Abstract: The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member.

Abstract: A heat dissipation module assembled with a circuit board is disclosed. The heat dissipation module assembled comprises a fan and at least a heat sink. The fan comprises a frame and an impeller. The frame comprises a body and at least an extension, wherein the extension protrudes from at least a side of the body. The impeller is disposed in the body. The heat sink is coupled to the extension for dissipating heat produced from an electronic element disposed on the circuit board, wherein the heat sink is received in the extension and disposed on the electronic element.

Abstract: A heat dissipation module is disclosed. The heat dissipation module includes fan and at least a heat sink. The fan includes a frame and an impeller. The frame includes a body and at least an extension. The extension protrudes from at least a side of the body. The extension or the body is connected with the circuit board. The impeller is disposed in the body. The heat sink is connected with the extension for dissipating heat produced from the electronic element.

Abstract: The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member.

Abstract: A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an sidewall of the passage at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.

Abstract: A heat dissipation module is disclosed. The heat dissipation module includes fan and at least a heat sink. The fan includes a frame and an impeller. The frame includes a body and at least an extension. The extension protrudes from at least a side of the body. The extension or the body is connected with the circuit board. The impeller is disposed in the body. The heat sink is connected with the extension for dissipating heat produced from the electronic element.

Abstract: The invention provides a magnetic-positioning motor having a magnetic element or magnet disposed at the interior center of a rotor, so that attractive force between the magnetic element and a metallic stator can maintain a rotor at a predetermined position during fan rotation. Additionally, a magnetic element or magnet can be placed on a stator, so that attractive force between the magnetic element and a metallic rotor can maintain a rotor at a predetermined position during fan rotation to reduce vibration, flotation and friction between the shaft and bearing under high speed operation.

Abstract: A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an inner wall of the passage at at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.

Abstract: A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an inner wall of the passage at at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.

Abstract: A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an inner wall of the passage at at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.