Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes photoelectric conversion elements. The solid-state image sensor also includes a mosaic pattern layer disposed above the photoelectric conversion elements. The mosaic pattern layer includes an infrared-passing segment and color filter segments disposed on the periphery of the infrared-passing segment. The solid-state image sensor further includes a first condensing structure disposed on the mosaic pattern layer. The infrared-passing segment and the color filter segments share the first condensing structure.

Abstract: Techniques for performing foreground analysis are provided. The techniques include identifying a region of interest in a video scene; detecting a static foreground object in the region of interest; and performing a foreground analysis based on tracking information to determine whether the static foreground object is abandoned or removed.

Abstract: Techniques for performing foreground analysis are provided. The techniques include identifying a region of interest in a video scene; detecting a static foreground object in the region of interest; and performing a foreground analysis based on tracking information to determine whether the static foreground object is abandoned or removed.

Abstract: Techniques for performing foreground analysis are provided. The techniques include identifying a region of interest in a video scene, detecting a static foreground object in the region of interest, and determining whether the static foreground object is abandoned or removed, wherein said determining comprises performing a foreground analysis based on tracking information and pruning one or more false alarms using one or more track statistics.

Abstract: An optoelectronic materials for OLED is represented by formula (I): wherein R1 is selected from a group consisting of formulas (II)-(VI): wherein R2 and R3 are identical and selected from a group consisting of formula (VII) and formula (VIII): The optoelectronic materials possesses superior luminescent performance and thermal stability and is suitable to be a new type of ambipolar materials for OLED elements.

Abstract: An optoelectronic materials for OLED is represented by formula (I): wherein R1 is selected from a group consisting of formulas (II)-(VI): wherein R2 and R3 are identical and selected from a group consisting of formula (VII) and formula (VIII): The optoelectronic materials possesses superior luminescent performance and thermal stability and is suitable to be a new type of ambipolar materials for OLED elements.

Abstract: Techniques for performing foreground analysis are provided. The techniques include identifying a region of interest in a video scene, detecting a static foreground object in the region of interest, and determining whether the static foreground object is abandoned or removed, wherein said determining comprises performing a foreground analysis based on tracking information and pruning one or more false alarms using one or more track statistics.

Abstract: Techniques are provided. The techniques include identifying a region of interest in a video scene, applying a background subtraction algorithm to the region of interest to detect a static foreground object in the region of interest, and determining whether the static foreground object is abandoned or removed, wherein determining whether the static foreground object is abandoned or removed comprises performing a foreground analysis based on edge energy and region growing, and pruning one or more false alarms using one or more track statistics.

Abstract: Techniques for performing foreground analysis are provided. The techniques include identifying a region of interest in a video scene, applying a background subtraction algorithm to the region of interest to detect a static foreground object in the region of interest, and determining whether the static foreground object is abandoned or removed, wherein determining whether the static foreground object is abandoned or removed comprises performing a foreground analysis based on edge energy and region growing, and pruning one or more false alarms using one or more track statistics.