Abstract: A flash memory control apparatus having a sequential writing procedure and method thereof are described. The flash memory control apparatus includes primary controller, a command module, an address module, a data buffer, a status unit, a counting device and a secondary controller. The primary controller generates a predetermined value which represents the amount of a plurality of pages in the flash memory. The command module stores a writing command during the writing procedure. The address module stores a current address for addressing a current page of the pages based on the current address and the writing command via a control bus. The data buffer stores the data for allowing the command module to write the data to the current page based on the current address via the control bus while the writing command is executed on the flash memory. The status unit determines that the flash memory is either ready or busy in writing the data to the current page of the flash memory.

Abstract: A circuit board and a package structure thereof are proposed. The circuit board includes a main body and a solder mask layer covered on a surface of the main body. The circuit board is formed with a cutting path to define a plurality of array-arranged circuit board units, wherein the solder mask layer is formed with a groove at a position corresponding to the cutting path to expose the main body of the circuit board. By such arrangement, when a laser is employed to perform a singulation process after a chip mounting process and a packaging process have been completed on the circuit board unit, the problem wherein the solder mask layer melts on the cutting path of the circuit board due to a thermal effect caused by the laser is avoided, so as to avoid the generation of irregular and uneven surface of the cutting plane. Additionally, chippings on a surface of a substrate can be prevented from being generated, so as to avoid contamination of subsequent processes.