Abstract: A sensor element, in particular for determining an angle of rotation, has a detection medium whose position varies as a function of a change in a parameter to be measured, where the change in the position of the detection medium leads to a change in an analyzable signal of the sensor element which is influenced by the detection medium. The detection medium has at least one conductor loop carrying current which is exposed to an external magnetic field; the detection medium is rotationally movably mounted so that a rotational motion of the sensor element about an angle of rotation in the plane of the magnetic field is converted into a deflection of the detection medium perpendicular to the magnetic field.

Abstract: A micromechanical magnetic field sensor includes a printed circuit trace device, which is suspended above a substrate and is capable of being deflected elastically. Also included are a first capacitor plate device that is joined to the printed circuit trace device and is able to be deflected together with the printed circuit trace device, and a second, fixed capacitor plate device that is joined to the substrate and forms a capacitor device by interacting with the first capacitor plate device. A magnetic field sensing device conducts a predetermined current through the printed circuit trace device and measures the change in capacitance of the capacitor device arising in dependence on an applied magnetic field. The magnetic field sensing device can also be designed in such a way that it can be calibrated by calibration current loops.

Abstract: The present invention provides a procedure for achieving accurate alignment between an X-ray mask and a device substrate for the fabrication of multi-layer microstructures. A first photoresist layer on the substrate is patterned by a first X-ray mask to include first alignment holes along with a first layer microstructure pattern. Mask photoresist layers are attached to second and subsequent masks that are used to pattern additional photoresist layers attached to the microstructure device substrate. The mask photoresist layers are patterned to include mask alignment holes that correspond in geometry to the first alignment holes in the first photoresist layer on the device substrate. Alignment between a second mask and the first photoresist layer is achieved by assembly of the second mask onto the first photoresist layer using alignment posts placed in the first alignment holes in the first photoresist layer that penetrate into the mask alignment holes in the mask photoresist layers.

Abstract: The present invention provides a procedure for achieving accurate alignment between an X-ray mask and a device substrate for the fabrication of multi-layer microstructures. A first photoresist layer on the substrate is patterned by a first X-ray mask to include first alignment holes along with a first layer microstructure pattern. Mask photoresist layers are attached to second and subsequent masks that are used to pattern additional photoresist layers attached to the microstructure device substrate. The mask photoresist layers are patterned to include mask alignment holes that correspond in geometry to the first alignment holes in the first photoresist layer on the device substrate. Alignment between a second mask and the first photoresist layer is achieved by assembly of the second mask onto the first photoresist layer using alignment posts placed in the first alignment holes in the first photoresist layer that penetrate into the mask alignment holes in the mask photoresist layers.