Patents by Inventor Harald ZAGLMAYR

Harald ZAGLMAYR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES
    Publication number: 20230001723
    Abstract: An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.
    Type: Application
    Filed: September 12, 2022
    Publication date: January 5, 2023
    Applicant: EV Group E. Thallner GmbH
    Inventors: Friedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
  • Device and method for embossing micro- and/or nanostructures
    Patent number: 11472212
    Abstract: An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: October 18, 2022
    Assignee: EV Group E. Thallner GmbH
    Inventors: Friedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
  • Method for bonding of at least three substrates
    Patent number: 10954122
    Abstract: A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: March 23, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Thomas Glinsner, Harald Zaglmayr
  • METHOD FOR BONDING OF AT LEAST THREE SUBSTRATES
    Publication number: 20200055729
    Abstract: A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.
    Type: Application
    Filed: March 16, 2017
    Publication date: February 20, 2020
    Applicant: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Thomas Glinsner, Harald Zaglmayr
  • DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES
    Publication number: 20190176500
    Abstract: An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.
    Type: Application
    Filed: September 5, 2016
    Publication date: June 13, 2019
    Applicant: EV Group E. Thallner GmbH
    Inventors: Friedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
  • Method for application of an overgrowth layer on a germ layer
    Patent number: 10241398
    Abstract: A method for applying a masked overgrowth layer onto a seed layer for producing semiconductor components, characterized in that a mask for masking the overgrowth layer is imprinted onto the seed layer.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: March 26, 2019
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Gerald Kreindl, Harald Zaglmayr, Martin Eibelhuber
  • METHOD FOR APPLICATION OF AN OVERGROWTH LAYER ON A GERM LAYER
    Publication number: 20180120695
    Abstract: A method for applying a masked overgrowth layer onto a seed layer for producing semiconductor components, characterized in that a mask for masking the overgrowth layer is imprinted onto the seed layer.
    Type: Application
    Filed: May 21, 2015
    Publication date: May 3, 2018
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Gerald KREINDL, Harald ZAGLMAYR, Martin EIBELHUBER