Patents by Inventor Hao Yuan

Hao Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958015
    Abstract: A dual-purpose household water purifier includes a main unit and an expansion unit which can be detachably connected. When the main unit is connected with the expansion unit, a booster pump can pressurize tap water entering a filter assembly. In the dual-purpose household water purifier, the main unit can be used as a non-electric drive water purifier. After the tap water enters the filter assembly and is filtered. The purified water flows into the purified water chamber of the pressure bucket, and the user takes the purified water. It is further provided an expansion unit. When the main unit is connected to the expansion unit, the booster pump can pressurize the pipeline, reducing application environmental restrictions on the water purifier. Through arrangement of the expansion unit, the water purifier can be operated in two operation modes of non-electric drive mode and electric drive mode.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: April 16, 2024
    Assignee: YUNDA H&H TECH (Tianjin) CO., LTD.
    Inventors: Enyu Wei, Yinping Yuan, Hao Xu, Xu Yang
  • Patent number: 11953740
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Publication number: 20240114359
    Abstract: Apparatus and methods are provided for AI-ML model storage and transfer in the wireless network. In one novel aspect, the AI-ML model is stored at the AI server and transferred through the user plane (UP). In one embodiment, UE downloads the AI-ML model from the AI server through the UP connection. In one embodiment, the AI-ML model is updated at the RAN node, and the UE downloads the AI-ML model through the AI server. In another embodiment, the AI-ML model is updated at the UE, and the UE uploads the AI-ML model to the AI server through the UP connection. In another embodiment, the UE uploads the AI-ML model to the RAN through the AI server. In one embodiment, the UE mobility triggers the AI-ML model transfer. In one novel aspect, the AI dataset is shared and transferred among different entities through the UP connection or a new AI plane.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 4, 2024
    Inventors: Ta-Yuan Liu, Hao Bi, CHIA-CHUN HSU
  • Patent number: 11947173
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11948983
    Abstract: A SiC ohmic contact preparation method is provided and includes: selecting a SiC substrate; preparing a graphene/SiC structure by forming a graphene on a Si-face of the SiC substrate; depositing an Au film on the graphene of the graphene/SiC structure; forming a first transfer electrode pattern on the Au film by a first photolithography; etching the Au film uncovered by the first transfer electrode pattern through a wet etching; etching the graphene uncovered by the Au film through a plasma etching after the wet etching; forming a second transfer electrode pattern on the SiC substrate by a second photolithography; depositing an Au material on the Au film exposed by the second transfer electrode pattern and forming an Au electrode and then annealing. The graphene reduces potential barrier associated with the SiC interface, specific contact resistance of ohmic contact reaches the order of 10?7˜10?8 ?·cm2, and the method has high repeatability.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: April 2, 2024
    Inventors: Yanfei Hu, Hui Guo, Yuming Zhang, Jiabo Liang, Yanjing He, Hao Yuan, Yuting Ji
  • Patent number: 11942272
    Abstract: A method for preparing an aramid fiber electrochemical capacitor includes (1) immersing aramid fiber bundles in an aqueous solution; (2) adding polyvinylpyrrolidone into a silver ammonia solution to obtain a solution C, adding an aqueous glucose solution to the solution C to obtain aramid fiber bundles coated with silver nanoparticles; (3) adding the aramid fiber bundles into an aqueous solution containing ?-(2,3-glycidoxy) propyltrimethoxysilane; (4) adding the aramid fiber bundles coated by silver nanoparticles with epoxy groups into an ethanol containing carbon nanotubes with carboxyl groups; (5) adding the aramid fiber bundles with two-layered coatings into an aqueous solution containing pyrrole; (6) heating a mixture of a polyvinyl alcohol, an acid, and water to obtain a polyvinyl alcohol gel, immersing two strands of the aramid fiber bundles, carbon nanotubes and silver nanoparticle in the polyvinyl alcohol gel, and twisting the two strands together to obtain the aramid fiber electrochemical capacitor.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: March 26, 2024
    Inventors: Aijuan Gu, Hao Fang, Guozheng Liang, Li Yuan
  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Publication number: 20240084432
    Abstract: The disclosure provides a method for heat-treating a boron steel, which includes: carburizing a boron steel on a surface thereof to obtain a carburized boron steel; austenitizing the carburized boron steel at a temperature of 885-895° C. for 25-35 min, to obtain an austenitized boron steel; sequentially subjecting the austenitized boron steel to an oil quenching and a tempering, wherein the oil quenching is performed at a temperature of 55-65° C. for 29-31 min.
