Abstract: In an embodiment, a method includes: forming a fin extending from a substrate; forming a first gate mask over the fin, the first gate mask having a first width; forming a second gate mask over the fin, the second gate mask having a second width, the second width being greater than the first width; depositing a first filling layer over the first gate mask and the second gate mask; depositing a second filling layer over the first filling layer; planarizing the second filling layer with a chemical mechanical polish (CMP) process, the CMP process being performed until the first filling layer is exposed; and planarizing the first filling layer and remaining portions of the second filling layer with an etch-back process, the etch-back process etching materials of the first filling layer, the second filling layer, the first gate mask, and the second gate mask at the same rate.

Abstract: An electrical assembly includes a system board and a power board closely arranged with each other in a parallel relation. An electronic package and a system connector are mounted upon an upper surface of the system board. A power connector and a set of connector units are mounted on an undersurface of the power board. Another set of connector units are formed on an upper surface of the electronic package. A heat sink is positioned upon the power board and contacts the electronic package via a center opening in the power board. After assembled, the power supply is provide through connection between the two sets of the connector units and that between the system connector and the power connector.

Abstract: A system controls a flow of a chemical mechanical polish (CMP) slurry into a chamber to form a slurry reservoir within the chamber. Once the slurry reservoir has been formed within the chamber, the system moves a polishing head to position and force a surface of a wafer that is attached to the polishing head into contact with a polishing pad attached to a platen within the chamber. A wafer/pad interface is formed at the surface of the wafer forced into contact with the polishing pad and the wafer/pad interface is disposed below an upper surface of the slurry reservoir. During CMP processing, the system controls one or more of a level, a force, and a rotation of the platen, a position, a force and a rotation of the polishing head to conduct the CMP processing of the surface of the wafer at the wafer/pad interface.

Abstract: An equalizer system includes at least one equalizer configured to equalize an input signal to generate an equalized input signal; a limiting amplifier coupled to the at least one equalizer, and configured to amplify the equalized input signal to a saturated level to generate an output signal; and a control circuit coupled to the at least one equalizer and the limiting amplifier, and configured to generate at least one control signal to the at least one equalizer according to the equalized input signal to adjust a peak gain of the at least one equalizer, wherein the peak gain of the at least one equalizer is at a Nyquist frequency.

Abstract: A roller assembly for a mobile cleaning system for cleaning a work surface can include a drive shaft, a sheath, a bushing, and a bushing shroud. The drive shaft can be rotatable about a drive axis, and the drive shaft can include a driven end and an opposite bushing end. The sheath can be supported by the drive shaft and the sheath can be rotatable with the drive shaft. The sheath can include a shell engageable with the work surface. The bushing can be located about the bushing end of the drive shaft. The bushing shroud can be connected to the bushing. The sheath and the drive shaft can be together rotatable with respect to the bushing and the bushing shroud, the bushing shroud can include an outer portion defining a first radius of curvature and a recessed portion connected to the outer portion.

Abstract: A system controls a flow of a chemical mechanical polish (CMP) slurry into a chamber to form a slurry reservoir within the chamber. Once the slurry reservoir has been formed within the chamber, the system moves a polishing head to position and force a surface of a wafer that is attached to the polishing head into contact with a polishing pad attached to a platen within the chamber. A wafer/pad interface is formed at the surface of the wafer forced into contact with the polishing pad and the wafer/pad interface is disposed below an upper surface of the slurry reservoir. During CMP processing, the system controls one or more of a level, a force, and a rotation of the platen, a position, a force and a rotation of the polishing head to conduct the CMP processing of the surface of the wafer at the wafer/pad interface.

Abstract: An electrical assembly includes a system board and a power board closely arranged with each other in a parallel relation. An electronic package and a system connector are mounted upon an upper surface of the system board. A power connector and a set of connector units are mounted on an undersurface of the power board. Another set of connector units are formed on an upper surface of the electronic package. A heat sink is positioned upon the power board and contacts the electronic package via a center opening in the power board. After assembled, the power supply is provide through connection between the two sets of the connector units and that between the system connector and the power connector.

Abstract: A system controls a flow of a chemical mechanical polish (CMP) slurry into a chamber to form a slurry reservoir within the chamber. Once the slurry reservoir has been formed within the chamber, the system moves a polishing head to position and force a surface of a wafer that is attached to the polishing head into contact with a polishing pad attached to a platen within the chamber. A wafer/pad interface is formed at the surface of the wafer forced into contact with the polishing pad and the wafer/pad interface is disposed below an upper surface of the slurry reservoir. During CMP processing, the system controls one or more of a level, a force, and a rotation of the platen, a position, a force and a rotation of the polishing head to conduct the CMP processing of the surface of the wafer at the wafer/pad interface.

Abstract: A universal tuning module may include an oscillator, a first tuner configured to process a first television signal, a second tuner configured to process a second television signal, a first switch configured to pass its input containing information associated with an output of the oscillator to said first tuner, and a second switch configured to pass its input containing information associated with the output of the oscillator to the second tuner.

Abstract: Provided is a cooperative multimedia communication system. The source node includes a first hierarchical modulation constellation diagram, modulates two data streams and transmits a first signal and a second signal. The relay node includes a protection-level-exchanging modulation and a second hierarchical modulation constellation diagram, modulates the second signal to generate a third signal and transmits the third signal. The destination node receives the first signal and the third signal and performs optimal decoding. The present disclosure designs a pair of optimal hierarchical constellation diagrams respectively for the source node and the relay node. Moreover, the present disclosure further provides a cooperative multimedia communication method.

Abstract: Provided is a cooperative multimedia communication system. The source node includes a first hierarchical modulation constellation diagram, modulates two data streams and transmits a first signal and a second signal. The relay node includes a protection-level-exchanging modulation and a second hierarchical modulation constellation diagram, modulates the second signal to generate a third signal and transmits the third signal. The destination node receives the first signal and the third signal and performs optimal decoding. The present disclosure designs a pair of optimal hierarchical constellation diagrams respectively for the source node and the relay node. Moreover, the present disclosure further provides a cooperative multimedia communication method.

Abstract: An electrical connector assembly, adapted for electrically connecting an IC package to a printed circuit board, includes a first housing used for soldering on the printed circuit board and a frame surrounding the first housing. The first housing includes a longitudinal body and a protrusion projecting forwardly from the body. The frame defines a base and two supporting arms extending from two ends of the base, each supporting arm defines a latching bent from a top edge of a free end thereof for locking the protrusion of the first housing. The electrical connector assembly includes a longitudinal holding member, the holding member has two ends respectively connecting to the free ends of said two supporting arms so that the dimension of the opening formed between the free ends of said two supporting arms is fixed.

Abstract: An integrated multi-user satellite receiver includes: a single-chip, and the single-chip includes: a first synthesizer for generating a first oscillating signal having a first frequency; a first frequency multiplier for generating a second oscillating signal having a second frequency according to the first oscillating signal; a second synthesizer for generating a third oscillating signal having a third frequency; and a second frequency multiplier for generating a fourth oscillating signal having a fourth frequency according to the third oscillating signal; wherein the single-chip generates a first down-converted signal according to a first satellite signal and the second oscillating signal, generates a second down-converted signal according to the first satellite signal and the fourth oscillating signal, generates a third down-converted signal according to a second satellite signal and the second oscillating signal, and generates a fourth down-converted signal according to the second satellite signal and the

Abstract: An electrical connector assembly, adapted for electrically connecting an IC package or module to a printed circuit board, includes a metallic bracket surrounding a stationary electrical connector which is mounted upon the printed circuit board. A module equipped with another electrical connector is positioned upon and removably assembled to the stationary electrical connector. A locking/ejecting member is pivotally mounted upon the bracket to releasably lock the module in position. A retention lever is pivotally mounted upon the bracket to prevent the locking/ejecting member from inadvertently or mistakenly unlatching the locking member from the module.

