Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Abstract: A display screen includes a redistribution layer, a plurality of light emitting units, and a plurality of driver chips. The redistribution layer includes a flexible dielectric layer and a metal interconnection structure disposed in the flexible dielectric layer. The light emitting unit includes at least one light emitting chip. The light emitting diode is disposed on the redistribution layer. A pad of the light emitting chip is bonded to the metal interconnection structure. The plurality of driver chips are disposed on the redistribution layer. A pad of the driver chip is bonded to the metal interconnection structure. One driver chip is electrically connected to light emitting chips in the same light emitting unit by using metal interconnection structure, and the driver chip is configured to drive the light emitting chip to emit light.

Abstract: This application provides a display panel, a fabrication method thereof, and a display apparatus. The display panel includes a display region and a non-display region extending around the display region, and includes: a base; an array structure layer, disposed on the base, where a drive circuit is disposed in the array structure layer, the array structure layer includes a first portion and a second portion, the first portion is a projection portion of the display region on the array structure layer, the second portion is a projection portion of the non-display region on the array structure layer, and the second portion is provided with a groove that is filled with a first organic material; an organic planarization layer, where the organic planarization layer covers the first portion and includes the first organic material; a light-emitting component layer, disposed on the organic planarization layer.

Abstract: A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.

Abstract: This application provides a display panel, a display screen including the display panel, and an electronic device including the display screen. The display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Abstract: An electronic device comprises a processor, a charging port, and memory that stores program code. When the program code is executed by the processor, the electronic device charges a battery of the electronic device using the charging port when a charger is connected to the charging port, stops charging in response to detecting that the charging port is abnormal, and displays a first window on a display interface of the electronic device in response to detecting that the charging port is abnormal. The first window comprises a first prompt information and a second prompt information. The first prompt information is used to prompt that liquid intake exists in the charging port, and the second prompt information is used to prompt a user to exclude a liquid intake situation of the charging port.

Abstract: An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

Abstract: A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

Abstract: A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

Abstract: An electronic device comprises a processor, a charging port, and memory, that stores program code. When the program code is executed by the processor, the electronic device charges a battery of the electronic device using the charging port when a charger is connected to the charging port, stops charging in response to detecting that the charging port is abnormal, and displays a first window on a display interface of the electronic device in response to detecting that the charging port is abnormal. The first window comprises a first prompt information and a second prompt information. The first prompt information is used to prompt that liquid intake exists in the charging port, and the second prompt information is used to prompt a user to exclude a liquid intake situation of the charging port.

Abstract: A charging method and a related device are provided. A charge protection apparatus includes a micro control unit MCU, a current detection circuit, a gating circuit, and an I/O interface. The current detection circuit detects an external charging current flowing through a power cable. The current detection circuit transmits the external charging current to the MCU. The MCU transmits the external charging current to a user terminal by using the I/O interface, so that the user terminal calculates a current difference between the external charging current and an internal charging current detected by the user terminal, and determines, based on the current difference, whether to generate a circuit control command. The MCU receives the circuit control command sent by the user terminal, and controls, according to the circuit control command, the gating circuit to be in a closed state or an open state.

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

Abstract: In one example implementation, a sensor apparatus includes a bracket, a first polar plate, a first contact portion, a first leading wire, a rotating shaft, a support frame, a second polar plate, a second contact portion, and a second leading wire. The bracket is of a cylindrical structure with two open ends. The first leading wire is disposed on the first polar plate and an external side of the bracket, one end of the first leading wire is connected to the first contact portion, and the other end of the first leading wire is connected to the first polar plate. The second contact portion is disposed at a first end of the support frame. The second leading wire is disposed on the support frame and the second polar plate.

Abstract: An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

Abstract: This application provides a touch display panel, a flexible display apparatus, and a method for manufacturing the touch display panel. The touch display panel includes a flexible substrate, a display component, a touch component, and a thin film encapsulation layer. The touch component and the display component are located at different locations on an upper surface of the flexible substrate, and the touch component and the display component are stacked together through folding, to form the touch display panel. The thin film encapsulation layer is formed on an upper surface of the touch component, an upper surface of the display component, and the upper surface of the flexible substrate. Due to a bendable feature of the flexible substrate, the display component and the touch component are manufactured at different locations on the flexible substrate at the same time, and an integrated touch display panel is formed through folding.

Abstract: In one example implementation, a sensor apparatus includes a bracket, a first polar plate, a first contact portion, a first leading wire, a rotating shaft, a support frame, a second polar plate, a second contact portion, and a second leading wire. The bracket is of a cylindrical structure with two open ends. The first leading wire is disposed on the first polar plate and an external side of the bracket, one end of the first leading wire is connected to the first contact portion, and the other end of the first leading wire is connected to the first polar plate. The second contact portion is disposed at a first end of the support frame. The second leading wire is disposed on the support frame and the second polar plate.