    Type: Application
    Filed: November 3, 2021
    Publication date: March 14, 2024
    Inventors: Yulin JU, Xiaonong CHENG, Zhizhong YUAN, Shun GUO, Rui LUO, Fuyang CAO, Hao HUANG
  • Publication number: 20240084121
    Abstract: A mechanically and piezoelectrically anisotropic polymer article is formed from a crystallizable fluoropolymer and a nucleating agent. The polymer article may be a thin film or a fiber, for example. A crystalline phase may constitute at least approximately 50% of the polymer article. In certain examples, a fluoropolymer may include vinylidene fluoride, trifluoroethylene, chlorotrifluoroethylene, hexafluoropropylene, and vinyl fluoride. The polymer article may include up to approximately 10 wt. % of the nucleating agent. Such a polymer article is optically transparent, has an elastic modulus of at least approximately 3 GPa, and an electromechanical coupling factor (k31) of at least approximately 0.15.
    Type: Application
    Filed: February 27, 2023
    Publication date: March 14, 2024
    Inventors: Sheng Ye, Jinghui Yang, Rui Jian, Hao Mei, Andrew John Ouderkirk, Christopher Yuan Ting Liao, Stephen Hsieh, Alexander Keener, Jonathan Robert Peterson
  • Publication number: 20240071833
    Abstract: The present disclosure relates to a semiconductor device with a hybrid fin-dielectric region. The semiconductor device includes a substrate, a source region and a drain region laterally separated by a hybrid fin-dielectric (HFD) region. A gate electrode is disposed above the HFD region and the HFD region includes a plurality of fins covered by a dielectric and separated from the source region and the drain region by the dielectric.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Yi-Huan Chen, Huan-Chih Yuan, Yu-Chang Jong, Scott Yeh, Fei-Yun Chen, Yi-Hao Chen, Ting-Wei Chou
  • Publication number: 20240070308
    Abstract: Embodiments of the present disclosure relate to a permission setting method and apparatus, a device, and a medium. The method includes: displaying a permission customization control, in response to a trigger operation on a permission setting object of task information, the permission setting object including a first information object and/or a second information object, the second information object being subordinate to the first information object; displaying a permission editing interface, in response to a trigger operation on the permission customization control, and receiving customization permission information via the permission editing interface; and displaying the customization permission information corresponding to the permission setting object. Therefore, a hierarchy structure based on the task information satisfies a setting need for content-based permission customization, and improves a permission management efficiency.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 29, 2024
    Inventors: Wenzong MA, Liang CHEN, Yingtao LIU, Wei REN, Qiushuo HUANG, Yuejiang YUAN, Hao HUANG, Jianhui WU, Yalong ZOU, Linghui ZHOU, Mengzhang WU, Yanhui ZHAO, Xinlei GUO
  • Publication number: 20240069975
    Abstract: Resource optimized forwarding of classified requests to different instances of a microservice is provided. The process includes obtaining classified requests to a microservice. The classified requests are classified based on different microservice resource consumption types. Further, the method includes forwarding the classified requests to instances of the microservice with different assigned resource configurations. The forwarding is based on the different microservice resource consumption types of the classified requests.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Hao SHENG, Rong FU, Pan LI, Xiao Lin SUN, Yao CHEN, Qing Yuan MENG
  • Publication number: 20240070858
    Abstract: A capsule endoscope image recognition method based on deep learning, and a device and a medium is provided. After a plurality of frames of continuously captured images are processed to form an image sequence of a specific format, multi-channel recognition is performed on the plurality of frames of images by means of a 3D convolutional neural network model, and a recognition result is then output in combination with a recognition probability of each channel, such that the image recognition precision is improved.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 29, 2024
    Inventors: Hang ZHANG, Hao ZHANG, Wenjin YUAN, Chukang ZHANG, Hui LIU, Zhiwei HUANG
