Abstract: A switching device has a substrate and a power semiconductor component, comprising a connection device and a pressure device wherein the substrate has tracks electrically insulated from one another. The power semiconductor component is on one of the tracks with a first main surface and is conductively connected thereto. The device is embodied as a film composite having a conductive film and an insulating film that forms a first and a second main surface. The switching device is connected internally in a circuit-conforming manner by the connection device and a contact area of the connection device is connected to a first contact area of one of the tracks in a force-locking and electrically conductive manner. There is a pressure body projecting to the substrate and pressing onto a first section of the second main surface of the film composite.

Abstract: A switching device has a substrate, a connection device and a pressure device, wherein the substrate has electrically insulated conductor tracks, and a power semiconductor component is on one of the conductor tracks with a first main surface and is conductively connected thereto. The connection device is a film composite with conductive film and an insulating film and forms a first and a second main surface. The switching device is connected by the connection device and a contact area of the second main surface of the power semiconductor component is connected to a first contact area of the first main surface of the connection device in a force-locking and electrically conductive manner with a pressure body and a pressure element projecting toward the power semiconductor component.

Abstract: The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.

Abstract: A switching device has a substrate and a power semiconductor component, comprising a connection device and a pressure device wherein the substrate has tracks electrically insulated from one another. The power semiconductor component is on one of the tracks with a first main surface and is conductively connected thereto. The device is embodied as a film composite having a conductive film and an insulating film that forms a first and a second main surface. The switching device is connected internally in a circuit-conforming manner by the connection device and a contact area of the connection device is connected to a first contact area of one of the tracks in a force-locking and electrically conductive manner. There is a pressure body projecting to the substrate and pressing onto a first section of the second main surface of the film composite.

Abstract: A switching device has a substrate, a connection device and a pressure device, wherein the substrate has electrically insulated conductor tracks, and a power semiconductor component is on one of the conductor tracks with a first main surface and is conductively connected thereto. The connection device is a film composite with conductive film and an insulating film and forms a first and a second main surface. The switching device is connected by the connection device and a contact area of the second main surface of the power semiconductor component is connected to a first contact area of the first main surface of the connection device in a force-locking and electrically conductive manner with a pressure body and a pressure element projecting toward the power semiconductor component.

Abstract: A switching device has a substrate, a power semiconductor component arranged thereon, a connection device and a pressure device. The substrate has conductor tracks electrically insulated from each another. A power semiconductor component is arranged on one of the conductor tracks. The connection device is embodied as a film composite having an electrically conductive film and an electrically insulating film and forming a first and a second main surface. The switching device is connected in a circuit-conforming manner by the connection device, and a contact area of the first main surface of the power semiconductor component is connected to a first contact area of an assigned conductor track of the substrate in a force-locking and electrically conductive manner.

Abstract: A power electronic switching device having plurality of potential surfaces. At least two different potentials are respectively assigned to at least one of the potential surfaces. A plurality of semiconductor components are arranged in an n×m matrix, oriented in the x-y-direction, on a first conductor track, formed by at least one potential surface of the first potential. The semiconductor components are connected in parallel with one another and form a current valve. In this case, the semiconductor components can be distributed among a plurality of potential surfaces of the first potential which form the first conductor track.

Abstract: A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.

Abstract: A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.