Abstract: The present invention relates to an advertising system and method of using the same. The advertising system includes a light source which may be activated by near field communication devices in order to extract information from the system.

Abstract: The present invention relates to an interactive advertising system and method of using the system. A plurality of removable RFID devices are disposed on a panel which is separate from an advertising graphic that is supported in an illuminated frame. Activation of one of the RFID devices illuminates a portion of the advertising graphic.

Abstract: A method for culturing placental potential cell is provided, comprising steps of: (1) obtaining placental cells and/or tissue under aseptic condition; (2) inoculating the placental cells and/or the tissue in a culture medium for culturing, adding cell growth regulators to the culture medium, in such a manner that the placental potential cells grows to make the placental cells and/or the tissue into a proliferative state; (3) culturing the placental potential cells to make the placental potential cells proliferate continuously into cells with characteristics of stem cells. The present invention not only finds the source of human tissues, organs and the continuation of their function, i.e., regenerative potential cells; but also finds a medical and health longevity method, but also finds out the life materials to maintain and support the potential cells, so as to replace drugs with the living material.

Abstract: An erasable and/or reusable image receiving medium (62) is disclosed along with a system (10) and/or method for using the same, including a unit (60) and/or method for erasing the reusable medium (62).

Abstract: An erasable and/or reusable image receiving medium (62) is disclosed along with a system (10) and/or method for using the same, including a unit (60) and/or method for erasing the reusable medium (62).

Abstract: Methods and/or systems for printing or otherwise evincing temporary indicia on media with disappearing inks are described along with suitable disappearing ink formulations and media constructions for executing the same. In particular embodiments, the methods and/or systems described employ a plurality of disappearing inks with different disappearing rates. In one embodiment, a barrier layer that is selectively used to cover a major surface of the media is employed to substantially block or otherwise regulate a rate of phase transitions (e.g., evaporation and/or sublimation) experienced by ink borne by the media.

Abstract: A heat-transfer imaging system and a method of using the same. The heat-transfer imaging system includes a heat-transfer sheet and an activating ink. The heat-transfer sheet and the activating ink are specially formulated so that only the areas of the heat-transfer sheet onto which the ink has been printed become adhesive under heat-transfer conditions. This effect may be achieved by designing the sheet to include an ink-receptive coating whose melting temperature is higher than that typically encountered during normal heat-transfer conditions and by formulating the activating ink to include a plasticizer that, when printed onto the ink-receptive coating, lowers the melting temperature of the ink-receptive coating sufficiently so that the modified melting temperature falls within the temperature range encountered during heat-transfer.

Abstract: The present invention includes a print-receptive medium including a print-receptive surface. The print-receptive surface having a plurality of peaks and a plurality of valleys. The print-receptive surface also has a primary profile that includes a mean surface. Each of the plurality of peaks has a height measured from the mean surface, and each of the valleys has a depth measured from the mean surface. The plurality of peaks has a mean peak height, Ppm, and the plurality of valleys has a mean valley depth, Pvm. The primary profile of the print-receptive surface has a value of Ppm-Pvm greater than about 0.23 micron.

Abstract: An erasable and/or reusable image receiving medium (62) is disclosed along with a system (10) and/or method for using the same, including a unit (60) and/or method for erasing the reusable medium (62).

Abstract: The present invention relates to an advertising system and method of using the same. The advertising system includes a light source which may be activated by near field communication devices in order to extract information from the system.

Abstract: The present invention relates to an interactive advertising system and method of using the system. A plurality of removable RFID devices are disposed on a panel which is separate from an advertising graphic that is supported in an illuminated frame. Activation of one of the RFID devices illuminates a portion of the advertising graphic.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A heat-transfer imaging system and a method of using the same. The heat-transfer imaging system includes a heat-transfer sheet and an activating ink. The heat-transfer sheet and the activating ink are specially formulated so that only the areas of the heat-transfer sheet onto which the ink has been printed become adhesive under heat-transfer conditions. This effect may be achieved by designing the sheet to include an ink-receptive coating whose melting temperature is higher than that typically encountered during normal heat-transfer conditions and by formulating the activating ink to include a plasticizer that, when printed onto the ink-receptive coating, lowers the melting temperature of the ink-receptive coating sufficiently so that the modified melting temperature falls within the temperature range encountered during heat-transfer.

Abstract: Methods and/or systems for printing or otherwise evincing temporary indicia on media with disappearing inks are described along with suitable disappearing ink formulations and media constructions for executing the same. In particular embodiments, the methods and/or systems described employ a plurality of disappearing inks with different disappearing rates. In one embodiment, a barrier layer that is selectively used to cover a major surface of the media is employed to substantially block or otherwise regulate a rate of phase transitions (e.g., evaporation and/or sublimation) experienced by ink borne by the media.

Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A method for creating a plurality of semiconductor assemblies that includes the steps of creating a plurality of quasi-wafers, each quasi-wafer comprising a plurality of semiconductor devices; transferring the plurality of semiconductor devices on each quasi-wafers onto a carrier having a functional adhesive; and bonding the plurality of semiconductor devices to a substrate.

Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A method for assembling a semiconductor device from a plurality of chips is disclosed. The method includes providing a penetrable carrier having a penetrable carrier substrate and an adhesive layer; providing a plurality of chips disposed on a surface of the adhesive layer; providing a second substrate; bringing the surface of the adhesive layer of the penetrable carrier close to the second substrate; pinning the plurality of chips against the second substrate through the penetrable carrier; and, moving the penetrable carrier away from the second substrate such that the plurality of pinned chips are removed from the surface of the adhesive layer on the penetrable carrier.