Abstract: This application provides a display panel, a fabrication method thereof, and a display apparatus. The display panel includes a display region and a non-display region extending around the display region, and includes: a base; an array structure layer, disposed on the base, where a drive circuit is disposed in the array structure layer, the array structure layer includes a first portion and a second portion, the first portion is a projection portion of the display region on the array structure layer, the second portion is a projection portion of the non-display region on the array structure layer, and the second portion is provided with a groove that is filled with a first organic material; an organic planarization layer, where the organic planarization layer covers the first portion and includes the first organic material; a light-emitting component layer, disposed on the organic planarization layer.

Abstract: A laminated structure, a display module, an electronic device, an impact-resistant layer, and a preparation method are disclosed, and relate to the field of display technologies. The laminated structure includes a protective layer and the impact-resistant layer. An elastic modulus of the impact-resistant layer is less than an elastic modulus of the protective layer, hardness of the impact-resistant layer is greater than hardness of the protective layer, and/or stiffness of the impact-resistant layer is greater than stiffness of the protective layer. The protective layer is connected to the impact-resistant layer through bonding or in another manner. In this case, an extrusion resistance property of a material with high hardness and/or high stiffness and an impact resistance property of a material with a high elastic modulus are combined, to improve reliability of the laminated structure.

Abstract: The present disclosure provides a touchscreen having a bending region. A touch layer is disposed in the bending region, a grid line is arranged at the touch layer, a plurality of channels for disconnecting the grid line are further disposed at the touch layer, the plurality of channels divide the grid line into a plurality of electrode regions, a grid line between any two adjacent electrode regions forms a fracture at a channel, and a width of the fracture is greater than or equal to 8 ?m.

Abstract: A display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Abstract: A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.

Abstract: This application provides a display panel, a display screen including the display panel, and an electronic device including the display screen. The display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Abstract: The present disclosure provides a touchscreen having a bending region. A touch layer is disposed in the bending region, a grid line is arranged at the touch layer, a plurality of channels for disconnecting the grid line are further disposed at the touch layer, the plurality of channels divide the grid line into a plurality of electrode regions, a grid line between any two adjacent electrode regions forms a fracture at a channel, and a width of the fracture is greater than or equal to 8 ?m.

Abstract: In accordance with an embodiment, a display driver is configured to drive pixel units arranged in an array on a display panel that includes a first display area and a second display area to perform image display operations. In response to both the first display area and the second display area performing the image display operations, a time sequence control circuit in the display driver continuously outputs a scanning-related signal, a data-related signal, and a light-emitting-related signal in first duration and second duration. In response to the first display area performing the image display operations and the second display area stopping performing the image display operations, the time sequence control circuit stops outputting the scanning-related signal, the data-related signal, and the light-emitting-related signal in the second duration.

Abstract: This application provides an adhesive composition. The adhesive composition includes an adhesive matrix and a modified polymer. A main chain of the modified polymer includes a boron-oxygen coordinate bond and/or a bridging boron-oxygen coordinate bond. A terminal group or a side chain of the modified polymer or both include at least one of a hydroxyl group, an acrylate group, and a vinyl group. This application further provides a preparation method of the adhesive composition, an optical adhesive film, a foldable screen using the optical adhesive film, and an electronic device using the optical adhesive film or the foldable screen.

Abstract: The present disclosure relates to display apparatuses and methods for manufacturing the display apparatuses. One example display apparatus includes an array substrate and a laminated structure. The array substrate includes a substrate and an array layer located on a side of the substrate. The laminated structure is located on a side that is of the array layer and that is opposite to the substrate, and includes a first film layer and a second film layer. The first film layer is located on a side that is of the second film layer and that is opposite to the substrate, and is formed by a high modulus material. An elastic modulus of the high modulus material is E1, and 50 Mpa?E1?5 Gpa. The second film layer is formed by a modified energy absorption impact resistance material has viscosity and shear thickening behavior.

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Abstract: A display screen includes a redistribution layer, a plurality of light emitting units, and a plurality of driver chips. The redistribution layer includes a flexible dielectric layer and a metal interconnection structure disposed in the flexible dielectric layer. The light emitting unit includes at least one light emitting chip. The light emitting diode is disposed on the redistribution layer. A pad of the light emitting chip is bonded to the metal interconnection structure. The plurality of driver chips are disposed on the redistribution layer. A pad of the driver chip is bonded to the metal interconnection structure. One driver chip is electrically connected to light emitting chips in the same light emitting unit by using metal interconnection structure, and the driver chip is configured to drive the light emitting chip to emit light.

Abstract: This application provides a display panel, a fabrication method thereof, and a display apparatus. The display panel includes a display region and a non-display region extending around the display region, and includes: a base; an array structure layer, disposed on the base, where a drive circuit is disposed in the array structure layer, the array structure layer includes a first portion and a second portion, the first portion is a projection portion of the display region on the array structure layer, the second portion is a projection portion of the non-display region on the array structure layer, and the second portion is provided with a groove that is filled with a first organic material; an organic planarization layer, where the organic planarization layer covers the first portion and includes the first organic material; a light-emitting component layer, disposed on the organic planarization layer.

Abstract: A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.

Abstract: This application provides a display panel, a display screen including the display panel, and an electronic device including the display screen. The display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Abstract: An electronic device comprises a processor, a charging port, and memory that stores program code. When the program code is executed by the processor, the electronic device charges a battery of the electronic device using the charging port when a charger is connected to the charging port, stops charging in response to detecting that the charging port is abnormal, and displays a first window on a display interface of the electronic device in response to detecting that the charging port is abnormal. The first window comprises a first prompt information and a second prompt information. The first prompt information is used to prompt that liquid intake exists in the charging port, and the second prompt information is used to prompt a user to exclude a liquid intake situation of the charging port.

Abstract: An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

Abstract: A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.