Patents by Inventor Hardeep Singh

Hardeep Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12649339
    Abstract: A height adjustable tow mount assembly wherein locked engagement of corresponding through holes disposed in a tow mount member and an elongate member compresses a dampener member between an abutting front surface of the hitch platform elongate member and a rear surface of the tow mount member to thereby reduce movement and associated vibration between the hitch platform and tow mount member.
    Type: Grant
    Filed: May 28, 2023
    Date of Patent: June 9, 2026
    Inventors: Arvinder Singh, Hardeep Singh, Jeff Good
  • Publication number: 20260101206
    Abstract: Aspects of the subject disclosure may include, for example, communicating management plane (M-plane) data at a first port of a radio unit (RU), the RU being one RU of a set of radio units (RUs) at a cell site of a network operator, the M-plane data related to management and control of the RU, wherein the communicating M-plane data comprises communicating the M-plane data with a distributed unit (DU) over an M-plane segment, and initiating communication of the M-plane data at a second port of the RU, the second port configured for data communication over an alternate M-plane segment to a second RU of the set of RUs for forwarding the M-plane data to the DU over a second M-plane segment between the second RU and the DU, wherein the initiating communication is in response to an interruption in the communicating M-plane data. Other embodiments are disclosed.
    Type: Application
    Filed: October 8, 2024
    Publication date: April 9, 2026
    Applicants: AT&T Intellectual Property I, L.P., AT&T Mobility II LLC
    Inventors: Thomas W. Henderson, Hardeep Singh, Brian Gavin
  • Publication number: 20260015563
    Abstract: The present disclosure generally relates to microfluidics, and to systems and methods for controlling the flow of fluids. Certain aspects are generally directed to microfluidic channels that are parallel to each other, e.g., within a microfluidic interconnected region of a microfluidic device. In some embodiments, a fluid in a first microfluidic channel may be prevented from entering a second microfluidic channel due to a trench or other feature separating the channels. The trench may include features that at least partially prevent fluid from crossing. For example, the ends of the trench may be positioned such that fluids cannot access the ends, e.g., due to overhang regions between the trench and the microfluidic channels. This may keep the fluids pinned within the channels in some embodiments. Thus, for example, a fluid in a first microfluidic channel may be hardened to form a hydrogel, while the second microfluidic channel may remain free of the fluid and the hydrogel, due to the trench.
    Type: Application
    Filed: March 27, 2025
    Publication date: January 15, 2026
    Applicant: Xellar Ltd.
    Inventors: Xin Xie, Xiaohua Qian, Hardeep Singh
  • Publication number: 20260014559
    Abstract: The present disclosure generally relates to microfluidics, and to systems and methods for controlling the introduction of fluids. For example, certain aspects are generally directed to microfluidic devices having ports able to direct the end of a pipette tip into an end portion that is sized so as to allow fluid to flow from the pipette tip into an exit fluidly connected to a microfluidic channel. For example, the port may have a tapered portion that directs the pipette tip to the end portion. The end portion may be sized such that it is difficult for fluid to backflush around the pipette tip, and thus, the fluid is able to flow into microfluidic channels within the device, e.g., without resulting in excessive fluid remaining within the end portion. Other aspects are generally directed to methods of making or using such microfluidic devices, kits including such microfluidic devices, and the like.
    Type: Application
    Filed: March 27, 2025
    Publication date: January 15, 2026
    Applicant: Xellar Ltd.
    Inventors: Xin Xie, Xiaohua Qian, Hardeep Singh
  • Publication number: 20250210444
    Abstract: This application is directed to monitoring a package of an electronic device (e.g., a memory device including a solid state drive (SSD)). The electronic device includes a package substrate, a package, and an interface circuit. The package substrate includes one or more connectors. The package includes a plurality of electrodes that are exposed on a top surface of the package and electrically coupled to the one or more connectors. The interface circuit is coupled to the one or more connectors of the package substrate, and configured to measure one or more electrical signals via the one or more connectors of the package substrate and determine one or more interface parameters of the top surface of the package based on the one or more electrical signals. The package is physically coupled to the package substrate and configured to enclose and protect an integrated circuit (e.g., including the interface circuit).
