Patents by Inventor Hao-Liang Chen
Hao-Liang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240178102Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.Type: ApplicationFiled: April 21, 2023Publication date: May 30, 2024Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
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Publication number: 20240071888Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.Type: ApplicationFiled: August 28, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
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Publication number: 20050246276Abstract: A method for disbursing account payables includes at least the following steps: first, users enter intended sifting payable expenditure conditions in an account payable system; then the account payable system sifts and selects payable expenditures conforming to the payable expenditure conditions; then users select intended disbursing payable expenditures from the payable expenditures conforming to the payable expenditure conditions; then the account payable system summarizing contents of at least one payable document, and the intended disbursing payable expenditures that have same payable expenditure conditions are summarized in the contents of the payable document; thereafter users order the account payable system generating a payment batch number corresponding to all the payable documents; then users enter current intended settlement amount and current deductible amount for any one of the payable documents; and users order the account payable system calculating payable amount contained in the payment batchType: ApplicationFiled: July 13, 2005Publication date: November 3, 2005Inventors: Yeun-Jong Lee, Fang-Chen Tsao, Hao-Liang Chen, Hui-Shan Ni
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Patent number: 6754669Abstract: A computer-implemented method of generating an item number for an item is disclosed. First, an item-type table is created and a sequence of specification codes on the item-type table is determined. After creating a code table for each of the specification codes, a specification name for each of the specification code is input into the code table. After inputting representative codes into the code table, an item-type code is input into the item-type table. After inputting a specification description into the item-type table, an item-number-encoding table is created and an item type of the item is selected on the item-number-encoding table. Next, an item-type code of the item is input into the item-number-encoding table, and then specification descriptions of the item type is shown on the item-number-encoding table. After deciding the representative codes according to real properties of the item, the item number of the item is generated.Type: GrantFiled: November 21, 2001Date of Patent: June 22, 2004Assignee: Elite Intelligence Corp.Inventors: Yeun-Jonq Lee, Hui-Shan Ni, Hao-Liang Chen, Yueh-Wen Chen
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Publication number: 20030046104Abstract: The present invention disclosed a method for approving expense applications. It is applied in a computer system that has set up a procedure for approving expenses and comprises the following steps: submitting an expense application and personally checking it; entering it into the computer system if the expense application is approved, or returning it for resubmission if it is rejected; following up with a second check by the computer system; saving it on the computer system and creating a ledger for if the application information is approved by the computer system, or returning it for resubmission if it is rejected.Type: ApplicationFiled: August 7, 2002Publication date: March 6, 2003Applicant: Via Technologies, Inc.Inventors: Yeun-Jonq Lee, Fang-Chen Tsao, Hao-Liang Chen
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Publication number: 20030040990Abstract: A method for disbursing account payables includes at least the following steps: first, users enter intended sifting payable expenditure conditions in an account payable system; then the account payable system sifts and selects payable expenditures conforming to the payable expenditure conditions; then users select intended disbursing payable expenditures from the payable expenditures conforming to the payable expenditure conditions; then the account payable system summarizing contents of at least one payable document, and the intended disbursing payable expenditures that have same payable expenditure conditions are summarized in the contents of the payable document; thereafter users order the account payable system generating a payment batch number corresponding to all the payable documents; then users enter current intended settlement amount and current deductible amount for any one of the payable documents; and users order the account payable system calculating payable amount contained in the payment batchType: ApplicationFiled: March 27, 2002Publication date: February 27, 2003Applicant: Via Technologies, Inc.Inventors: Yeun-Jonq Lee, Fang-Chen Tsao, Hao-Liang Chen, Hui-Shan Ni
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Publication number: 20030040989Abstract: Expenses reimbursement application method, mainly used in the accounting system of the enterprise resource planning (ERP) system. Wherein, for expense applicants, it provides an “employee expense application function setup” in order to combine the inputs of general expense and petty cash applications, and the input operations are performed by the expense applicants; for petty cash keepers, it provides a “petty cash management function setup” to allow the petty cash keepers to manage petty cash accounts; for accountants, it provides an “expense application and account establishment function setup”, which allows the accountants to inquire the expense application data inputted by general employees and the petty cash keepers and reduces the input time of the accounting operations.Type: ApplicationFiled: March 25, 2002Publication date: February 27, 2003Applicant: VIA Technologies, Inc.Inventors: Yeun-Jonq Lee, Fang-Chen Tsao, Hao-Liang Chen
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Publication number: 20030023606Abstract: A computer-implemented method of generating an item number for an item is disclosed. First, an item-type table is created and a sequence of specification codes on the item-type table is determined. After creating a code table for each of the specification codes, a specification name for each of the specification code is input into the code table. After inputting representative codes into the code table, an item-type code is input into the item-type table. After inputting a specification description into the item-type table, an item-number-encoding table is created and an item type of the item is selected on the item-number-encoding table. Next, an item-type code of the item is input into the item-number-encoding table, and then specification descriptions of the item type is shown on the item-number-encoding table. After deciding the representative codes according to real properties of the item, the item number of the item is generated.Type: ApplicationFiled: November 21, 2001Publication date: January 30, 2003Applicant: Via Technologies, Inc.Inventors: Yeun-Jonq Lee, Hui-Shan Ni, Hao-Liang Chen, Yueh-Wen Chen