Abstract: A polygonal paving stone has a plurality of substantially planar sides extending perpendicularly between parallel upper and lower faces of the stone. A row of substantially identical and outwardly projecting narrow coupling members of a predetermined member width on each of the sides are separated by spaces of a predetermined space width. These narrow members are positioned on the respective sides such that when a plurality of the paving stones are fitted together with their upper faces generally coplanar the narrow coupling members of confronting sides of adjacent paving stones fit between one another A single wide coupling member on each of the sides has a width a greater than that of the member width of the narrow members and smaller than the space width so it can fit between two of the narrow members of a confronting side of an adjacent paving stone.

Abstract: The invention relates to a paving stone (1), especially for road construction. The paving stone (1) has side flanks (23) preferably directed perpendicularly with respect to the laying plane. At least two coupling members (3, 4) are disposed on at least one side flank (23) wherein the coupling members correspond with the coupling members (3, 4) of an adjacent paving stone (1). At least one coupling member (4) has a width substantially corresponding to the clear width between two adjacent coupling members (3, 4) of an adjacent paving stone (1).

Abstract: A semiconductor device has a carrier, at least one semiconductor component provided on this carrier, and a multilayer metallization between the semiconductor component and the carrier. A first metal layer of aluminium, gold, or a gold alloy is provided on the surface of the semiconductor component, a second metal layer of titanium is provided on the first metal layer, a third metal layer of nickel is provided on the second metal layer, and a fourth metal layer of a binary or ternary gold-germanium alloy is provided on the third metal layer. The device has a low-ohmic contact resistance and extremely long useful life under temperature loads.

Abstract: On a base plate with a matrix array of centering holes of a certain unit spacing, an intermediate plate or mounting element can be affixed which has longitudinal rows of centering holes of a center to center spacing which is one-half the unit spacing. A positioning element is mounted on the mounting element and has a pair of parallel positioning surfaces perpendicular to the mounting plane thereof, a countercentering hole located midway between these surfaces and another countercentering hole offset by one-quarter of the unit spacing corresponding to the offset between the holes of the rows of the mounting element whereby, by rotation of the positioning element through 180.degree. in its plane, small changes in the location of the positioning surfaces can be achieved.