Abstract: A nitride-based semiconductor device includes a nitride-based semiconductor wafer, a protecting layer, and a plurality of connecting bumps. The nitride-based semiconductor wafer comprises a plurality of nitride-based dies. Each of the nitride-based dies comprises a connecting surface and a plurality of connecting pads and the connecting pads are embedded in the connecting surface. The protecting layer is disposed on the connecting surfaces of the nitride-based dies. The connecting bumps are embedded in the protecting layer. Every connecting bump connects one of the connecting pads. Every connecting bump has a first polished plane, and the first polished plane is free from the protecting layer. A manufacturing method of nitride-based semiconductor device is also provided.

Abstract: A nitride-based semiconductor device includes a first nitride-based semiconductor layer, a second nitride-based semiconductor layer, a first nitride-based transistor, a second nitride-based transistor, and a thermal resistor. The first nitride-based transistor is disposed over the second nitride-based semiconductor layer and applies the 2DEG region as an own channel. The second nitride-based transistor is disposed over the second nitride-based semiconductor layer and applying the 2DEG region as an own channel. The temperature sensor is disposed over the second nitride-based semiconductor layer and between first and second nitride-based transistors. The temperature sensor is in a strip shape and at least turns twice in a region between first and second nitride-based transistors.