Patents by Inventor Hardeep Singh
Hardeep Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12649339Abstract: A height adjustable tow mount assembly wherein locked engagement of corresponding through holes disposed in a tow mount member and an elongate member compresses a dampener member between an abutting front surface of the hitch platform elongate member and a rear surface of the tow mount member to thereby reduce movement and associated vibration between the hitch platform and tow mount member.Type: GrantFiled: May 28, 2023Date of Patent: June 9, 2026Inventors: Arvinder Singh, Hardeep Singh, Jeff Good
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Publication number: 20260101206Abstract: Aspects of the subject disclosure may include, for example, communicating management plane (M-plane) data at a first port of a radio unit (RU), the RU being one RU of a set of radio units (RUs) at a cell site of a network operator, the M-plane data related to management and control of the RU, wherein the communicating M-plane data comprises communicating the M-plane data with a distributed unit (DU) over an M-plane segment, and initiating communication of the M-plane data at a second port of the RU, the second port configured for data communication over an alternate M-plane segment to a second RU of the set of RUs for forwarding the M-plane data to the DU over a second M-plane segment between the second RU and the DU, wherein the initiating communication is in response to an interruption in the communicating M-plane data. Other embodiments are disclosed.Type: ApplicationFiled: October 8, 2024Publication date: April 9, 2026Applicants: AT&T Intellectual Property I, L.P., AT&T Mobility II LLCInventors: Thomas W. Henderson, Hardeep Singh, Brian Gavin
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Publication number: 20260015563Abstract: The present disclosure generally relates to microfluidics, and to systems and methods for controlling the flow of fluids. Certain aspects are generally directed to microfluidic channels that are parallel to each other, e.g., within a microfluidic interconnected region of a microfluidic device. In some embodiments, a fluid in a first microfluidic channel may be prevented from entering a second microfluidic channel due to a trench or other feature separating the channels. The trench may include features that at least partially prevent fluid from crossing. For example, the ends of the trench may be positioned such that fluids cannot access the ends, e.g., due to overhang regions between the trench and the microfluidic channels. This may keep the fluids pinned within the channels in some embodiments. Thus, for example, a fluid in a first microfluidic channel may be hardened to form a hydrogel, while the second microfluidic channel may remain free of the fluid and the hydrogel, due to the trench.Type: ApplicationFiled: March 27, 2025Publication date: January 15, 2026Applicant: Xellar Ltd.Inventors: Xin Xie, Xiaohua Qian, Hardeep Singh
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Publication number: 20260014559Abstract: The present disclosure generally relates to microfluidics, and to systems and methods for controlling the introduction of fluids. For example, certain aspects are generally directed to microfluidic devices having ports able to direct the end of a pipette tip into an end portion that is sized so as to allow fluid to flow from the pipette tip into an exit fluidly connected to a microfluidic channel. For example, the port may have a tapered portion that directs the pipette tip to the end portion. The end portion may be sized such that it is difficult for fluid to backflush around the pipette tip, and thus, the fluid is able to flow into microfluidic channels within the device, e.g., without resulting in excessive fluid remaining within the end portion. Other aspects are generally directed to methods of making or using such microfluidic devices, kits including such microfluidic devices, and the like.Type: ApplicationFiled: March 27, 2025Publication date: January 15, 2026Applicant: Xellar Ltd.Inventors: Xin Xie, Xiaohua Qian, Hardeep Singh
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Publication number: 20250210444Abstract: This application is directed to monitoring a package of an electronic device (e.g., a memory device including a solid state drive (SSD)). The electronic device includes a package substrate, a package, and an interface circuit. The package substrate includes one or more connectors. The package includes a plurality of electrodes that are exposed on a top surface of the package and electrically coupled to the one or more connectors. The interface circuit is coupled to the one or more connectors of the package substrate, and configured to measure one or more electrical signals via the one or more connectors of the package substrate and determine one or more interface parameters of the top surface of the package based on the one or more electrical signals. The package is physically coupled to the package substrate and configured to enclose and protect an integrated circuit (e.g., including the interface circuit).Type: ApplicationFiled: December 21, 2023Publication date: June 26, 2025Inventors: Jorge MARTINEZ ARAIZA, Hardeep SINGH
