Abstract: The invention relates to an endoscope head comprising an endoscope head body in which at least one working channel is formed, wherein a pivot member actuatable from the proximal side is provided on the distal side of the endoscope head body, wherein an Albarran lever capable of being pivoted is provided at the distal end portion of the working channel.

Abstract: The invention refers to an endoscope including at least one channel which may be contaminated in use, wherein the channel wall of the at least one channel is formed of a material having properties capable of photocatalysis. The invention further refers to a method for cleaning such an endoscope including the steps of: connecting the endoscope to a reprocessing device, performing a photocatalytic treatment at least in the at least one channel for the purpose of the decomposition of organic residues on the surface of the channel, and rinsing the endoscope. The invention further refers to a cleaning device for cleaning such an endoscope.

Abstract: The invention relates to an endoscope head comprising an endoscope head body in which at least one working channel is formed, wherein a pivot member actuatable from the proximal side is provided on the distal side of the endoscope head body, wherein an Albarran lever capable of being pivoted is provided at the distal end portion of the working channel.

Abstract: The invention relates to an endoscope head comprising an endoscope head body in which at least one working channel is formed, wherein a pivot member actuatable from the proximal side is provided on the distal side of the endoscope head body, wherein an Albarran lever capable of being pivoted is provided at the distal end portion of the working channel.

Abstract: According to an embodiment of a method of manufacturing a plurality of semiconductor devices on a wafer, the method includes forming a structure layer comprising a plurality of same semiconductor device structures and providing a protective layer on the structure layer. The protective layer on a first one of the plurality of semiconductor device structures differs from the protective layer on a second one of the plurality of semiconductor device structures.

Abstract: A power semiconductor package includes a reference voltage terminal, a supply voltage terminal, a phase terminal, a first power transistor and a second power transistor. The first power transistor and the second power transistor are connected in series and form a low side switch and a high side switch of a half bridge circuit.

Abstract: The invention refers to an endoscope including at least one channel which may be contaminated in use, wherein the channel wall of the at least one channel is formed of a material having properties capable of photocatalysis. The invention further refers to a method for cleaning such an endoscope including the steps of: connecting the endoscope to a reprocessing device, performing a photocatalytic treatment at least in the at least one channel for the purpose of the decomposition of organic residues on the surface of the channel, and rinsing the endoscope. The invention further refers to a cleaning device for cleaning such an endoscope.

Abstract: According to an embodiment of a method of manufacturing a plurality of semiconductor devices on a wafer, the method includes forming a structure layer comprising a plurality of same semiconductor device structures and providing a protective layer on the structure layer. The protective layer on a first one of the plurality of semiconductor device structures differs from the protective layer on a second one of the plurality of semiconductor device structures.

Abstract: The invention relates to an endoscope head comprising an endoscope head body in which at least one working channel is formed, wherein a pivot member actuatable from the proximal side is provided on the distal side of the endoscope head body, wherein an Albarran lever capable of being pivoted is provided at the distal end portion of the working channel.

Abstract: A power semiconductor package includes a reference voltage terminal, a supply voltage terminal, a phase terminal, a first power transistor and a second power transistor. The first power transistor and the second power transistor are connected in series and form a low side switch and a high side switch of a half bridge circuit.

Abstract: The invention relates to an antenna device (1), in particular a roof antenna device (19), for a motor vehicle, having at least one antenna (6) and at least one electronic assembly (7). In this case, provision is made for the antenna (6) and the electronic assembly (7) to be arranged in a water-tight inner housing (2) and for a visible housing (5) to cover the inner housing (2). The invention also relates to a motor vehicle having an antenna device (1).

Abstract: The invention relates to azaindole derivatives of general formula (I), wherein X represents a group of general formula (X1). Said compounds have a therapeutic potential in the treatment of diseases that are accompanied by an impaired dopamine metabolism and/or abnormal serotonin-5-HT1a signal transmission.