Patents by Inventor Hao-Wei KU

Hao-Wei KU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modularized riser system
    Patent number: 11966352
    Abstract: An information handling system with modular riser components for receiving expansion cards having various requirements. The system includes a riser body assembly having a common support structure for receiving expansion cards. The common support structure may be coupled to different expansion structures to provide support of expansion cards having requirements that would not be met by the common support structure alone.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: April 23, 2024
    Assignee: Dell Products L.P.
    Inventors: Yu-Feng Lin, Hao-Cheng Ku, Yi-Wei Lu
  • Wafer level reflector for LED packaging
    Patent number: 9343505
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: May 17, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Min Lin, Shang-Yu Tsai
  • Light-emitting diode (LED) package systems and methods of making the same
    Patent number: 8754440
    Abstract: A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: June 17, 2014
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Yu-Sheng Tang, Hsin-Hung Chen, Hao-Wei Ku
  • Wafer Level Reflector for LED Packaging
    Publication number: 20130299855
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Application
    Filed: July 15, 2013
    Publication date: November 14, 2013
    Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hain-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
  • Wafer level reflector for LED packaging
    Patent number: 8486724
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: July 16, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
  • LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS AND METHODS OF MAKING THE SAME
    Publication number: 20120241784
    Abstract: A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.
    Type: Application
    Filed: March 22, 2011
    Publication date: September 27, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANTY, LTD.
    Inventors: Yu-Sheng Tang, Hsin-Hung Chen, Hao-Wei Ku
  • LIGHT EMITTING DIODE PACKAGE WITH PHOTORESIST REFLECTOR AND METHOD OF MANUFACTURING
    Publication number: 20120098006
    Abstract: Optical emitters are fabricated by forming and shaping photoresist reflectors on a package wafer using lithography processes, and bonding Light-Emitting Diode (LED) dies to the package wafer.
    Type: Application
    Filed: July 7, 2011
    Publication date: April 26, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chang CHEN, Hsin-Hsien WU, Fu-Wen LIU, Hao-Wei KU, Hsin-Hung CHEN
  • WAFER LEVEL REFLECTOR FOR LED PACKAGING
    Publication number: 20120097986
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Application
    Filed: October 22, 2010
    Publication date: April 26, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hao-Wei KU, Chung Yu WANG, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai