Patents by Inventor Haode Li

Haode Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board compensation processing method, device, and PCB
    Patent number: 9185808
    Abstract: The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: November 10, 2015
    Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd., Zhuhai Founder PCB Development Co., Ltd.
    Inventors: Lanyuan Chen, Haode Li