Abstract: A method is provided for production of a module, including the steps of: providing a substrate (1) having a first surface (5) in the form of a translucent carrier; providing an open casting mold (6), wherein the formation of at least one optical element (4, 4?) is provided in the casting mold (6); covering the surface (5) with a polymeric casting compound (3) in the open casting mold, while forming the optical element from the casting compound (3); and curing the casting compound in the casting mold, wherein the translucent carrier and the casting compound (3) together form an optical system (10).

Abstract: An optical module is provided, including a substrate (1) of a defined shape, the substrate having two surfaces (1a, 1b) opposite from each other and an edge (1c). A layer (2) covers at least one of the surfaces (1a, 1b) of the substrate (1). The layer (2) includes a transparent polymeric material and has at least one optical element (3) which scatters rays of light originating from the substrate and passing through the optical element (3). A design feature for at least one of mounting and aligning (4, 5) the optical module is provided in a mounting region of the layer and is the same material and the same part as the layer (2).

Abstract: A lamp is provided having at least one module that includes a plurality of LEDs distributed over a module surface. The plurality of LEDs are arranged in a row of a plurality of rows in a longitudinal direction of the at least one module. Each of the plurality of rows are arranged next to each other in a transverse direction of the at least one module that is perpendicular to the longitudinal direction. The lamp includes an optical system for bundling the light emitted by the plurality of LEDs. The optical system includes at least one cylinder lens that extends in the longitudinal direction. The light of at least some of the plurality of LEDs from a first row of the plurality of rows is bundled into a line on a target surface by the at least one cylinder lens.

Abstract: The invention relates to an optoelectronic module, more particularly to an optoelectronic chip-on-board module. The optoelectronic module comprises a substrate, wherein the substrate has a planar design. Furthermore, the optoelectronic module comprises a plurality of optoelectronic components that are arranged on the substrate. Furthermore, the optoelectronic module comprises a lens system having a plurality of lenses. The lens system comprises at least two lenses with different directivities.

Abstract: The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design. Furthermore, the optoelectronic module (112) comprises a plurality of optoelectronic components (118) that are arranged on the substrate (116). The optoelectronic module (110) further comprises at least one optical system (120) applied onto the substrate (114), more particularly a microoptical system having a plurality of microoptical elements. The optical system (120) comprises at least one primary optical system (124) that is adjacent to the optoelectronic components (116) and at least one secondary optical system (138).

Abstract: A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: A lamp is provided including a first module and at least one second module, each having a plurality of LEDs distributed over a module surface. The modules are arranged on at least one cooling element for dissipation of lost heat. A reflector deflects light emitted by one of the modules into an exit opening of the lamp. An optical system located between at least some of the LEDs and the exit opening bundles the light of the LEDs into a defined structure on a target surface.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A lighting device is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules, which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module has a plurality of light-emitting LEDs. The lighting device is characterized by at least one pair of the adjacent chip-on-board LED modules being arranged at an angle greater than 0° with respect to the surface normals of the modules.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract: A lamp is provided including a first module (1) and at least one second module (1), each having a plurality of LEDs (3) distributed over a module surface. The modules (1) are arranged on at least one cooling element (2) for dissipation of lost heat. A reflector (5, 5a, 5b) deflects light emitted by one of the modules (1) into an exit opening (6) of the lamp. An optical system (8, 9, 11, 12) located between at least some of the LEDs (3) and the exit opening (6) bundles the light of the LEDs (3) into a defined structure on a target surface (10).

Abstract: A lamp is provided having at least one module that includes a plurality of LEDs distributed over a module surface. The plurality of LEDs are arranged in a row of a plurality of rows in a longitudinal direction of the at least one module. Each of the plurality of rows are arranged next to each other in a transverse direction of the at least one module that is perpendicular to the longitudinal direction. The lamp includes an optical system for bundling the light emitted by the plurality of LEDs. The optical system includes at least one cylinder lens that extends in the longitudinal direction. The light of at least some of the plurality of LEDs from a first row of the plurality of rows is bundled into a line on a target surface by the at least one cylinder lens.

Abstract: A method is provided for production of a module, including the steps of: providing a substrate (1) having a first surface (5) in the form of a translucent carrier; providing an open casting mold (6), wherein the formation of at least one optical element (4, 4?) is provided in the casting mold (6); covering the surface (5) with a polymeric casting compound (3) in the open casting mold, while forming the optical element from the casting compound (3); and curing the casting compound in the casting mold, wherein the translucent carrier and the casting compound (3) together form an optical system (10).

Abstract: An optical module is provided, including a substrate (1) of a defined shape, the substrate having two surfaces (1a, 1b) opposite from each other and an edge (1c). A layer (2) covers at least one of the surfaces (1a, 1b) of the substrate (1). The layer (2) includes a transparent polymeric material and has at least one optical element (3) which scatters rays of light originating from the substrate and passing through the optical element (3). A design feature for at least one of mounting and aligning (4, 5) the optical module is provided in a mounting region of the layer and is the same material and the same part as the layer (2).

Abstract: A method is provided for production of a module, including the steps of: (a) providing a substrate (1) having a first surface (5); (b) providing an open casting mold (6), wherein the formation of at least one optical element (4, 4?) is provided in the casting mold (6); (c) coating the first surface (5) with an adhesion promoter (2); (d) covering the coated surface (2, 5) with a silicone (3) in the open casting mold while forming the optical element from the silicone (3); and (e) curing the silicone in the casting mold.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement.

Abstract: The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design. Furthermore, the optoelectronic module (112) comprises a plurality of optoelectronic components (118) that are arranged on the substrate (116). The optoelectronic module (110) further comprises at least one optical system (120) applied onto the substrate (114), more particularly a microoptical system having a plurality of microoptical elements. The optical system (120) comprises at least one primary optical system (124) that is adjacent to the optoelectronic components (116) and at least one secondary optical system (138).