Abstract: A method can include receiving a low-resolution (LR) image, extracting a first feature embedding from the LR image, performing a first upsampling to the LR image by a first upsampling factor to generate a upsampled image, receiving a LR coordinate of a pixel within the LR image and a first cell size of the LR coordinate, generating a first residual image based on the first feature embedding, the LR coordinate, and the first cell size of the LR coordinate using a local implicit image function, and generating a first high-resolution (HR) image by combining the first residual image and the upsampled image via element-wise addition.

Abstract: A semiconductor structure includes a composite redistribution structure, a first interconnect device and an integrated circuit (IC) package component. The composite redistribution structure includes a first redistribution structure, a second redistribution structure and a third redistribution structure. The second redistribution structure is located between the first redistribution structure and the third redistribution structure. The first interconnect device is embedded in the second redistribution structure. The first interconnect device includes a plurality of metal connectors leveled with a surface of the second redistribution structure and electrically connected to the third redistribution structure. The IC package component is disposed over the third redistribution structure and electrically connected to the first interconnect device via the third redistribution structure.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

Abstract: The present disclosure provides a method of preparing mimicking angiogenic co-spheroids, including: co-cultring a neural related cell and a cultured cell on hyaluronan-grafted chitosan (CS-HA) substrates to form a co-spheroid of neural related cell/cultured cell, and encapsulating the co-spheroid of neural related cell/cultured cell into a hydrogel to form a mimicking angiogenic co-spheroid. The mimicking angiogenic co-spheroid of the present disclosure can be formed by 3D printing model as a 3D mini-neurovascular unit, which is applicated to a high-throughput angiogenesis screening platform.

Abstract: A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.

Abstract: Approaches described herein can capture an audio signal using at least one microphone while a user of an electronic device is determined to be asleep. At least one audio frame can be determined from the audio signal. The at least one audio frame represents a spectrum of frequencies detected by the at least one microphone over some period of time. One or more sounds associated with the at least one audio frame can be determined. Sleep-related information can be generated. The information identifies the one or more sounds as potential sources of sleep disruption.

Abstract: A heat dissipation structure includes a housing, a heat conduction sheet and a thin film. The housing includes a wall surface, which includes an accommodating groove, a supporting surface and an inclined surface. The accommodating groove is recessed on the supporting surface. The inclined surface is connected to the supporting surface, and is located on one side of the accommodating groove. The heat conduction sheet is accommodated in the accommodating groove, and a surface of the heat conduction sheet is in aligned with a surface of the supporting surface. The thin film covers the supporting surface, the heat conduction sheet and the inclined surface. An electronic device including the above housing and heat conduction sheet is further provided.

Abstract: A method for performing radio resource allocation in a TN-NTN mixed system is provided. The system includes a satellite that covers an NTN cell, and a plurality of TN base stations (TN BSs) within a coverage of the satellite. The NTN cell serves a plurality of NTN user equipments (NTN UEs). The method includes dividing the plurality of NTN UEs into X NTN UE groups; partitioning a radio resource into M parts, where M?X; dividing the plurality of TN BSs into M TN BS groups; deciding radio resource allocation regarding the plurality of NTN UEs, by allocating an i-th part of the radio resource to an i-th NTN UE group, where i=1, 2, . . . , X; and deciding radio resource allocation regarding the plurality of TN BSs, by allocating a sum of a j-th to an M-th parts of the radio resource to a j-th TN BS group, where j=1, 2, . . . , M.

Abstract: This disclosure provides a method, an apparatus, and a non-transitory computer-readable medium for radio resource allocation for a terrestrial network (TN) cell. In the method, the TN cell is determined to be outside a coverage of a first non-terrestrial network (NTN) cell. In response to the TN cell being outside the coverage of the first NTN cell, a radio resource is allocated to the TN cell based on a radio resource of the first NTN cell.

