Patents by Inventor HARALD WIEDENHOFER

HARALD WIEDENHOFER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950743
    Abstract: A dishwasher (1), in particular a commercial dishwasher (1), which is in the form of a box-type dishwasher and has a treatment chamber (2) which can be closed and in which washware can be treated in accordance with a predefined or predefinable treatment program, wherein a washware detector apparatus (51) is designed to detect the type of washware to be, wherein the washware detector apparatus (51) has an optical identification system, which is oriented toward the washware to be treated, and an evaluation device, wherein the optical identification system is designed to record at least a portion of the light reflected by the washware to be treated as a reflection image, and wherein the evaluation device is designed to automatically distinguish between different types of washware on the basis of the recorded reflection image, wherein the extent of the reflection provides information about the type of washware.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: April 9, 2024
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Harald Disch, Björn S. Himmelsbach, Markus Heidt, Verena Wiedenhöfer
  • Patent number: 10573533
    Abstract: Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: February 25, 2020
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Irmgard Escher-Poeppel, Stephanie Fassl, Paul Ganitzer, Gerhard Poeppel, Werner Schustereder, Harald Wiedenhofer
  • Publication number: 20190013210
    Abstract: Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.
    Type: Application
    Filed: August 29, 2018
    Publication date: January 10, 2019
    Applicant: Infineon Technologies AG
    Inventors: Edward Fuergut, Irmgard Escher-Poeppel, Stephanie Fassl, Paul Ganitzer, Gerhard Poeppel, Werner Schustereder, Harald Wiedenhofer
  • Patent number: 9614045
    Abstract: In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: April 4, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Srinivasa Reddy Yeduru, Joachim Hirschler, Harald Wiedenhofer, Franz Kleinbichler
  • Publication number: 20160336226
    Abstract: Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.
    Type: Application
    Filed: May 11, 2016
    Publication date: November 17, 2016
    Inventors: Edward FUERGUT, Irmgard ESCHER-POEPPEL, Stephanie FASSL, Paul GANITZER, Gerhard POEPPEL, Werner SCHUSTEREDER, Harald WIEDENHOFER
  • Publication number: 20160079087
    Abstract: In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
    Type: Application
    Filed: September 17, 2014
    Publication date: March 17, 2016
    Inventors: SRINIVASA REDDY YEDURU, JOACHIM HIRSCHLER, HARALD WIEDENHOFER, FRANZ KLEINBICHLER