Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: An organic light-emitting device includes a first electrode, a first light-emitting layer, a first low work function layer, a second low work function layer, a conductive etching-resistant layer, a first hole-injection layer, a second light-emitting layer, and a second electrode. The first light-emitting layer is disposed over the first electrode. The first low work function layer is disposed over the first light-emitting layer. The second low work function layer is disposed over the first low work function layer, and a work function of the second low work function layer is greater than a work function of the first low work function layer. The conductive etching-resistant layer is disposed over the second low work function layer. The first hole-injection layer is disposed over the conductive etching-resistant layer. The second light-emitting layer is disposed over the first hole-injection layer. The second electrode is disposed over the second light-emitting layer.

Abstract: An organic light-emitting device includes a first electrode, a first light-emitting layer, a first low work function layer, a second low work function layer, a conductive etching-resistant layer, a first hole-injection layer, a second light-emitting layer, and a second electrode. The first light-emitting layer is disposed over the first electrode. The first low work function layer is disposed over the first light-emitting layer. The second low work function layer is disposed over the first low work function layer, and a work function of the second low work function layer is greater than a work function of the first low work function layer. The conductive etching-resistant layer is disposed over the second low work function layer. The first hole-injection layer is disposed over the conductive etching-resistant layer. The second light-emitting layer is disposed over the first hole-injection layer. The second electrode is disposed over the second light-emitting layer.

Abstract: A method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer.

Abstract: A method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer.

Abstract: A chemical mechanical polishing method is provided. The chemical mechanical polishing method includes steps of providing a plurality of semiconductor elements to be polished, obtaining a respective dimension of the each semiconductor element to be polished, and polishing the each semiconductor element according to the respective dimension thereof.

Abstract: An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a metallic plate, a spoke detecting device and a spindle motor PCB. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is supported on the metallic plate and having a notch such that a receptacle is defined by sidewalls of the notch and a surface of the metallic plate. The spoke detecting device is received in the receptacle such that the spoke detecting device is separated from the lightscribe disc by a specified gap.

Abstract: An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a spindle motor PCB and an insulating pad. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating pad is coupled with the spindle motor PCB for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap.

Abstract: An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a traverse assembly frame, a spindle motor PCB and an insulating base. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating base is coupled with the frame for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap.

Abstract: An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a traverse assembly frame, a spindle motor PCB and an insulating base. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating base is coupled with the frame for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap.