Patents by Inventor Harald Kraushaar

Harald Kraushaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8470258
    Abstract: Embodiments of the invention relate a surface-structured device for life-sciences and a life-science method applying the surface-structured device. The surface-structured device has a substrate with a frontside surface corresponding to a first surface; and a plurality of protrusions arranged on the frontside surface. A shortest dimension of the protrusions at the junction from the protrusion to the front-side surface is smaller than 250 nm and at least a first group of the plurality of protrusions is arranged on a first planar area of the frontside surface in a first regular pattern in a plane of the first planar area of the frontside surface. Further embodiments relate to a stamper which may be used in the manufacturing method of the surface-structured device and a manufacturing method for surface-structured device.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: June 25, 2013
    Assignee: Sony DADC Austria AG
    Inventors: Ivan Lucic, Harald Kraushaar
  • Publication number: 20110104732
    Abstract: Embodiments of the invention relate a surface-structured device for life-sciences and a life-science method applying the surface-structured device. The surface-structured device has a substrate with a frontside surface corresponding to a first surface; and a plurality of protrusions arranged on the frontside surface. A shortest dimension of the protrusions at the junction from the protrusion to the front-side surface is smaller than 250 nm and at least a first group of the plurality of protrusions is arranged on a first planar area of the frontside surface in a first regular pattern in a plane of the first planar area of the frontside surface. Further embodiments relate to a stamper which may be used in the manufacturing method of the surface-structured device and a manufacturing method for surface-structured device.
    Type: Application
    Filed: August 9, 2010
    Publication date: May 5, 2011
    Applicant: SONY DADC AUSTRIA AG
    Inventors: Ivan LUCIC, Harald Kraushaar
  • Publication number: 20060038286
    Abstract: The invention relates to a package or package raw material comprising an electrically conductive layer arranged on a base material and a chip connected to the electrically conductive layer, the electrically conductive layer being configured as an antenna element for transferring data and/or energy, wherein the electrically conductive layer comprises a non-conductive portion. Further, the invention relates to a method for producing a package and a device for producing a package.
    Type: Application
    Filed: August 15, 2005
    Publication date: February 23, 2006
    Inventors: Johan Maier, Karl Kronegger, Gottfried Reiter, Harald Kraushaar