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Publication number: 20250076156Abstract: A testing device, related method for using the testing device and a production device arranged based on a predicted ambient temperature determined using the testing device, the testing device including a circuitry of a first form factor that corresponds to a second form factor of the production device. Circuitry includes heat-generating electrical components to simulate thermal generation of the production device. The circuitry also includes sensors to measure at least one characteristic of airflow of the testing device and at least one temperature of the testing device. The sensors include a first sensor disposed upstream of the airflow, and a second sensor disposed downstream of the airflow. The circuitry also includes processing circuitry to receive sensor data from the sensors indicative the characteristics of airflow and the temperatures of the testing device, and to determine a predicted ambient temperature proximate to the production device based on the sensor data.Type: ApplicationFiled: August 29, 2023Publication date: March 6, 2025Inventors: Hardeep Singh, Leo Craft
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Publication number: 20250069978Abstract: A package and related method for manufacturing thereof, the package including multiple layers. The layers include an external layer with an external layer outer surface and an external layer inner surface, and an interface layer with an interface layer outer surface and an interface layer inner surface, where the interface layer outer surface is in contact with the external layer inner surface. The layers also include a thermal spreader layer with a thermal spreader outer surface and a thermal spreader inner surface, where the thermal spreader outer surface is in contact with the interface layer inner surface. The layers include circuitry, which is arranged proximate to and facing the thermal spreader inner surface. In some embodiments, the thermal spreader layer includes at least one thermally conductive channel to transfer heat along the at least one channel, the heat to be thermally transferred to the external layer via the interface layer.Type: ApplicationFiled: August 23, 2023Publication date: February 27, 2025Inventors: Hardeep Singh, Wayne Gregory
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COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPABLE ELECTRONIC COMPONENT INTERFACE
Publication number: 20250024647Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.Type: ApplicationFiled: September 26, 2024Publication date: January 16, 2025Applicant: Intel CorporationInventors: Hardeep SINGH, Rachit SHARMA, Timothy Glen HANNA, Devdatta P. KULKARNI -
Publication number: 20240391281Abstract: A height adjustable tow mount assembly wherein locked engagement of corresponding through holes disposed in a tow mount member and an elongate member compresses a dampener member between an abutting front surface of the hitch platform elongate member and a rear surface of the tow mount member to thereby reduce movement and associated vibration between the hitch platform and tow mount member.Type: ApplicationFiled: May 28, 2023Publication date: November 28, 2024Applicant: Advanced Engineering Group, LLCInventors: Arvinder Singh, Hardeep Singh, Jeff Good
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Cooling mass and spring element for low insertion force hot swappable electronic component interface
Patent number: 12133368Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.Type: GrantFiled: March 17, 2022Date of Patent: October 29, 2024Assignee: Intel CorporationInventors: Hardeep Singh, Rachit Sharma, Timothy Glen Hanna, Devdatta P. Kulkarni -
Patent number: 11964523Abstract: A hitch vibration dampener assembly and method of use thereof including a tow mount member including a base portion with a vibration dampener pad affixed to the back surface such that coupling of the tow mount member by locked engagement of at least one elongated pin successively received through paired side holes disposed in flanges of a hitch platform channel compresses a vibration dampener material upon the back panel of the hitch platform to thereby reduce the movement between the tow mount member and hitch assembly.Type: GrantFiled: April 17, 2023Date of Patent: April 23, 2024Inventors: Arvinder Singh, Hardeep Singh
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Patent number: 11850914Abstract: Methods and systems for conveying or operationalizing data from a transport climate control system (TCCS) that provides climate control within an internal space moved by a vehicle are disclosed. A method includes determining, by a controller of the TCCS, a set of TCCS operational measurements; obtaining, by the controller, a set of TCCS operational settings; determining, by the controller, a set of cargo measurements; creating a shipment performance log based on the set of TCCS operational measurements, the set of TCCS operational settings, and the set of cargo measurements; publishing the shipment performance log to a data repository; and retrieving the shipment performance log to facilitate disposition of goods in the internal space.Type: GrantFiled: May 21, 2021Date of Patent: December 26, 2023Assignee: THERMO KING LLCInventors: Christos Alkiviadis Polyzois, Wendy K. Foslien, Hardeep Singh, Grant Ovsak, Matthew Srnec, Travis Lumpkin, George Wallace Malheiros, Jordyn Purvins