    Type: Application
    Filed: December 21, 2023
    Publication date: June 26, 2025
    Inventors: Jorge MARTINEZ ARAIZA, Hardeep SINGH
  • Publication number: 20250076156
    Abstract: A testing device, related method for using the testing device and a production device arranged based on a predicted ambient temperature determined using the testing device, the testing device including a circuitry of a first form factor that corresponds to a second form factor of the production device. Circuitry includes heat-generating electrical components to simulate thermal generation of the production device. The circuitry also includes sensors to measure at least one characteristic of airflow of the testing device and at least one temperature of the testing device. The sensors include a first sensor disposed upstream of the airflow, and a second sensor disposed downstream of the airflow. The circuitry also includes processing circuitry to receive sensor data from the sensors indicative the characteristics of airflow and the temperatures of the testing device, and to determine a predicted ambient temperature proximate to the production device based on the sensor data.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Inventors: Hardeep Singh, Leo Craft
  • Publication number: 20250069978
    Abstract: A package and related method for manufacturing thereof, the package including multiple layers. The layers include an external layer with an external layer outer surface and an external layer inner surface, and an interface layer with an interface layer outer surface and an interface layer inner surface, where the interface layer outer surface is in contact with the external layer inner surface. The layers also include a thermal spreader layer with a thermal spreader outer surface and a thermal spreader inner surface, where the thermal spreader outer surface is in contact with the interface layer inner surface. The layers include circuitry, which is arranged proximate to and facing the thermal spreader inner surface. In some embodiments, the thermal spreader layer includes at least one thermally conductive channel to transfer heat along the at least one channel, the heat to be thermally transferred to the external layer via the interface layer.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Hardeep Singh, Wayne Gregory
  • Publication number: 20250024647
    Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Applicant: Intel Corporation
    Inventors: Hardeep SINGH, Rachit SHARMA, Timothy Glen HANNA, Devdatta P. KULKARNI
  • Publication number: 20240391281
    Abstract: A height adjustable tow mount assembly wherein locked engagement of corresponding through holes disposed in a tow mount member and an elongate member compresses a dampener member between an abutting front surface of the hitch platform elongate member and a rear surface of the tow mount member to thereby reduce movement and associated vibration between the hitch platform and tow mount member.
    Type: Application
    Filed: May 28, 2023
    Publication date: November 28, 2024
    Applicant: Advanced Engineering Group, LLC
    Inventors: Arvinder Singh, Hardeep Singh, Jeff Good
  • Patent number: 12133368
    Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: October 29, 2024
    Assignee: Intel Corporation
    Inventors: Hardeep Singh, Rachit Sharma, Timothy Glen Hanna, Devdatta P. Kulkarni
  • Patent number: 11964523
    Abstract: A hitch vibration dampener assembly and method of use thereof including a tow mount member including a base portion with a vibration dampener pad affixed to the back surface such that coupling of the tow mount member by locked engagement of at least one elongated pin successively received through paired side holes disposed in flanges of a hitch platform channel compresses a vibration dampener material upon the back panel of the hitch platform to thereby reduce the movement between the tow mount member and hitch assembly.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: April 23, 2024
    Inventors: Arvinder Singh, Hardeep Singh
  • Patent number: 11850914
    Abstract: Methods and systems for conveying or operationalizing data from a transport climate control system (TCCS) that provides climate control within an internal space moved by a vehicle are disclosed. A method includes determining, by a controller of the TCCS, a set of TCCS operational measurements; obtaining, by the controller, a set of TCCS operational settings; determining, by the controller, a set of cargo measurements; creating a shipment performance log based on the set of TCCS operational measurements, the set of TCCS operational settings, and the set of cargo measurements; publishing the shipment performance log to a data repository; and retrieving the shipment performance log to facilitate disposition of goods in the internal space.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: December 26, 2023
    Assignee: THERMO KING LLC
    Inventors: Christos Alkiviadis Polyzois, Wendy K. Foslien, Hardeep Singh, Grant Ovsak, Matthew Srnec, Travis Lumpkin, George Wallace Malheiros, Jordyn Purvins
  • Publication number: 20230294467
    Abstract: A height adjustable multiple hitch assembly including a shank hitch channel platform and a tow mount member with a base block configured for squared alignment within the channel having opposed flanges with aligned pairs of side holes, the block blasé having a plurality of through holes for engaged coupling with corresponding aligned side holes by a fastening member to thereby reduce the movement between the hitch platform and tow mount member that may be enhanced by a dampener member attached to a rear planar surface of the block base or a recessed column of the channel member.
