Abstract: The present application provides a method, a device, an apparatus, and storage medium for deviation correction of an electrode sheet. The deviation correction method of the electrode sheet includes: determining the first deviation amount of the electrode sheet on the stacking machine in the first direction; correcting a deviation of the electrode sheet in the first direction according to the first deviation amount; determining the second deviation amount of the electrode sheet in the second direction, wherein the second deviation amount is different from the first deviation amount; and correcting a deviation of the electrode sheet in the second direction according to the second deviation amount.

Abstract: Various embodiments of the present technology generally relate to robotic devices and artificial intelligence. More specifically, some embodiments relate to a robotic device for picking items from a bin and perturbing items in a bin. In some implementations, the device may include one or more computer-vision systems. A computer-vision system, in accordance with the present technology, may use at least two two-dimensional images to generate three-dimensional (3D) information about the bin and items in the bin. Based on the 3D information, a strategy for picking up items from the bin is determined. When no strategies with high probability of success exist, the robotic device may perturb the contents of the bin to create new available pick-up points and re-attempt to pick up an item.

Abstract: A display substrate and a display device relate to the technical field of displaying. The display substrate includes a plurality of display units spaced apart from each other and a plurality of connection units, the plurality of connection units being connected between two adjacent display units; the plurality of connection units include: two connection units arranged along a first direction, wherein the first direction is parallel to a stretching direction of the display substrate; wherein the two connection units arranged along the first direction are axisymmetric with respect to a first reference line, so that the plurality of connection units arranged along a second direction have a same deformation amount in a stretching state, the second direction is perpendicular to the stretching direction, and an extension direction of the first reference line is parallel to the second direction.

Abstract: A method for treating a sludge derived from sewage or wastewater, the method comprising subjecting the sludge to a treatment step at a pH of 8.9 or greater and a free ammonia (FA) content of 100 mg NH3—N/L or greater. The treated sludge may be fed to a bioreactor to produce methane.

Abstract: A method for treating a sludge derived from sewage or wastewater, the method comprising subjecting the sludge to a treatment step at a pH of 8.9 or greater and a free ammonia (FA) content of 100 mg NH3—N/L or greater. The treated sludge may be fed to a bioreactor to produce methane.

Abstract: A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received operation command is processed to supply test data to each of the IP cores being tested. Result data is received in response to the supplied test data from each of the IP cores being tested. The result data is processed and from the processed result data is generated a status data packet. The status data packet includes the operation code component and a status flag component and is provided on the input/output port.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

Abstract: A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received operation command is processed to supply test data to each of the IP cores being tested. Result data is received in response to the supplied test data from each of the IP cores being tested. The result data is processed and from the processed result data is generated a status data packet. The status data packet includes the operation code component and a status flag component and is provided on the input/output port.

Abstract: A method for implementing package-level intellectual property (PLIP) preverification for system on chip (SOC) devices includes providing at least one externally connected intellectual property (IP) core with an SOC. A package generic unit is provided with the IP core and is configured for providing external interface functions with respect to the SOC, wherein said package generic unit is pre-verified in silicon and independent of the specific packaging of the SOC. A package adaptation unit is provided with the IP core and is configured for providing external interface functions with respect to the SOC, wherein the package adaptation unit is pre-verified in silicon and dependent upon the specific packaging of the SOC.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

Abstract: A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received operation command is processed to supply test data to each of the IP cores being tested. Result data is received in response to the supplied test data from each of the IP cores being tested. The result data is processed and from the processed result data is generated a status data packet. The status data packet includes the operation code component and a status flag component and is provided on the input/output port.

Abstract: A method for implementing package-level intellectual property (PLIP) preverification for system on chip (SOC) devices includes providing at least one externally connected intellectual property (IP) core with an SOC. A package generic unit is provided with the IP core and is configured for providing external interface functions with respect to the SOC, wherein said package generic unit is pre-verified in silicon and independent of the specific packaging of the SOC. A package adaptation unit is provided with the IP core and is configured for providing external interface functions with respect to the SOC, wherein the package adaptation unit is pre-verified in silicon and dependent upon the specific packaging of the SOC.

Abstract: A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

Abstract: An asynchronous mode transfer (ATM) switch conducting switching based upon the calculation of weights for entries corresponding to cells in an input queue to achieve a high throughput rate which avoids head of line blocking. The switch includes a cell scheduler driven by the iterative resolution of a traffic matrix formed by highest priority entries for each of a plurality of output ports queued in each of a plurality input queues each having separate virtual queues corresponding to the output ports. Conflicts in the matrix are resolved according to weight so that one entry per one row is chosen to be transmitted in parallel. Selection of winning entries from among a group of conflicting entries during any step are resolved by selecting the heaviest weighted entry and leaving the remaining ports maximum satisfactory transmission opportunities.