Patents by Inventor Hao-Yu Yang

Hao-Yu Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130299855
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Application
    Filed: July 15, 2013
    Publication date: November 14, 2013
    Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hain-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
  • Patent number: 8497519
    Abstract: An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: July 30, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Ching-Yi Chen, Yu-Sheng Tang, Hao-Yu Yang, Hsin-Hung Chen, Tzu-Wen Shih
  • Patent number: 8486724
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: July 16, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
  • Publication number: 20120299017
    Abstract: An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.
    Type: Application
    Filed: May 24, 2011
    Publication date: November 29, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Yi CHEN, Yu-Sheng TANG, Hao-Yu YANG, Hsin-Hung CHEN, Tzu-Wen SHIH
  • Publication number: 20120299018
    Abstract: A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.
    Type: Application
    Filed: May 24, 2011
    Publication date: November 29, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Yi CHEN, Hao-Yu YANG
  • Publication number: 20120249925
    Abstract: A radiation device is disclosed. The device includes a light cavity including a top surface, a bottom surface, and side walls. A light source array including at least one light source is formed on a first side wall. The device also includes a reflective coating formed on at least the bottom surface. The top surface allows light transmission and includes a light conversion layer.
    Type: Application
    Filed: March 28, 2011
    Publication date: October 4, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Hao-Yu Yang
  • Publication number: 20120097986
    Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
    Type: Application
    Filed: October 22, 2010
    Publication date: April 26, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hao-Wei KU, Chung Yu WANG, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai