Patents by Inventor Haobo Li
Haobo Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250125307Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.Type: ApplicationFiled: December 18, 2024Publication date: April 17, 2025Applicant: Intel CorporationInventors: Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade, Xavier Francois Brun, Yonggang Li, Suddhasattwa Nad, Bohan Shan, Haobo Chen, Gang Duan
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Publication number: 20250112175Abstract: Various techniques for edge stress reduction in glass cores and related devices and methods are disclosed. In one example, a microelectronic assembly includes a glass core having a bottom surface, a top surface opposite the bottom surface, and one or more sidewalls extending between the bottom surface and the top surface, and further includes a panel of an organic material, wherein the glass core is embedded within the panel. In another example, a microelectronic assembly includes a glass core as in the first example, where an angle between a portion of an individual sidewall and one of the bottom surface or the top surface is greater than 90 degrees. In yet another example, a microelectronic assembly includes a glass core as in the first example, and further includes a pattern of a material on one of the one or more sidewalls.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Intel CorporationInventors: Brandon C. Marin, Jesse C. Jones, Yosef Kornbluth, Mitchell Page, Soham Agarwal, Fanyi Zhu, Shuren Qu, Hanyu Song, Srinivas V. Pietambaram, Yonggang Li, Bai Nie, Nicholas Haehn, Astitva Tripathi, Mohamed R. Saber, Sheng Li, Pratyush Mishra, Benjamin T. Duong, Kari Hernandez, Praveen Sreeramagiri, Yi Li, Ibrahim El Khatib, Whitney Bryks, Mahdi Mohammadighaleni, Joshua Stacey, Travis Palmer, Gang Duan, Jeremy Ecton, Suddhasattwa Nad, Haobo Chen, Robin Shea McRee, Mohammad Mamunur Rahman
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Publication number: 20250112136Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
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Publication number: 20250112085Abstract: An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Intel CorporationInventors: Bohan Shan, Ziyin Lin, Haobo Chen, Yiqun Bai, Kyle Arrington, Jose Waimin, Ryan Carrazzone, Hongxia Feng, Dingying Xu, Srinivas Pietambaram, Minglu Liu, Seyyed Yahya Mousavi, Xinyu Li, Gang Duan, Wei Li, Bin Mu, Mohit Gupta, Jeremy Ecton, Brandon C. Marin, Xiaoying Guo, Ashay Dani
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Publication number: 20250113434Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface, and the substrate is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, where the opening comprises a sidewall that is non-orthogonal with the first surface of the substrate. In an embodiment a corner at a junction between the sidewall and the first surface is rounded. In an embodiment, a via is provided in the opening, where the via is electrically conductive.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Inventors: Bai NIE, Mitchell PAGE, Junxin WANG, Srinivas Venkata Ramanuja PIETAMBARAM, Haifa HARIRI, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Hongxia FENG, Haobo CHEN, Bohan SHAN, Hiroki TANAKA, Leonel R. ARANA, Yonggang Yong LI
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Publication number: 20250106983Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Inventors: Bohan SHAN, Kyle ARRINGTON, Dingying David XU, Ziyin LIN, Timothy GOSSELIN, Elah BOZORG-GRAYELI, Aravindha ANTONISWAMY, Wei LI, Haobo CHEN, Yiqun BAI, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Bin MU, Mohit GUPTA, Jeremy D. ECTON, Brandon C. MARIN, Xiaoying GUO, Ashay DANI
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Publication number: 20250059841Abstract: A coring tool, a coring method, and use thereof are provided. The coring tool has a differential device for selective force transmission and a core gripping device for core cutting operations arranged within the housing. The core gripping device has a retractable core gripper, a slip-collar type core gripper and a shielding mechanism. The shielding mechanism is configured to be actuated by the differential device, so that the slip-collar type core gripper is shielded during coring operation and a first core cutting operation to avoid accidental core cutting operation, and to be exposed during a second core cutting operation to complete the whole core cutting operation.Type: ApplicationFiled: December 27, 2022Publication date: February 20, 2025Inventors: Zhongshuai CHEN, Xueliang PEI, Zhonghua WU, Zhihe LIU, Feng LIU, Wei ZHUANG, Renlei NING, Kai GAO, Guiting WANG, Haobo LI
