Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A light emitting diode package structure and a method for manufacturing the same are provided. The LED package structure includes a substrate having a first and a second surface opposite to each other, a conductive structure including a first and a second conductive structure electrically connected with each other, a first gold layer disposed on the first conductive structure, a second gold layer disposed on the second conductive structure, an LED chip disposed on the first gold layer, and a package layer disposed on the first surface and encapsulating the first conductive structure, the first gold layer, and the LED chip. The first conductive structure is disposed on the first surface. The second conductive structure is disposed on the second surface. A thickness of the first gold layer is greater than 1 ?m. The second conductive structure is completely covered by the second gold layer.

Abstract: Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.

Abstract: A projector apparatus includes a light source for producing light beams, a micromirror device including an array of micromirrors for modulating and reflecting the light beams into image light beams, and a projection lens unit for magnifying and projecting the image light beams. The projection lens unit includes an optical lens disposed adjacent to the micromirror device, and a light shielding plate mounted on the optical lens or between the micromirror device and the optical lens for covering bias light so as to prevent formation of a ghost image in the projected image.

Abstract: A projector apparatus includes a light source for producing light beams, a micromirror device including an array of micromirrors for modulating and reflecting the light beams into image light beams, and a projection lens unit for magnifying and projecting the image light beams. The projection lens unit includes an optical lens disposed adjacent to the micromirror device, and a light shielding plate mounted on the optical lens or between the micromirror device and the optical lens for covering bias light so as to prevent formation of a ghost image in the projected image.