Abstract: The present application provides a chip package structure and an electronic device, which could reduce a chip package thickness and implement ultra-thinning of chip package. The chip package structure includes a chip, a substrate, a lead and a lead protection adhesive; the lead is configured to electrically connect the chip and the substrate; the lead protection adhesive is configured to support the lead, where a highest point of the lead protection adhesive is not higher than a highest point of an upper edge of the lead.

Abstract: A chip package structure and an electronic equipment may reduce probability of short circuit failure during chip packaging and improve chip reliability. The chip package structure includes: a chip, a substrate, and a lead; the chip is disposed above the substrate; wherein the chip includes a pin pad and a test metal key, and the lead is configured to electrically connect the pin pad and the substrate; the test metal key is disposed in an edge region of the chip that is not under the lead.

Abstract: Embodiments of the present application provide a chip package structure, a chip package method and a terminal device. The chip package structure includes: an optical sensing chip, including a first surface and a second surface, where the first surface is provided with a first pad, the second surface is provided with a connecting end, the first pad is electrically connected to the connecting end, and the connecting end is configured to implement an electrical connection between the chip package structure and the exterior; and an optical path modulating structure, disposed above the first surface, and configured to perform an optical path modulation on an optical signal reflected from a human finger and make the signal incident on the first surface, or perform the optical path modulation on an optical signal emitted from the first surface and make the signal exit to the human finger.

Abstract: The present application provides a chip package structure and an electronic device, which could reduce a chip package thickness and implement ultra-thinning of chip package. The chip package structure includes a chip, a substrate, a lead and a lead protection adhesive; the lead is configured to electrically connect the chip and the substrate; the lead protection adhesive is configured to support the lead, where a highest point of the lead protection adhesive is not higher than a highest point of an upper edge of the lead.

Abstract: A chip package structure and an electronic equipment may reduce probability of short circuit failure during chip packaging and improve chip reliability. The chip package structure includes: a chip, a substrate, and a lead; the chip is disposed above the substrate; wherein the chip includes a pin pad and a test metal key, and the lead is configured to electrically connect the pin pad and the substrate; the test metal key is disposed in an edge region of the chip that is not under the lead.

Abstract: Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.

Abstract: Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.

Abstract: Embodiments of the present application provide a chip package structure, a chip package method and a terminal device. The chip package structure includes: an optical sensing chip, including a first surface and a second surface, where the first surface is provided with a first pad, the second surface is provided with a connecting end, the first pad is electrically connected to the connecting end, and the connecting end is configured to implement an electrical connection between the chip package structure and the exterior; and an optical path modulating structure, disposed above the first surface, and configured to perform an optical path modulation on an optical signal reflected from a human finger and make the signal incident on the first surface, or perform the optical path modulation on an optical signal emitted from the first surface and make the signal exit to the human finger.

Abstract: A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.

Abstract: A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.