Abstract: An LED light core structure, which has better mechanical strength and good heat dissipation effect and is able to 360-degree project light. The LED light core structure includes a substrate having at least two faces. The substrate is formed with at least one opening communicating the two faces. LEDs are disposed on at least one of the two faces of the substrate at the opening, whereby the light emitted from the LEDs disposed on one of the two faces of the substrate can be projected through the opening to the opposite face of the substrate. Accordingly, the substrate can be made of metal material, whereby the substrate is unlikely to crack so that the ratio of good products is increased and the substrate can provide excellent heat dissipation effect for the LEDs. The conventional wolfram filament electrodes can be directly replaced with the LED light core structure.

Abstract: An integrated multi-user satellite receiver includes: a single-chip, and the single-chip includes: a first synthesizer for generating a first oscillating signal having a first frequency; a first frequency multiplier for generating a second oscillating signal having a second frequency according to the first oscillating signal; a second synthesizer for generating a third oscillating signal having a third frequency; and a second frequency multiplier for generating a fourth oscillating signal having a fourth frequency according to the third oscillating signal; wherein the single-chip generates a first down-converted signal according to a first satellite signal and the second oscillating signal, generates a second down-converted signal according to the first satellite signal and the fourth oscillating signal, generates a third down-converted signal according to a second satellite signal and the second oscillating signal, and generates a fourth down-converted signal according to the second satellite signal and the

Abstract: An integrated multi-user satellite receiver includes: a single-chip, and the single-chip includes: a first synthesizer for generating a first oscillating signal having a first frequency; a first frequency multiplier for generating a second oscillating signal having a second frequency according to the first oscillating signal; a second synthesizer for generating a third oscillating signal having a third frequency; and a second frequency multiplier for generating a fourth oscillating signal having a fourth frequency according to the third oscillating signal; wherein the single-chip generates a first down-converted signal according to a first satellite signal and the second oscillating signal, generates a second down-converted signal according to the first satellite signal and the fourth oscillating signal, generates a third down-converted signal according to a second satellite signal and the second oscillating signal, and generates a fourth down-converted signal according to the second satellite signal and the

Abstract: An electrical connector assembly, adapted for electrically connecting an IC package or module to a printed circuit board, includes a metallic bracket surrounding a stationary electrical connector which is mounted upon the printed circuit board. A module equipped with another electrical connector is positioned upon and removably assembled to the stationary electrical connector. A locking/ejecting member is pivotally mounted upon the bracket to releasably lock the module in position. A retention lever is pivotally mounted upon the bracket to prevent the locking/ejecting member from inadvertently or mistakenly unlatching the locking member from the module.

Abstract: An electrical connector assembly, adapted for electrically connecting an IC package to a printed circuit board, includes a first housing used for soldering on the printed circuit board and a frame surrounding the first housing. The first housing includes a longitudinal body and a protrusion projecting forwardly from the body. The frame defines a base and two supporting arms extending from two ends of the base, each supporting arm defines a latching bent from a top edge of a free end thereof for locking the protrusion of the first housing. The electrical connector assembly includes a longitudinal holding member, the holding member has two ends respectively connecting to the free ends of said two supporting arms so that the dimension of the opening formed between the free ends of said two supporting arms is fixed.

Abstract: An electrical connector includes an insulative housing defining a base portion and a mating tongue forwardly extending from the base portion, and a plurality of terminals insert molded in the housing. Each of the terminals defines a horizontal portion with a contacting section exposed upon the mating tongue, a tail portion bending out of the base portion, and a retaining section disposed between the horizontal portion and the tail portion and fully embedded within the base portion without exposure. The horizontal portion is provided in a rectangular shape, and at least a portion of the retaining section is provided in a round shape to provide good waterproof function with lower cost.