Abstract: Embodiments of the present disclosure disclose a rotary key force unloading mechanism, and an electronic device. The rotary key force unloading mechanism includes a key, a bourdon tube, and a cover cap; the cover cap is axially movable relative to the bourdon tube, and the cover cap and the bourdon tube are connected by an axially retractable elastic member; a stem portion of the key passes through the bourdon tube and the cover cap, so that the elastic member is compressed when the cover cap is pressed by a key cap of the key; and the stem portion of the key is provided with a limiting member for preventing separation, and when no axial force is applied on the key, no interaction forces exist between the limiting member and the bourdon tube.

Abstract: A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.

Abstract: A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.