Abstract: A stylus used to interact with a plurality of positioning transmission electrodes includes a receiver and a demodulation circuit. The receiver receives an uplink signal carrying a plurality of positioning signals which are transmitted from the plurality of positioning transmission electrodes. The demodulation circuit, coupled to the receiver, demodulates the uplink signal to generate at least one positioning signal among the plurality of positioning signals.

Abstract: A method and system for accelerating the analysis of large-scale data reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the signal reference value is converted into a collected value according to a preset signal transformation ratio and correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.

Abstract: A method and an apparatus for dynamically determining a yaw control precision. The method comprises: during a predetermined time period, collecting a plurality of wind speed data and a plurality of wind direction data, and processing the collected plurality of wind speed data and plurality of wind direction data; on the basis of the processed wind speed data and wind direction data, establishing a model of the corresponding relationship between wind speed, wind direction angle change, yaw control precision, yaw fatigue, and power loss; and, on the basis of the current wind speed data, wind direction data, predetermined yaw fatigue range, and predetermined power loss range, by means of the corresponding relationship model, determining the yaw control precision corresponding to the current wind speed and current wind direction angle change.

Abstract: A method and system for accelerating analysis of large-scale data that reads a data packet from a queue, and after performing data processing on the data packet, a first high, middle, and low byte of the processed data packet is cyclically read; a preset signal reference value is read, and the preset signal reference value is converted into a collected value according to a preset signal transformation ratio and a correction factor; the collected value is converted into an integer value, and the integer value is split into a second high, middle, and low byte; and the first high, middle, and low byte of the processed data packet is compared with the second high, middle and low byte of the integer value in a preset way. A determination as to whether the data of the packet is abnormal or not is made based on the result of the comparison.

Abstract: A position sensing system, a method for acquiring a position sensing signal and an electronic device are provided. The position sensing system is provided with a first position sensing element and at least one second position sensing element. A first position sensing signal outputted by the first position sensing element in response to a predetermined signal is used as a correction signal for a second position sensing signal outputted by the second position sensing element, and the signal processing module corrects the second position sensing signal outputted by at least one of the second position sensing element based on the first position sensing signal and determines a target sensing signal based on at least one corrected second position sensing signal.

Abstract: A multiplexer (MUX) calibration system includes main MUX circuitry, first replica MUX circuitry, digital-to-analog (DAC) circuitry, detection circuitry, and control circuitry. The main MUX circuitry receives clock signals and outputs a first data signal based on the clock signals. The first replica MUX circuitry receives the clock signals and outputs a second data signal based on the clock signals. The DAC circuitry generates an offset voltage. The detection circuitry receives the second data signal and the offset voltage and generates a first error signal based on one or more of the second data signal and the offset voltage. The control circuitry receives the first error signal and generates a first control signal indicating an adjustment to the clock signals.

Abstract: A one-coil multi-core inductor-capacitor (LC) oscillator is provided. The one-coil multi-core LC oscillator includes a main coil and at least one mode suppression device. The main coil includes an outer wire and a central wire, wherein the outer wire is coupled to a first core circuit and a second core circuit, and the central wire is coupled between a first node and a second node of the outer wire. More particularly, an outer loop formed by the outer wire corresponds to a first mode of the one-coil multi-core LC oscillator, and inner loops formed by the outer wire and the central wire correspond to a second mode of the one-coil multi-core LC oscillator, where the at least one mode suppression device is configured to suppress one of the first mode and the second mode.

Abstract: A mirror assembly can include a housing, a mirror, and a light source. In some embodiments, the mirror comprises one or more adjustable sections. In certain embodiments, the mirror includes a light column configured to emit a substantially constant amount of light along a periphery of a mirror section. In some embodiments, the light column can produce various color temperatures. In some embodiments, the mirror assembly comprises a capacitive touch sensor that allows control of one or more features of the light emitted from the light source. In some embodiments, the mirror assembly includes a sensor assembly. The sensor assembly can be configured control on/off settings and other features of the emitted light.