Abstract: A thermal processing apparatus comprises a reaction zone having a first and second opening, a conveyor system that transports a desired material from the first opening to the second opening, an exhaust system communicatively connected to the first opening, and a plenum positioned above the reaction zone that extends from about the first opening to about the second opening. A vented barrier between the plenum and the reaction zone comprises a plurality of vents arranged such that the density of vents is highest near the first opening and progressively lower toward the second opening. A gas supply and a gas heater are communicatively connected to the plenum to introduce and condition an atmosphere to the plenum that is released into the reaction zone through the vents.

Abstract: A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.