Patents by Inventor HAO-WEI FONG

HAO-WEI FONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic shielding element, and transmission line assembly and electronic structure package using the same
    Patent number: 11369049
    Abstract: An electromagnetic shielding element and, transmission line assembly and electronic structure package using the same are provided. The electromagnetic shielding element is applied to the transmission line assembly and the electronic structure package to shield electromagnetic noise. The electromagnetic shielding element includes a quantum well structure, and the quantum well structure includes at least two barrier layers and at least one carrier confined layer located between the two barrier layers. Each barrier layer has a thickness between 0.1 nm and 500 nm, and the thickness of the carrier confined layer is between 0.1 nm and 500 nm. The electromagnetic shielding element absorbs electromagnetic wave noise to suppress electromagnetic interference.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: June 21, 2022
    Assignee: HOTEK MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Hao-Wei Fong, Ming-Goo Chien, Chia-Yu Wu
  • ELECTROMAGNETIC SHIELDING ELEMENT, AND TRANSMISSION LINE ASSEMBLY AND ELECTRONIC STRUCTURE PACKAGE USING THE SAME
    Publication number: 20200205321
    Abstract: An electromagnetic shielding element and, transmission line assembly and electronic structure package using the same are provided. The electromagnetic shielding element is applied to the transmission line assembly and the electronic structure package to shield electromagnetic noise. The electromagnetic shielding element includes a quantum well structure, and the quantum well structure includes at least two barrier layers and at least one carrier confined layer located between the two barrier layers. Each barrier layer has a thickness between 0.1 nm and 500 nm, and the thickness of the carrier confined layer is between 0.1 nm and 500 nm. The electromagnetic shielding element absorbs electromagnetic wave noise to suppress electromagnetic interference.
    Type: Application
    Filed: June 21, 2019
    Publication date: June 25, 2020
    Inventors: HAO-WEI FONG, MING-GOO CHIEN, CHIA-YU WU