Abstract: Disclosed herein is an injection molding method for making optical thermoplastic lenses using 3D-printed functional wafers. The method employs a variable injection molding cavity temperature that is heated to at least wafer Tg?10° C.

Abstract: The present invention relates to a pharmaceutical composition comprising at least one liposome and an antipsychotic drug with a high drug to lipid ratio and encapsulation efficiency. The pharmaceutical composition improves the pharmacokinetic profile and sustains the release of the antipsychotic drug. Also provided is the method for treating schizophrenia or bipolar disorder using the pharmaceutical composition disclosed herein.

Abstract: Provided is an anesthetic composition for locally administrating an amide-type anesthetic into a subject in need thereof. The anesthetic composition has multilamellar vesicles with entrapped amide-type anesthetic prepared by hydrating a highly entrapped lipid structure comprising an amide-type anesthetic and a lipid mixture with an aqueous buffer solution at a pH higher than 5.5. Also provided is a method to prepare an anesthetic composition using a simpler and more feasible process for large-scale manufacture and for providing a high molar ratio of amide-type anesthetic to phospholipid content as compared to the prior art. This anesthetic composition has a prolonged duration of efficacy adapted to drug delivery.

Abstract: The present invention relates to a pharmaceutical composition comprising at least one liposome and a therapeutic agent for treating an auto-immune disease with a high therapeutic agent to lipid ratio and a high encapsulation efficiency. The pharmaceutical composition improves the pharmacokinetic profile and sustains the release of the therapeutic agent. Also provided is the method for treating an auto-immune disease using the pharmaceutical composition disclosed herein.

Abstract: The present invention relates to pharmaceutical compositions comprising at least one liposome and a therapeutic agent for treating dementia with a high drug to lipid ratio and a high encapsulation efficiency. The pharmaceutical composition improves the pharmacokinetic profile and sustains the release of the therapeutic agent. Also provided is the method for treating dementia using the pharmaceutical composition disclosed herein.

Abstract: A location-related topic discussion system, an operating method, and a computer-readable recording medium are provided. The system includes a server having a topic-discussion database. In the server, the topic-discussion database is queried for obtaining one or more location-related discussion topics within a geographic range according to location information transmitted by a user device. The server then provides one or more location-related discussion-topic-category linking icons to the user device, and the one or more icons can be marked on a graphical user interface initiated by the user device. When a user selects one of location-related discussion-topic-category links, the server accordingly provides contents on a first layer topic-discussion page to be displayed by the user device. The first layer topic-discussion page includes multiple popularity-sorted topic-discussion areas and location-related discussion topic categories in accordance with personal preference of the user.

Abstract: The present disclosure includes optical articles comprising a film layer that has first and second film surfaces and is embossed such that the first film surface defines a plurality of concave optical elements and the second film surface defines a plurality of convex optical elements. The present optical articles can include one or more optical layers coupled to the film layer. Each of the optical layer(s) can encapsulate the concave optical elements or the convex optical elements.

Abstract: Systems, apparatus, articles of manufacture, and methods to generate customized customer messages are disclosed. An example method includes selecting a prompt template based on an intended purpose of the customized customer message and a type of communication of the customized customer message, generating a prompt based on the customer data for an identified customer and the prompt template, providing the prompt to a large language model to cause generation of the customized customer message, and causing transmission of the customized customer message.

Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.

Abstract: A lid for a tank which is stably supported at various angles when open includes a tank or box, the lid, and at least one supporting component. The interior of the box contains components which are immersed in coolant for example, the lid allowing access thereto. The lid is rotatably connected to the box and covers or exposes the interior. The one or more supporting components are connected to the lid and the box. The lengths of the supporting components which stably support the lid at certain angles can be changed, which makes it convenient and risk-free for an operator to access the interior under the open lid. An immersion cooling system is also disclosed.

Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.

Abstract: A method includes: forming first bond pads along a wafer; bonding a first die to a first set of the first bond pads, the first die being electrically connected to the wafer; depositing a gap-fill dielectric over the wafer and around the first die; forming openings in the gap-fill dielectric; forming first active through vias in physical contact with the second set of the first bond pads and first dummy through vias in physical contact with the third set of the first bond pads, the first active through vias being electrically connected to the wafer, the first dummy through vias being electrically isolated from the wafer; forming second bond pads along the first die, the first active through vias, and the first dummy through vias; and bonding a second die to the first die and to a first active via of the first active through vias.

Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.

Abstract: A method of manufacturing an optical lens (417, 901), comprising: obtaining (S301) a transparent thermoplastic (TP) carrier (410, 1210) with at least one smooth surface; printing (S305), via a 3-D printer on the side opposite to the at least one smooth surface of the transparent TP carrier (410, 1210), at least one transparent layer (420, 1220) using a thermoplastic filament (403), each transparent layer (420, 1220) having a predetermined light filtering property, thereby forming a functional layer (420, 1220); and performing (S307) an injection over-molding process (415) to fuse bond the functional layer (420, 1220) to a thermoplastic substrate thereby forming the optical lens, wherein the at least one smooth surface of the transparent TP carrier (410, 1210) forms a smooth surface of the manufactured optical lens (417, 901).

Abstract: Disclosed are optical elements and the methods of producing the same. The optical element contains two or more near infrared absorbers mixed in an optical substrate, and one or more functional film disposed on the optical substrate. The method of producing the optical element comprises mixing two near infrared absorbers with different near infrared wavelengths absorption ranges and residual colors with a precursor of an optical substrate. The mixture is subsequently processed to produce an optical element that has broad near infrared wavelength absorption range, a high near infrared absorption level, and/or homogeneous color distribution.

Abstract: The present disclosure relates to ophthalmic lenses for correction of myopia. In particular, the present disclosure relates to an ophthalmic lens, comprising a first layer having microstructures on a first surface of the first layer, the microstructures on the first surface of the first layer being formed in a pattern, a material of the first layer being a thermoplastic material; and a second layer formed on the first surface of the first layer, wherein a glass transition temperature of the first layer is higher than a glass transition temperature of the second layer.

Abstract: Disclosed herein is an injection molding method for making optical thermoplastic lenses using 3D—printed functional wafers. The method employs a variable injection molding cavity temperature that is heated to at least wafer Tg—10° C.

Abstract: The disclosure includes core-shell filament composition for additive manufacturing of ophthalmic lenses and ophthalmic lens components. The disclosure also includes a set of criteria for selecting core and shell thermoplastic combinations that exhibit high optical clarity, improved filament inter-strand diffusion, high inter-strand adhesion, and improved manufactured part strength when used in an additive manufacturing method like fused deposition modelling.

Abstract: A method of forming an optical lens includes providing a lens having microstructures on a surface thereof and an adhesive layer coated thereon; pressing a coating stack, via a carrier layer attached to a first surface of the coating stack by a release coating, against the adhesive layer, a second surface of the coating stack being in contact with the adhesive layer; and curing the adhesive layer and removing the carrier layer from the first surface of the coating stack via the release coating, wherein a thickness of the adhesive layer is greater than a depth of the microstructures on the surface of the lens.

Abstract: A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.