coordinate, generating a first residual image based on the first feature embedding, the LR coordinate, and the first cell size of the LR coordinate using a local implicit image function, and generating a first high-resolution (HR) image by combining the first residual image and the upsampled image via element-wise addition.

Abstract: A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.

Abstract: The present invention provides a method of laminating a film for a dye-sensitized cell. First, a composite film is taken by a robotic arm, in which the composite film includes a release layer, a protective layer and a hot glue layer between the release layer and the protective layer, and the release layer is removed by the robotic arm. Then, the hot glue layer is precisely attached to a substrate by a target positioning step. Next, the protective layer is removed by the robotic arm.

Abstract: The present invention provides a method of laminating a film for a dye-sensitized cell. First, a composite film is taken by a robotic arm, in which the composite film includes a release layer, a protective layer and a hot glue layer between the release layer and the protective layer, and the release layer is removed by the robotic arm. Then, the hot glue layer is precisely attached to a substrate by a target positioning step. Next, the protective layer is removed by the robotic arm.

Abstract: A method for conversion treating a surface of a magnesium alloy workpiece includes the following steps: providing a magnesium alloy workpiece, degreasing the magnesium alloy workpiece, acid pickling the magnesium alloy workpiece in a first acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a first surface conditioning treatment step, acid pickling the magnesium alloy workpiece in a second acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a second surface conditioning treatment step, pre-phosphating the magnesium alloy workpiece in a pre-phosphating treatment step, and phosphating the magnesium alloy workpiece in a phosphating treatment step to form a phosphating film on the surface of the magnesium alloy workpiece.

Abstract: A method for conversion treating a surface of a magnesium alloy workpiece includes the following steps: providing a magnesium alloy workpiece, degreasing the magnesium alloy workpiece, acid pickling the magnesium alloy workpiece in a first acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a first surface conditioning treatment step, acid pickling the magnesium alloy workpiece in a second acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a second surface conditioning treatment step, pre-phosphating the magnesium alloy workpiece in a pre-phosphating treatment step, and phosphating the magnesium alloy workpiece in a phosphating treatment step to form a phosphating film on the surface of the magnesium alloy workpiece.

Abstract: An apparatus for converting ultraviolet (UV) light into electricity is disclosed. It includes a UV-light-into-electricity conversion device and an electricity storage. The welding operation zone has a welding apparatus for welding a workpiece. This welding apparatus generates strong UV light during a welding operation. The UV-light-into-electricity conversion device can absorb the UV light and then convert into electricity. Finally, the electricity storage stores the electricity generated by the UV-light-into-electricity conversion device. Hence, it can convert the harmful UV light into useable electricity. The entire structure of this invention is simple. In addition, it is suitable for a fixed operation zone or a movable operation zone during a welding operation.