Patents by Inventor Hao-Wei Lin

Hao-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079283
    Abstract: A package structure includes a first semiconductor die, a second semiconductor die, an insulating encapsulant and a redistribution layer. The insulating encapsulant laterally surrounds the first semiconductor die and the second semiconductor die, wherein the insulating encapsulant includes a first portion sandwiched in between the first semiconductor die and the second semiconductor die, the first portion has a first recessed part adjacent to an edge of the first semiconductor die, and a second recessed part adjacent to an edge of the second semiconductor die. The redistribution layer is disposed on and electrically connected to the first semiconductor die and the second semiconductor die.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 6, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Chen Li, Sung-Chi Chang, Chin-Chuan Chang, Wei-Jhan Tsai, Hao-Wei Lin, Ying-Ching Shih
  • Publication number: 20250035730
    Abstract: A current sensing calibration method includes setting a first calibration current, inputting the first calibration current to a current sensing circuit for detecting a first real digital code, acquiring offset calibration data according to the first real digital code and a first ideal digital code corresponding to the first calibration current, setting a second calibration current and a third calibration current, inputting the second calibration current to the current sensing circuit for detecting a second real digital code, inputting the third calibration current to the current sensing circuit for detecting a third real digital code, acquiring gain calibration data according to the second real digital code, the third real digital code, a second ideal digital code, and a third ideal digital code, and acquiring channel temperature calibration data after the current sensing circuit is calibrated according to the offset calibration data and the gain calibration data.
    Type: Application
    Filed: February 20, 2024
    Publication date: January 30, 2025
    Applicant: HIMAX TECHNOLOGIES LIMITED
    Inventors: Te-Chieh Kung, Ming-Chia Chen, Hugo Cruz, Hao-Wei Lin
  • Publication number: 20110154698
    Abstract: A multimedia greeting card in accordance with the present invention has a base, a control circuit board, a screen, a speaker and a cover. The control circuit board and the speaker are mounted in the base, and the screen is mounted on the base. The screen and the speaker are electrically connected to the control circuit board. The cover is pivotally mounted on the base. People can record audio-visual information and store data in a storage unit of the control circuit board. When the multimedia greeting card is actuated, the multimedia information is presented by the screen and speaker.
    Type: Application
    Filed: December 28, 2009
    Publication date: June 30, 2011
    Inventor: Hao-Wei Lin
  • Patent number: 6336931
    Abstract: An automatic bone drilling apparatus for surgery operation uses a computer to control a hand tool drilling device to drill opening in skeleton. The computer has a fuzzy logic software to control the hand tool operation through a control box and a manual-automatic mode switch box. The hand tool drilling device may be securely mounted on the patient. Drilling location and size and depth may be precisely controlled to enhance surgical operation safety. It is particularly useful for drilling patient skeleton for brain surgery operation.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: January 8, 2002
    Inventors: Yeh-Liang Hsu, Shih-Tseng Lee, Chong-Fai Wang, Jia-Wen Chen, Hao-Wei Lin, Tsung-Cheng Huang