Abstract: A process for encapsulating microelectronic hybrid semi-conductor circuits or microelectronic semi-conductor components in which the components, located on a substrate, receive a soft, sealable poured-on plastic coating, are covered with a plastic/metal composite film or foil and are, if necessary, then encapsulated with a hard synthetic resin sealing compound which is resistant to thermal shock. The external plastic layers of the film or foil combine with the filler or sealing compound and thus form an encapsulation which is temperature and moisture resistant.