Patents by Inventor Hao Xia

Hao Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150067411
    Abstract: Embodiments are directed to predicting the health of a computer node using health report data and to proactively handling failures in computer network nodes. In an embodiment, a computer system monitors various health indicators for multiple nodes in a computer network. The computer system accesses stored health indicators that provide a health history for the computer network nodes. The computer system then generates a health status based on the monitored health factors and the health history. The generated health status indicates the likelihood that the node will be healthy within a specified future time period. The computer system then leverages the generated health status to handle current or predicted failures. The computer system also presents the generated health status to a user or other entity.
    Type: Application
    Filed: November 10, 2014
    Publication date: March 5, 2015
    Inventors: Hao Xia, Todd F. Pfleiger, Mark C. Benvenuto, Ajay Kalhan
  • Patent number: 8887006
    Abstract: Embodiments are directed to predicting the health of a computer node using health report data and to proactively handling failures in database services. In an embodiment, a computer system monitors various health indicators for multiple nodes in a database cluster. The computer system accesses stored health indicators that provide a health history for the database cluster nodes. The computer system then generates a health status based on the monitored health factors and the health history. The generated health status indicates the likelihood that the node will be healthy within a specified future time period. The computer system then leverages the generated health status to handle current or predicted failures. The computer system also presents the generated health status to a user or other entity.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: November 11, 2014
    Assignee: Microsoft Corporation
    Inventors: Hao Xia, Todd F. Pfleiger, Mark C. Benvenuto, Ajay Kalhan
  • Publication number: 20140258229
    Abstract: A database associated with a primary database cluster may be replicated in a backup database cluster located in a different location in order to provide a highly-available fault tolerant database service. The databases are reconciled through a cluster management module distributed in each database cluster. The cluster management module uses a set of reconciliation data structures to track locally the reconciled states of each database in each database cluster, the operations made locally to the databases in each database cluster, and the author of the operations. The cluster management module in each database cluster engages in a stateless messaging protocol using the set of reconciliation data structures to determine whether or not the databases may be reconciled.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: Microsoft Corporation
    Inventors: Alexandre Verbitski, Hao Xia, Santeri Voutilainen, Tomas Talius, Michael Nelson, Sree Kuchibhotla, Vishrut Shah
  • Publication number: 20130105123
    Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated from electronic components having different heights. The heat dissipation device includes a base plate and a first heat absorbing member and a second heat absorbing member extending from a top side of the base plate and having different heights for contacting the electronic components having different heights.
    Type: Application
    Filed: October 17, 2012
    Publication date: May 2, 2013
    Inventors: CHUN-CHI CHEN, XUE-WEN PENG, WEI LI, HAO-XIA LIU
  • Patent number: 8381801
    Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 26, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Zhi-Yong Zhou, Ji-Yun Qin, Hao-Xia Liu
  • Publication number: 20130043006
    Abstract: A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.
    Type: Application
    Filed: December 24, 2011
    Publication date: February 21, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: XUE-WEN PENG, WEI LI, HAO-XIA LIU
  • Publication number: 20130020056
    Abstract: A heat dissipation device includes a base and a fin group fixed on the base. The base includes a container, a flattened heat pipe and a solid supporting member. The container includes a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween. The heat pipe and the supporting member are housed in the receiving chamber. Opposite sides of the heat pipe and the supporting member respectively abut against the baffle plate and the cover of the container.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 24, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: XUE-WEN PENG, WEI LI, JI-YUN QIN, HAO-XIA LIU
  • Publication number: 20120273168
    Abstract: An exemplary heat dissipation device includes a base and fasteners. The base includes a bottom plate, a top plate, a heat pipe, and a frame. The heat pipe is sandwiched between peripheries of the bottom plate and the top plate. The frame is sandwiched between the bottom plate and the top plate. The frame surrounds the heat pipe. The fasteners extend through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.
    Type: Application
    Filed: June 27, 2011
    Publication date: November 1, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: XUE-WEN PENG, WEI LI, JI-YUN QIN, HAO-XIA LIU
  • Publication number: 20120254669
    Abstract: Embodiments are directed to predicting the health of a computer node using health report data and to proactively handling failures in database services. In an embodiment, a computer system monitors various health indicators for multiple nodes in a database cluster. The computer system accesses stored health indicators that provide a health history for the database cluster nodes. The computer system then generates a health status based on the monitored health factors and the health history. The generated health status indicates the likelihood that the node will be healthy within a specified future time period. The computer system then leverages the generated health status to handle current or predicted failures. The computer system also presents the generated health status to a user or other entity.
    Type: Application
    Filed: April 4, 2011
    Publication date: October 4, 2012
    Applicant: MICROSOFT CORPORATION
    Inventors: Hao Xia, Todd F. Pfleiger, Mark C. Benvenuto, Ajay Kalhan
  • Publication number: 20100206522
    Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.
    Type: Application
    Filed: June 30, 2009
    Publication date: August 19, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: ZHI-YONG ZHOU, JI-YUN QIN, HAO-XIA LIU