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Publication number: 20250062141Abstract: A method includes placing a wafer in a process bath filled with a process solution; determining whether the wafer is in the process bath after a pre-set process time after placing the wafer in the process bath; and in response the determination determines that the wafer is in the process bath after the pre-set process time, draining the process solution from the process bath while the wafer is in the process bath.Type: ApplicationFiled: August 31, 2023Publication date: February 20, 2025Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITEDInventors: Jie CHEN, Chuang LI, Qiang SU, Haobo NI
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Publication number: 20230287427Abstract: The disclosure provides compositions comprising an inhibitory nucleic acid targeting IncExACTI, and methods of use thereof to improve cardiac function in a subject in need thereof. Specifically, the disclosure provides a cardiac long noncoding RNA (IncRNA), referred as IncExACT 1 (SEQ ID NO: 1), and inhibitory nucleic acids targeting IncExACT 1 for reducing expression of IncExACT 1 and/or Dachsous cadherin-related 2 (DCHS2) in a cell, e.g., a cell in a subject for improving cardiac function in a subject, wherein the subject has pathological cardiac hypertrophy and/or heart failure.Type: ApplicationFiled: July 29, 2021Publication date: September 14, 2023Inventors: Anthony Rosenzweig, Haobo Li
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Patent number: 11254398Abstract: A porous-structure device includes a semi-submersible platform consisting of four columns, two pontoons, two horizontal supports and a deck. Fillets on middle portions of the columns have a square section, a radius of the fillets, close to the deck and the pontoons, of the columns is gradually decreased to 0, a porous device is disposed outside each column and is formed by combining and connecting four single components, and each single component is formed by combining and connecting a plurality of porous laminated plates and a plurality of connecting pieces. The parameters, such as the pore type, porosity, number of layers, interlayer spacing and installation height, of the porous laminated plates are set according to the wave characteristics in different sea areas.Type: GrantFiled: July 21, 2020Date of Patent: February 22, 2022Assignee: SHANGHAI JIAO TONG UNIVERSITYInventors: Longfei Xiao, Zhichao Fang, Haobo Li, Yufeng Kou, Mingyue Liu, Handi Wei, Guocheng Zhao
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Publication number: 20200346722Abstract: A porous-structure device includes a semi-submersible platform consisting of four columns, two pontoons, two horizontal supports and a deck. Fillets on middle portions of the columns have a square section, a radius of the fillets, close to the deck and the pontoons, of the columns is gradually decreased to 0, a porous device is disposed outside each column and is formed by combining and connecting four single components, and each single component is formed by combining and connecting a plurality of porous laminated plates and a plurality of connecting pieces. The parameters, such as the pore type, porosity, number of layers, interlayer spacing and installation height, of the porous laminated plates are set according to the wave characteristics in different sea areas.Type: ApplicationFiled: July 21, 2020Publication date: November 5, 2020Applicant: SHANGHAI JIAO TONG UNIVERSITYInventors: Longfei XIAO, Zhichao FANG, Haobo LI, Yufeng KOU, Mingyue LIU, Handi WEI, Guocheng ZHAO
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Publication number: 20120209631Abstract: A computer system for processing of data related to a permanent life insurance policy includes a data storage device storing data indicative of a policy owner, an insured under the policy, and a death benefit amount, payable under the policy to a beneficiary upon death of the insured, and a processor in communication with the data storage device. A withdrawal benefit providing periodic payments to the owner, each payment reducing the amount of the death benefit until reaching a residual death benefit amount, is available on owner request, at a minimum age of the insured, on meeting a condition related to a likelihood of policy lapse prior to death of the insured. The processor is configured to determine whether premium payments in accordance with a schedule will cause the condition to be met.Type: ApplicationFiled: April 8, 2011Publication date: August 16, 2012Applicant: HARTFORD FIRE INSURANCE COMPANYInventors: Michael J. Roscoe, Edwin Clifford Barron, JR., Lisa Michelle Proch, Haobo Li