    Type: Application
    Filed: May 28, 2023
    Publication date: September 21, 2023
    Applicant: Advanced Engineering Group, LLC
    Inventors: Jeff Good, Arvinder Singh, Hardeep Singh
  • Publication number: 20230249503
    Abstract: A hitch vibration dampener assembly and method of use thereof including a tow mount member including a base portion with a vibration dampener pad affixed to the back surface such that coupling of the tow mount member by locked engagement of at least one elongated pin successively received through paired side holes disposed in flanges of a hitch platform channel compresses a vibration dampener material upon the back panel of the hitch platform to thereby reduce the movement between the tow mount member and hitch assembly.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Applicant: AEG Engineering Group, LLC
    Inventors: Arvinder Singh, Hardeep Singh
  • Publication number: 20230241774
    Abstract: A system and method for reprogramming a trajectory of a robotic arm based on a human interaction. The method comprises configuring a motor arrangement to operate the robotic arm to cause movement of an end-effector thereof along a first trajectory predefined therefor. The method further comprises detecting the human interaction related to the end-effector, while the end-effector is moving along the first trajectory. The method further comprises determining instantaneous positional coordinates to which the end-effector is moved in response to the human interaction, deviating from the first trajectory. The method further comprises recording the determined instantaneous positional coordinates. The method further comprises configuring the motor arrangement to operate the robotic arm with movement of the end-effector thereof along a second trajectory based on the recorded instantaneous positional coordinates.
    Type: Application
    Filed: January 26, 2023
    Publication date: August 3, 2023
    Applicant: Addverb Technologies Limited
    Inventors: Rajesh KUMAR, Hardeep SINGH
  • Patent number: 11660916
    Abstract: A multiple hitch assembly and method of use thereof including a hitch platform having a channel member and multiple hitch member having a block base. A dampening member may be affixed such that coupling of the multiple hitch member by locked engagement of received through holes of the block base and paired side holes disposed in flanges of the channel member compresses the dampening member upon the recessed column of the hitch platform to absorb and thus attenuate the load and associated torque imparted by movement and rub between the hitch platform and multiple hitch member to thereby reduce associated rattle noise, and vibration.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: May 30, 2023
    Assignee: Advanced Engineering Group, LLC
    Inventors: Arvinder Singh, Hardeep Singh, Jeff Good
  • Patent number: 11641985
    Abstract: A modular fluid dispensing system includes a rigid bottle and multiple swappable base units. The modular fluid dispensing system includes a bottle housing to house a rigid bottle, a dispenser to dispense the fluid, and an attachment mechanism to reversibly affix the modular fluid dispensing system to a support structure. The bottle housing includes a threaded fastener to form a seal with the rigid bottle and a puncturing taper to puncture a seal of the rigid bottle. The dispenser includes a pump to initiate flow of the fluid from the rigid bottle and out a nozzle in response to a command signal from a sensor. The dispenser also includes a vacuum break port to allow an external fluid to replace the fluid in the bottle and prevent formation of a vacuum.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: May 9, 2023
    Assignee: ALO NEW YORK LLC
    Inventors: Jonathan Bijari, Jason Barlia, Hardeep Singh, Wesley Robinson, Matthew De Remer
  • Patent number: D987435
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: May 30, 2023
    Inventors: Jonathan Bijari, Jason Barlia, Wesley Robinson, Matthew De Remer, Brenton Lacombe, Hardeep Singh
  • Patent number: D1077270
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: May 27, 2025
    Assignee: Xellar Ltd.
    Inventors: Xiaohua Qian, Hardeep Singh
  • Patent number: D1117816
    Type: Grant
    Filed: April 3, 2024
    Date of Patent: March 10, 2026
    Assignee: Xellar Ltd.
    Inventors: Xiaohua Qian, Hardeep Singh, XuHai Huang, Thomas Marshall