Abstract: The present invention provides a three-dimensional heterogeneous integrated millimeter-wave system package structure, which is composed of an upper antenna board and a lower chip carrier board. The upper antenna board has an integrated structure with an antenna in package and a feed network arranged inside, the lower chip carrier board has a modular structure provided with a first chipset and a second chipset which are heterogeneous integrated, and each chipset comprises a plurality of chips of the same or different processes.