Abstract: The invention relates to a module (1) in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (2), with a connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) which is delimited by a first end (23) and a second end (24), with electronic components (19, 20) which are connected to the connection means (3) as required, and with cooling means (14). In order that the power is supplied from the outside via the connection means (3) directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4) at least at one point, is not fixed to the carrier (2) in this area (9) and has contact means (22).

Abstract: The invention relates to a module (1) in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (2), with a connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) which is delimited by a first end (23) and a second end (24), with electronic components (19, 20) which are connected to the connection means (3) as required, and with cooling means (14). In order that the power is supplied from the outside via the connection means (3) directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4) at least at one point, is not fixed to the carrier (2) in this area (9) and has contact means (22).

Abstract: A component (9) includes a first ceramic substrate (1), a ceramic fin cooler or a ceramic cooler through which liquid flows, having an upper face (1b) and a lower face (1a). A metallization (2) is applied to the upper face (1b), on which metallization a circuit (4) is mounted by its lower face. The circuit (4) of the component (9) is cooled on both sides by elements having high thermal conductivity and at the same time high electrical conductivity and thus the efficiency of the assembly is increased. A ceramic electrical/thermal conduction substrate (6) is attached by its lower face to the upper face of the circuit by a connection, and a second ceramic substrate (8) is arranged on the upper face of the electrical/thermal conduction substrate (6) via a metallization (7). The substrate (8) contains metal-filled thermal-electrical vias (11) and/or cooling channels to guide a coolant.

Abstract: The invention relates to a component (9) comprising a first ceramic substrate (1) with an upper side (1b) and a lower side (1a), wherein a metallization (2) is applied on the upper side (1b), on which metallization an Si circuit (4) is mounted by its lower side via a connecting means (3). In order that the Si circuit (4) is cooled on both sides by elements with a high thermal conductivity and simultaneously a high electrical conductivity, and in order that the efficiency of the assembly is increased, according to the invention, a connecting means (5) is applied on the upper side (1b) of the Si circuit (4), on which connecting means a ceramic flat substrate (6) is attached by its lower side, and a second ceramic substrate (8) is arranged on the flat substrate (6) via a metallization (7), wherein the ceramic flat substrate (8) contains metal-filled thermal electrical vias (11) and/or cooling ducts for conveying a cooling means.

Abstract: The invention relates to a carrier body (1) for solar cells (2). According to the invention, in order to significantly improve the thermal resistivity of the connection between a solar cell (2) and the carrier body (1) or a cooling element, the carrier body (1) is made of a ceramic material having sintered metallization regions (3), at least one solar cell (2) is soldered or sintered onto the carrier body (1) and electrically connected to the metallization regions (3), and the carrier body (1) has ceramic cooling elements.

Abstract: The invention relates to a ceramic molded article (1) that has recesses (2) and comprises at least two plates (joined parts) (3) made of a ceramic material, i.e. a lower base plate (9), an upper cover plate (8) and, optionally, one or more intermediate plates (7) which are stacked on top of each other and are joined to each other on the surfaces thereof to form the molded article (1); a joining material (paste) is placed between the plates (joined parts) (3).