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Publication number: 20230294467Abstract: A height adjustable multiple hitch assembly including a shank hitch channel platform and a tow mount member with a base block configured for squared alignment within the channel having opposed flanges with aligned pairs of side holes, the block blasé having a plurality of through holes for engaged coupling with corresponding aligned side holes by a fastening member to thereby reduce the movement between the hitch platform and tow mount member that may be enhanced by a dampener member attached to a rear planar surface of the block base or a recessed column of the channel member.Type: ApplicationFiled: May 28, 2023Publication date: September 21, 2023Applicant: Advanced Engineering Group, LLCInventors: Jeff Good, Arvinder Singh, Hardeep Singh
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Publication number: 20230249503Abstract: A hitch vibration dampener assembly and method of use thereof including a tow mount member including a base portion with a vibration dampener pad affixed to the back surface such that coupling of the tow mount member by locked engagement of at least one elongated pin successively received through paired side holes disposed in flanges of a hitch platform channel compresses a vibration dampener material upon the back panel of the hitch platform to thereby reduce the movement between the tow mount member and hitch assembly.Type: ApplicationFiled: April 17, 2023Publication date: August 10, 2023Applicant: AEG Engineering Group, LLCInventors: Arvinder Singh, Hardeep Singh
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Publication number: 20230241774Abstract: A system and method for reprogramming a trajectory of a robotic arm based on a human interaction. The method comprises configuring a motor arrangement to operate the robotic arm to cause movement of an end-effector thereof along a first trajectory predefined therefor. The method further comprises detecting the human interaction related to the end-effector, while the end-effector is moving along the first trajectory. The method further comprises determining instantaneous positional coordinates to which the end-effector is moved in response to the human interaction, deviating from the first trajectory. The method further comprises recording the determined instantaneous positional coordinates. The method further comprises configuring the motor arrangement to operate the robotic arm with movement of the end-effector thereof along a second trajectory based on the recorded instantaneous positional coordinates.Type: ApplicationFiled: January 26, 2023Publication date: August 3, 2023Applicant: Addverb Technologies LimitedInventors: Rajesh KUMAR, Hardeep SINGH
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Patent number: 11660916Abstract: A multiple hitch assembly and method of use thereof including a hitch platform having a channel member and multiple hitch member having a block base. A dampening member may be affixed such that coupling of the multiple hitch member by locked engagement of received through holes of the block base and paired side holes disposed in flanges of the channel member compresses the dampening member upon the recessed column of the hitch platform to absorb and thus attenuate the load and associated torque imparted by movement and rub between the hitch platform and multiple hitch member to thereby reduce associated rattle noise, and vibration.Type: GrantFiled: April 6, 2021Date of Patent: May 30, 2023Assignee: Advanced Engineering Group, LLCInventors: Arvinder Singh, Hardeep Singh, Jeff Good
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Patent number: 11641985Abstract: A modular fluid dispensing system includes a rigid bottle and multiple swappable base units. The modular fluid dispensing system includes a bottle housing to house a rigid bottle, a dispenser to dispense the fluid, and an attachment mechanism to reversibly affix the modular fluid dispensing system to a support structure. The bottle housing includes a threaded fastener to form a seal with the rigid bottle and a puncturing taper to puncture a seal of the rigid bottle. The dispenser includes a pump to initiate flow of the fluid from the rigid bottle and out a nozzle in response to a command signal from a sensor. The dispenser also includes a vacuum break port to allow an external fluid to replace the fluid in the bottle and prevent formation of a vacuum.Type: GrantFiled: April 13, 2021Date of Patent: May 9, 2023Assignee: ALO NEW YORK LLCInventors: Jonathan Bijari, Jason Barlia, Hardeep Singh, Wesley Robinson, Matthew De Remer
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Patent number: D987435Type: GrantFiled: April 13, 2021Date of Patent: May 30, 2023Inventors: Jonathan Bijari, Jason Barlia, Wesley Robinson, Matthew De Remer, Brenton Lacombe, Hardeep Singh
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Patent number: D1077270Type: GrantFiled: June 20, 2023Date of Patent: May 27, 2025Assignee: Xellar Ltd.Inventors: Xiaohua Qian, Hardeep Singh
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Patent number: D1117816Type: GrantFiled: April 3, 2024Date of Patent: March 10, 2026Assignee: Xellar Ltd.Inventors: Xiaohua Qian, Hardeep Singh, XuHai Huang, Thomas Marshall