Abstract: A medical document analysis method includes following steps: performing recursive search based on keywords extracted from first medical documents to obtain second medical documents; analyzing feature labels of the second medical documents; projecting the second medical documents onto a multi-dimensional map according to the feature labels; estimating second symptoms from a first symptom; selecting third medical documents based on the first symptom and the second symptom from the multi-dimensional map; analyzing correlation between the third medical documents and their respective feature labels in the multi-dimensional map to form a label topology map; and selecting a target branch path from branch paths in the label topology map, and displaying information about the target branch path.

Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: In a method of manufacturing a photo mask, a resist layer is formed over a mask blank, which includes a mask substrate, a phase shift layer disposed on the mask substrate and a light blocking layer disposed on the phase shift layer. A resist pattern is formed by using a lithographic operation. The light blocking layer is patterned by using the resist pattern as an etching mask. The phase shift layer is patterned by using the patterned light blocking layer as an etching mask. A border region of the mask substrate is covered with an etching hard cover, while a pattern region of the mask substrate is opened. The patterned light blocking layer in the pattern region is patterned through the opening of the etching hard cover. A photo-etching operation is performed on the pattern region to remove residues of the light blocking layer.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: Crystalline 4-((L-valyl)oxy)butanoic acid, methods of preparing crystalline 4-((L-valyl)oxy)butanoic acid, pharmaceutical compositions of crystalline 4-((L-valyl)oxy)butanoic acid, and methods of treatment using crystalline 4-((L-valyl)oxy)butanoic acid are disclosed.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A front light module includes a light guide sheet and a light bar. The light guide sheet has two light receiving laterals, a fold line, a first pattern area, and a second pattern area respectively located on two sides of the fold line. One light receiving lateral is protruded to form first taper sets, and the other is protruded to form second taper sets. The second pattern area is superimposed on the first pattern area, and the first and second tapers set are engaged and coplanar to form a light incident surface after folding along the fold line. The light bar provides light toward the light incident surface, the first pattern area is lit by the odd positions of the light bar via the first taper sets, and the second pattern area is lit by the even positions of the light bar via the second taper sets.

Abstract: A semiconductor device includes a first contact layer, a second contact layer, an active layer, a photonic crystal layer, a passivation layer, a first electrode and a second electrode. The first contact layer has a first surface and a second surface opposite to each other. Microstructures are located on the second surface. The second contact layer is located below the first surface. The active layer is located between the first contact layer and the second contact layer. The photonic crystal layer is located between the active layer and the second contact layer. The passivation layer is located on the second contact layer. The first electrode is located on the passivation layer and is electrically connected the first surface of the first contact layer. The second electrode is located on the passivation layer and is electrically connected to the second contact layer.

Abstract: An antenna device, a positioning system and a positioning method are provided. The positioning method includes: dispersedly arranging a plurality of receivers to form a target area, in which each of the receivers includes the antenna device; receiving a wireless signal from the target area through the antenna device, and generating a difference signal strength and a sum signal strength; calculating, for each of the receivers, a sum-difference ratio between the difference signal strength and the sum signal strength, and estimating a corresponding one of estimated incident angles according to the sum-difference ratio and a comparison table; executing, in response to obtaining the estimated incident angles corresponding to the receivers, a positioning algorithm according to the estimated incident angles, so as to generate a plurality of possible positions; and executing an optimization algorithm to calculate a best estimated position of the possible positions.

Abstract: A one-coil multi-core inductor-capacitor (LC) oscillator is provided. The one-coil multi-core LC oscillator includes a main coil and at least one mode suppression device. The main coil includes an outer wire and a central wire, wherein the outer wire is coupled to a first core circuit and a second core circuit, and the central wire is coupled between a first node and a second node of the outer wire. More particularly, an outer loop formed by the outer wire corresponds to a first mode of the one-coil multi-core LC oscillator, and inner loops formed by the outer wire and the central wire correspond to a second mode of the one-coil multi-core LC oscillator, where the at least one mode suppression device is configured to suppress one of the first mode and the second mode.

Abstract: A semiconductor device includes a metal layer, a ground plane formed on the metal layer, a first inductor formed on the metal layer, and a first isolation region formed on the metal layer and arranged to separate the first inductor from the ground plane. The first isolation region includes a first main area surrounding the first inductor, and at least one first slot extended from the first main area.

Abstract: A one-coil multi-core inductor-capacitor (LC) oscillator is provided. The one-coil multi-core LC oscillator includes a main coil and at least one mode suppression device. The main coil includes an outer wire and a central wire, wherein the outer wire is coupled to a first core circuit and a second core circuit, and the central wire is coupled between a first node and a second node of the outer wire. More particularly, an outer loop formed by the outer wire corresponds to a first mode of the one-coil multi-core LC oscillator, and inner loops formed by the outer wire and the central wire correspond to a second mode of the one-coil multi-core LC oscillator, where the at least one mode suppression device is configured to suppress one of the first mode and the second mode.

Abstract: An inductor-capacitor (LC) oscillator with an embedded second harmonic filter and an associated dual core oscillator are provided. The LC oscillator includes a first transistor, a second transistor, a first part-one inductor, a second part-one inductor, a part-one capacitor, a part-two inductor and at least one part-two capacitor. A first end of the first part-one inductor and a first end of the second part-one inductor are coupled to gate terminals of the second transistor and the first transistor, respectively. The part-one capacitor is coupled between the first end of the first part-one inductor and the first end of the second part-one inductor. The part-two inductor is coupled between a second end of the first part-one inductor and a second end of the second part-one inductor. The at least one part-two capacitor is coupled to drain terminals of the first transistor and the second transistor.

Abstract: An inductor-capacitor (LC) oscillator with an embedded second harmonic filter and an associated dual core oscillator are provided. The LC oscillator includes a first transistor, a second transistor, a first part-one inductor, a second part-one inductor, a part-one capacitor, a part-two inductor and at least one part-two capacitor. A first end of the first part-one inductor and a first end of the second part-one inductor are coupled to gate terminals of the second transistor and the first transistor, respectively. The part-one capacitor is coupled between the first end of the first part-one inductor and the first end of the second part-one inductor. The part-two inductor is coupled between a second end of the first part-one inductor and a second end of the second part-one inductor. The at least one part-two capacitor is coupled to drain terminals of the first transistor and the second transistor.

Abstract: An oscillator apparatus includes an oscillator core circuit. The oscillator core circuit includes an inverting transconductance amplifier, at least one first capacitor, at least one second capacitor, and a resonator. The at least one first capacitor is connected between an input of the inverting transconductance amplifier and a ground level. The at least one second capacitor is connected between an output of the inverting transconductance amplifier and the ground level. The resonator has a first port connected to the input of the inverting transconductance amplifier and a second port connected to the output of the inverting transconductance amplifier. The first port is decoupled from the second port.