Patents by Inventor Harald Riebel

Harald Riebel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9713266
    Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: July 18, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Richard Nichols, Don Jang, Harald Riebel, Frank BrĂ¼ning
  • Publication number: 20150083602
    Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.
    Type: Application
    Filed: February 6, 2013
    Publication date: March 26, 2015
    Inventors: Richard Nichols, Don Jang, Harald Riebel, Frank BrĂ¼ning