  • Patent number: 11883142
    Abstract: As shown in FIG. 1 and FIG. 2, the health monitoring system 100 of one embodiment includes an electromagnetic transmitter 110 configured to transmit an electromagnetic signal towards a target body region on a user; an electromagnetic receiver 120 configured to receive reflected energy from a target body region on a user; a calibration sensor 130 that measures reference cardiovascular-related parameters of a user (such as vessel pressure, stiffness, or motion); and an activity sensor 140 configured to detect the activity state of a user. The system also includes an attachment mechanism 150 for fixing the electromagnetic transmitter, electromagnetic receiver, calibration sensor and activity sensor to the user; and a stand-off mechanism 160 for fixing the electromagnetic transmitter and electromagnetic receiver at a known standoff distance from a target body region on the user.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: January 30, 2024
    Inventors: Oliver Hao-Yuan Shay, Jessi E. Johnson, Lillian Lei Dai
  • Publication number: 20240028062
    Abstract: An alert device includes a button assembly and an alert switch. The button assembly includes a casing and a button. The casing has a first through hole and a plurality of second through holes. The button includes a pressed part, an activation part and a plurality of hook parts. The pressed part has a central portion and a non-central portion, the non-central portion is connected to the central portion, the activation part is connected to the central portion, the plurality of hook parts are connected to the non-central portion, the activation part is disposed through the first through hole, and each of the plurality of hook parts is respectively disposed through each of the plurality of second through holes and is connected to the casing. The alert switch is disposed corresponding to the activation part.
    Type: Application
    Filed: December 2, 2022
    Publication date: January 25, 2024
  • Publication number: 20230404418
    Abstract: A wearable health monitoring system includes one or more RF electromagnetic transmitters (30-300 GHz) configured to transmit RF signals towards the skin over the artery of a user, one or more RF electromagnetic receivers configured to receive a reflected RF signals from a target body region on a user. A system has an attachment mechanism and standoff mechanism position the one or more RF transmitters and receivers relative to the target body region on the user at a known stand-off distance. The reflected signals and the transmitted signal are use to create an Intermediate Frequency signal which is used to determine a composite waveform via Principal Component Analysis, or other Dimensionality Reduction technique.
    Type: Application
    Filed: June 21, 2023
    Publication date: December 21, 2023
    Inventors: Jessi E. Johnson, Oliver Hao-Yuan Shay, Elizabeth Anne Gomes
  • Publication number: 20230323099
    Abstract: A polypropylene composition, a preparation method therefor, and an article made therefrom, the polypropylene composition comprising: (a) 70-95% by weight of a crystalline homo-polypropylene having a isotactic pentad fraction of 96% or more and forming a continuous matrix phase in the polypropylene composition; (b) 5-30% by weight of an ethylene-propylene elastic copolymer containing 20-35% by weight of an ethylene structure unit and 65-80% by weight of a propylene structure unit, and forming a dispersed rubber phase in the continuous matrix phase, such that the rubber phase can at least partially deform under an orientation force and form an orientation state structure, wherein the ratio of melt mass flow rate measured at 230° C. and a 2.16 kg load of the crystalline homo-polypropylene and the polypropylene composition is 0.5-2.0.
    Type: Application
    Filed: August 20, 2021
    Publication date: October 12, 2023
    Inventors: Xiaomeng ZHANG, Wenbo SONG, Fasheng ZOU, Huijie HU, Dezhan LI, Lusheng WANG, Mengyao ZHAO, Qi ZHANG, Zhenjie LIU, Hao YUAN
  • Patent number: D1015794
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: February 27, 2024
    Assignee: YUNDA H&HTECH (Tianjin) CO., LTD.
    Inventors: Enyu Wei, Yinping Yuan, Hao Xu, Xu Yang
  • Patent number: D1016864
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: March 5, 2024
    Assignee: YUNDA H&HTECH (Tianjin) CO., LTD.
    Inventors: Enyu Wei, Xu Yang, Hao Xu, Yinping Yuan