Abstract: A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.

Abstract: A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.

Abstract: The present invention relates to a device for selectively displacing at least two holding devices which can be individually displaced along a z-axis by means of a central z-drive and by a selective magnetic coupling to a common lifting element. The exclusively magnetic coupling between the holding devices and the lifting element ensures a largely bounce-free displacement of the coupled holding devices, during the corresponding shock-free displacement of the lifting element. The coupling is especially advantageous during the transport of components as the bounce-free displacement from falling or sliding. The invention also relates to a fitting head for transporting a plurality of components, the holding devices being arranged along a line or on grid points of a two dimensional grid. The holding devices can be individually coupled to the movement of a common lifting element.

Abstract: A method for checking the fitting at automatic onserting units for the onserting of substrates with components, comprising the steps of: taking a picture of the surface of a component to be onserted positioned in a delivery means with a camera; comparing the picture in an image evaluation unit following the camera to a stored pattern of the component to be onserted; given agreement in the comparison, onserting the component onto the substrate; and given disagreement in the comparison, outputting an error message.

Abstract: A method and apparatus for mounting a component onto a substrate of an electrical assembly that utilizes a transponder unit. The transponder unit is attached to the substrate for storing mounting process data, such as, the component manufacturer identification code, the number of missing components, and the number of faulty substrate position, before, during or after the mounting process. The stored process data can then be transmitted to a control unit that controls the component mounting apparatus wherein the data is processed and utilized during the mounting operation to enhance process quality control.

Abstract: A fitting system and a method of fitting substrates with components includes, along a conveyor line, loading apparatuses provided in a conveying direction. Each of the loading apparatuses include at least two holding regions arranged one above another, so that substrates delivered along the conveyor line can be transferred to the upper holding region or the lower holding region. In this case, it is possible to feed substrates to fitting areas and at the same time to move substrates past the fitting areas. This achieves a very high performance per unit area of the fitting system. Furthermore, great flexibility is possible in the selected processing of the substrates.

Abstract: A pick and place device, a pick and place system and a method of fitting substrates with components are provided, in which feed devices having a plurality of feed modules and a corresponding plurality of collection points on opposite sides of the feed devices in each case have at least one pick and place area, pick and place heads being assigned to the pick and place areas, by way of which components can be removed alternatingly and/or simultaneously from the collection points of the feed devices in order to be positioned on substrates which are arranged in the pick and place areas.

Abstract: Disclosed is an arrangement for making it possible to pick up movable components for transporting purposes and/or to set them down in order to place them for example on a device which is to be produced. Therefore, a measuring arrangement may reliably measure the presence of the movable component at an opening of a tubular element. The measuring arrangement here measures, on the basis of a temperature measurement, the gas through flow through the tubular element, which, in turn, can be related directly to the presence or absence of a component at the opening.

Abstract: A configuration for positioning components within the compartments on a delivery belt prior to their removal by an onserting apparatus. The configuration can include a brush and a vibrator.

Abstract: A device for detecting the position, coplanarity and separation of terminals of printed circuit board components wherein the terminals are consecutively imaged on a topically resolving detector through the use of an illuminating light source, and wherein the direct reflections are suppressed by the use of a polarized light source and by the existence of an optical analyzer in the imaging beam path, resulting in only the diffused reflections being used for imaging to avoid overradiation of the detector.