Patents by Inventor Hao-Wei Tseng

Hao-Wei Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12062742
    Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 13, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Hao-Wei Tseng, Chi-Hai Kuo, Jeng-Ting Li, Ying-Chu Chen, Pu-Ju Lin, Cheng-Ta Ko
  • Publication number: 20230231087
    Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.
    Type: Application
    Filed: March 7, 2022
    Publication date: July 20, 2023
    Inventors: Hao-Wei TSENG, Chi-Hai KUO, Jeng-Ting LI, Ying-Chu CHEN, Pu-Ju LIN, Cheng-Ta KO
  • Publication number: 20210019908
    Abstract: A method that enables building recognition via object detection and geospatial intelligence. The method includes detecting an object in an input image, wherein the object is located within a bounding area and extracting a physical location and a camera pose associated with the input image. The method also includes projecting a location coordinate of at least one entity onto the input image to obtain a projected point for the at least one entity, wherein the at least one entity is selected according to the physical location and camera pose associated with the input image and determining a nearest projected point to the bounding area. Finally, the method includes labeling the object within the bounding area with an entity name of the at least one entity associated with the nearest projected point.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 21, 2021
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Yan Zhang, Zhiqing Hong, Chun-Ting Wu, Simon L. Shapiro, Hao-Wei Tseng, Qing Zhang, Chih-Kai Wang